跳到主要內容

臺灣博碩士論文加值系統

(216.73.216.152) 您好!臺灣時間:2026/03/09 17:51
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果 :::

詳目顯示

我願授權國圖
: 
twitterline
研究生:梁效彬
研究生(外文):Hsiao-Bin Liang
論文名稱:深次微米金氧半場效電晶體基板效應及2.4/5.2GHz雙頻帶矽鍺低雜訊放大器之研究
論文名稱(外文):Study of Substrate Effect on Deep Sub-Micron MOSFETs and 2.4/5.2 GHz Dual-Band SiGe LNA
指導教授:林嘉慶林嘉慶引用關係林佑昇林佑昇引用關係
指導教授(外文):Jia-Chin LinYo-Sheng Lin
學位類別:碩士
校院名稱:國立暨南國際大學
系所名稱:電機工程學系
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2003
畢業學年度:91
語文別:英文
論文頁數:150
中文關鍵詞:金氧半場效電晶體雙頻帶矽鍺低雜訊放大器
外文關鍵詞:MOSFETDual-BandSiGeLNA
相關次數:
  • 被引用被引用:0
  • 點閱點閱:357
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:1
通信系統中,雜訊對訊號傳輸品質的影響甚重,低雜訊放大器( Low Noise Amplifier,LNA) 在無線傳輸系統中為接收端的前端電路,一定要具有高增益、低雜訊的特性,以及好的阻抗匹配,才能確保整個系統有最佳的性能,因此設計一個好的LNA對高頻接收系統來說極為重要。在發展現況方面,目前無線區域網路及行動通訊系統發展快速,傳輸資料量大幅提升,所需頻率因而升高,5GHz漸漸成為目前學術界及業界研究的主流。而要達到體積小、高性能、低成本及SOC(System On Chip)的目標,採用CMOS來設計射頻傳輸接收器(RF Transceiver)是必然的趨勢。目前不論802.11a或HiperLAN 的系統中,5.2GHz CMOS 之射頻前端電路已漸被開發,未來將陸續被整合於單一系統晶片中。
在微波電路中,微波元件的高頻表現直接影響到整體電路之性能。然而,在CMOS 技術中,由基板所造成的偶合效應,使得主被動元件在高頻操作時有不小的影響。因此,當使用CMOS製程技術來製作高頻電路,如何降低基板對於元件之負面影響進而增加整體電路的性能,是一件非常重要的課題。
在這篇論文中,主要分成兩大部分。在第一個部分中,主要研究金氧半場效電晶體在高頻時由於機版效應所造成出現的kink效應。在推導其kink理論的同時,發現此理論具有對稱性,於是由閘極-汲極寄生電阻所造成的kink效應亦被解釋。
在第二個部分中,主要是設計LNA電路。此部分的前半段,我們設計一顆簡單的5.2GHz LNA,並將電路中電感器的基板效應降低(基板磨薄)及電感器鍍金,探討對整體電路性能之影響。而在後半部分,我們以矽化鍺及CMOS技術設計了2.4/5.2GHz雙頻帶低雜訊放大器,其中以矽化鍺製作的放大器部分,由於使用電阻代替LC tank,使得佈局面積降低且有高增益之表現。

In the communication system, noise has great influence on the quality of transmission. Low noise amplifier (LNA) is the front-end amplifier of the receiver in the wireless communication system. Characteristics of high gain, low noise and good impedance match are necessary for a low noise amplifier to ensure the best performance in the whole system. Therefore, designing a good low noise amplifier is very important for a microwave transceiver system. Recently, the development of wireless local area network (LAN) is growing rapidly so that the need for data transmission rate is raising and lead to the going up of operation frequency. Consequently, no mater in the academic community or industrial circles, the research in 5GHz frequency band is the main stream. In order to achieve the goals of small chip area, high performance, low coast and SOC (System On Chip) application, designing the RF transceiver by CMOS technology is a necessary trend. Not only 802.11a but also HiperLAN system, the front-end circuits have been developed gradually and will be integrated in a single chip in the feature continually.
In the microwave circuit, the performance of a microwave device affects the whole circuit performance directly at high frequency. However, in the CMOS technology, the coupling effects through the substrate affect the active and passive devices so deeply at high frequency. Therefore, it is a very important topic for us to reduce the substrate effect to improve the performance of circuit while implementing a high frequency circuit by CMOS technology.
There are two main parts in this master thesis. In the first part this thesis, we focus on the study of the kink effect in MOSFETs due to substrate effect at high frequency. Then, we discovered that the theory of kink phenomenon due to substrate effect is symmetric with gate-grain resistance. Therefore, the kink phenomena due to small gate-drain resistance are also explained here.
In the second part, we focus on the design of LNA circuit. In the first half of this part, we design a simple 5.2GHz LNA circuit. Here, we lowered the substrate effect of the inductors by substrate thinning and used gold-plated inductors in this circuit to observe the effect due to microwave device upon the whole circuit. In the latter half of this part, we designed the 2.4/5.2 GHz dual-band LNA by SiGe 0.35m and CMOS 0.25m technology . In the SiGe design, we presented a high gain and small chip area LNA because of resistive output load instead of LC tank output load.

Contents
Chapter 1 Introduction 1
1.1 Introduction 2
1.2 Thesis Organization 2
Chapter 2 An analysis of Small-Signal Substrate Resistance
Effect in Deep Sub-micron RF MOSFETs 4
2.1 Introduction 5
2.2 Theoretical Analysis 6
2.3 Simulated Results and Discussion 11
2.4 Conclusions 29
Chapter 3 An Analysis of Small-Signal Gate-Drain Resistance Effect
on RF Power MOSFETs 32
3.1 Introduction 32
3.2 Device Structure and S11, S22 Versus Gate-Grain Resistance 34
3.3 Scattering Parameter 36
3.3.1 Expressions of Scattering Parameter S11 36
3.3.2 Expressions of Scattering Parameter S22 40
3.4 Results and Discussion 47
3.4.1 Results and Discussion for S11 47
3.4.2 Results and Discussion for S22 51
3.5 Conclusion 53
Chapter 4 A 5.2 GHz CMOS Low Noise Amplifier 55
4.1 Introduction 55
4.2 Important Concepts in RF Circuit Design 56
4.2.1 Noise Figure 56
4.2.2 S — Parameter 58
4.2.3 Input Matching 63
4.2.4 Stability 72
4.2.5 Effect of Nonlinearity 75
4.3 Circuit Description 82
4.3.1 LNA Design 87
4.3.2 Simulation Results 91
4.3.3 Circuit Layout 94
4.3.4 Measurements 95
4.3.5 Discussions and Conclusions 97
Chapter 5 2.4/5.2 GHz Dual-Band SiGe LNA and CMOS LNA 98
5.1 Introduction 98
5.2 Dual-Band SiGe LNA 100
5.2.1 Dual-Band SiGe LNA Design 100
5.2.2 Simulation Results 101
5.2.3 Circuit Layout 105
5.3 Dual-Band CMOS LNA 106
5.3.1 Dual-Band CMOS LNA Design 106
5.3.2 Simulation Results 108
5.3.3 Circuit Layout 112
Chapter 6 Conclusions 115
Reference 117
Publication List 123

[1] Hans Hjelmgren and Andrej Litwin, “Small-Signal Substrate Resistance Effect in RF CMOS Identified Through Device Simulations,” IEEE Trans. on Electron Devices, vol. 48, no. 6, pp. 397-399, Feb. 2001.
[2] Shey-Shi Lu, Chinchun Meng, To-Wei Chen and Hsiao-Chin Chen, “A Novel Interpretation of Transistor S-Parameters by Poles and Zeros for RF IC Circuit Design,” IEEE Trans. on Microwave Theory and Techniques, vol. 49, no. 2, pp. 406-409, Feb. 2001.
[3] Hsing-Yuan Tu, Yo-Sheng Lin, Ping-Yu Chen and Shey-Shi Lu , “An Analysis of the anomalous dip in Scattering Parameter S22 of InGaP/GaAs Heterojunction Bipolar Transistors (HBTs),” IEEE Trans. on Electron Devices, vol. 49, no. 9, Sep. 2002. (Accepted for publication)
[4] Y. Aoki and Y. Hirano, “High-Power GaAs FETs,” High Power GaAs FET Amplifiers, pp. 81, 1993.
[5] P .R. Gray and R. G. Meyer, “Analysis and Design of Analog Integrated Circuits.” New York: Wiley, 1993, pp. 579-584.
[6] R. A. Minasian, “Simplified GaAs M.E.S.F.ET. model to 10 GHz,” Electron. Lett.,
vol. 13, no. 18, pp. 549, 1977.
[7] B. Bayrajtariglu, N. Camilleri, S. A. Lambert, “Microwave performance of n-p-n and p-n-p AlGaAs/GaAs heterojunction bipolar transistors,” in IEEE Trans. Microwave Theory Tech., vol. 36, no. 12, pp. 1869-1873, 1988.
[8] T. Takahashi, S. Sasa, A. Kawano, T. Iwai, and T. Fuji, “High-Reliability InGaP/GaAs HBTs Fabricated by Self-Aligned process,” IEEE, IEDM, Tech. Dig., 1994, pp. 191-194.
[9] R. Sung, P. Bendix, and M. B. Das, “Extraction of High-Frequency Equivalent Circuit Parameters of Submicron Gate-Length MOSFET’s,” IEEE Trans. on Electron Devices, vol. 45, no. 8, pp. 1769-1775, 1998.
[10] William Liu, Handbook of III-V Heterojunction Bipolar Transistors, John Wiley & Sons, Inc., New York, p.1153.
[11] F. Ali and A. Gupta, HEMTs and HBTs: Devices, Fabrication, and circuits, Artech House, Boston, p.305, 1991.
[12] Behzad Razavi, "RF Microelectronics", p. 169, Upper Saddle River, New Jersey: Prentice Hall, 1998.
[13] Guillermo Gonzalez, “Microwave Transistor Amplifiers Analysis and Design ”, pp.95-102
[14] C. Patrick Yue and S. Simon Wong “On-Chip Spiral Inductors with Patterned Ground Shield for Si-Based RF IC`s “ IEEE Journal of solid-state circuits
[15] Thomas H. Lee , Hirad Samavati , and Hamid R. Rategh “5-GHz CMOS Wireless LANs ” IEEE Journal of solid-state circuits
[16] K.Pahlavan, A. Zahedi and P.Krishamurthy, “Wideband local access wireless LAN and wireless ATM,” IEEE Communication Magazine, PP.34-40, Nov. 1997.
[17] IEEE 802.11a Draft Supplement to IEEE Std 802.11, Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications: High Speed Physical Layer in the 5 GHz Band, Draft 7.0, July 1999.
[18] R. van Nee, G. Awater, M. Morikura, H. Takanashi, M. Webster, and K. W. Halford, “New High —Rate Wireless LAN Standards” IEEE Communication Magazine, pp. 82-88, Dec. 1999.
[19] B.J. Buck, M.W. Geen, A.W. Dearn, A.P.Long,S.P. Melvin, L.M. Devlin, and J.C. Clifton, “GaAs MMICs for 5.2GHz HIPERLAN,” Proc. Fifth Annual Wireless Symp.,pp. 62-66,Feb.1997.
[20] M. Madihian, T.Drenski, L. Desclos, H. Yoshida, H. Hirabayashi, and T. Yamazaki, “A 5-GHz-band multifunctional BiCMOS transceiver chip for GMSK modulation wireless systems” IEEE J. Solid-State Circuits, vol. 34, pp.25 32, Jan.1999.
[21] S.P. Voinigescu, M.A. Copeland, D. Marchesan, P. Popescu, and M. C. Maliepaard, “5 GHz SiGe HBT monolithic radio transceiver with tunable filtering,” RFIC Symp. Dig., 1999,pp 131 134.
[22] M. Soda, H. Tezuka, F. Sato, T. Hashimoto, S. Nakamura, T. Tatsumi,and T. Tashiro, “Si-analog IC’s for 20 Gb/s optical receiver,” in Tech.Dig. IEEE Int. Solid-State Circuits Conf., 1994, pp. 170—171.
[23] T. Hashimoto, F. Sato, M. Soda, H. Tezuka, T. Suzuki, T. Tatsumi,and T. Tashiro, “SiGe bipolar IC’s for a 20 Gb/s optical transmitter,”in Proc. IEEE Bipolar/BiCMOS Circuits Technol. Meeting, 1994, pp.167—170.
[24] F. Sato, T. Hashimoto, T. Tatsumi, and T. Tashiro, “Sub-20 ps ECLcircuits with high-performance super self-aligned selectively grownSiGe base (SSSB) bipolar transistors,” IEEE Trans. Electron Devices,vol. 42, pp. 483—488, Mar. 1995.
[25] M. Case, L. Larson, D. Rensch, S. Rosenbaum, S. Knorr, D. Harame,
and B. Meyerson, “A 23 GHz static 1/128 frequency divider implementedin a manufacturable Si/SiGe HBT process,” in Proc. IEEEBipolar/BiCMOS Circuits Technol. Meeting, 1995, pp. 121—123.
[26] W. Gao, W. Snelgrove, T. Varelas, S. Kovacic, and D. Harame, “A 5-GHz SiGe HBT return-to-zero comparator,” in Proc. IEEE Bipolar/BiCMOS Circuits Technol. Meeting, 1995, pp. 166—169.
[27] J. Glenn, R. Poisson, M. Case, D. Harame, and B. Meyerson, “12-GHz Gilbert mixers using a manufacturable Si/SiGe epitaxial-base bipolar technology,” in Proc. IEEE Bipolar/BiCMOS Circuits Technol. Meeting,1995, pp. 186—189.
[28] H. Schumacher, U. Erben, A. Gruhle, H. Kibbel, and U. K¨onig, “A 3 V supply voltage, DC-18 GHz SiGe HBT wide-band amplifier,” in Proc. IEEE Bipolar/BiCMOS Circuits Technol. Meeting, 1995, pp. 190—193.
[29] A. Gruhle, A. Sch¨uppen, U. K¨onig, U. Erben, and H. Schumacher, “Monolithic 26 GHz and 40 GHz VCO’s with SiGe heterojunction bipolar transistors,” in Tech. Dig. Int. Electron Device Meeting, 1995,pp. 725—728.
[30] F. Sato, H. Tezuka, M. Soda, T. Hashimoto, T. Suzaki, T. Tatsumi, T. Morikawa, and T. Tashiro, “The optical terminal IC: A 2.4 Gb/s receiver and a 1:16 demultiplexer in one chip,” in Proc. IEEE Bipolar/ BiCMOS Circuits Technol. Meeting, 1995, pp. 162—165.
[31] L. Larson, M. Case, S. Rosenbaum, D. Rensch, P. MacDonald, M. Matloubian, M. Chen, D. Harame, J. Malinowski, B. Meyerson, M. Gilbert, and S. Maas, “Si/SiGe HBT technology for low-cost monolithic microwave integrated circuits,” in Tech. Dig. IEEE Int. Solid-State Circuits Conf., 1996, pp. 80—81.
[32] F. Sato, H. Tezuka, M. Soda, T. Hashimoto, T. Suzaki, T. Tatsumi, T. Morikawa, and T. Tashiro, “A 2.4 Gb/s receiver and a 1:16 demultiplexer in one chip using a super self-aligned selectively grown SiGe base (SSSB) bipolar transistor,” IEEE J. Solid-State Circuits, vol. 1451—1457, Oct. 1996.
[33] M. Soyuer, J. Burghartz, H. Ainspan, K. Jenkins, P. Xiao, A. Shahani, M. Dolan, and D. Harame, “An 11 GHz 3 V SiGe voltage-controlled oscillator with integrated resonator,” in Proc. IEEE Bipolar/BiCMOS Circuits Technol. Meeting, 1996, pp. 169—1172.
[34] R. G¨otzfried, T. Itoh, J. F. Luy, and H. Schumacher, “Zero power consumption Si/SiGe HBT SPDT T/R antenna switch,” in Tech. Dig. IEEE MTT-S Int. Microwave Symp., 1996, pp. 651—653.
[35] J. Long, M. Copeland, S. Kovacic, D. Malhi, and D. Harame, “RF analog and digital circuits in SiGe technology,” in Tech. Dig. IEEE Int. Solid-State Circuits Conf., 1996, pp. 82—83.
[36] W. Gao, W. Snelgrove, and S. Kovacic, “A 5-GHz SiGe HBT return-to-zero comparator for RF A/D conversion,” IEEE J. Solid-State Circuits, vol. 31, pp. 1502—1506, 1996.
[37] M. Soda, T. Morikawa, S. Shioiri, H. Tezuka, F. Sato, T. Tatsumi, K. Emura, T. Tashiro, “A 1 Gb/s 8-channel array OEIC with SiGe photdetectors,” in Tech. Dig. IEEE Int. Solid-State Circuits Conf., 1997, pp. 120—121.
[38] M. Wurzer, T. Miester, H. Sch¨afer, H. Knapp, J. B¨ock, R. Stengl, K. Aufinger, M. Franosch, M. Rest, M. M¨oller, H.-M. Rein, and A. Felder, “42 GHz static frequency divider in Si/SiGe bipolar technology,” in Tech. Dig. IEEE Int. Solid-State Circuits Conf., 1997, pp. 122—123.
[39] P. Xiao, K. Jenkins, M. Soyuer, H. Ainspan, J. Burghartz, H. Shin, M. Dolan, and D. Harame, “A 4 b 8 GSample/s A/D converter in SiGe bipolar technology,” in Tech. Dig. IEEE Int. Solid-State Circuits Conf., 1997, pp. 124—125.
[40] S. Shiori, M. Soda, R. Morikawa, T. Hashimoto, F. Sato, and K. Emura, “A 10 Gb/s SiGe bipolar framer/demultiplexer for SDH system,” presented at the IEEE Int. Solid-State Circuits Conf., Feb. 1998.
[41] T. Masuda, K.-I. Ohhata, E. Ohue, K. Oda, M. Tanabe, H. Shimamoto, T. Onai, a nd K. Washio, “40 Gb/s analog IC chipset for optical receiver using SiGe HBT’s,” presented at the IEEE Int. Solid-State Circuits Conf., Feb. 1998.
[42] D. L. Harame, K. Schonenberg, M. Gilbert, D. Nguyen-Ngoc, J. Malinowski, S.-J. Jeng, B. S. Meyerson, J. D. Cressler, R. Groves,G. Berg, K. Tallman, K. Stein, G. Hueckel, C. Kermarrec, T. Tice,G. Fitzgibbons, K. Walter, D. Colavito, T. Houghton, N. Greco, T.Kebede, B. Cunningham, S. Subbanna, J. H. Comfort, and E. F.Crabb´e, “A 200 mm SiGe-HBT technology for wireless and mixedsignalapplications,” in Tech. Dig. Int. Electron Device Meeting, 1994,pp. 437—440.
[43] M. Hong, E. de Fresart, J. Steele, A. Zlotnicka, C. Stein, G. Tam, M. Racanelli, L. Knoch, Y. C. See, and K. Evans, “High-performance epitaxial base bipolar transistors produced by a reduced-pressure CVD reactor,” IEEE Electron Device Lett., vol. 14, pp. 450—452, Sept. 1993.
[44] F. Sato, T. Hashimoto, T. Tatsumi, M. Soda, H. Tezuka, T. Sazaki, and T. Tashiro, “A self-aligned SiGe base bipolar technology using cold wall UHV/CVD and its application for optical communications IC’s,” in Proc. IEEE Bipolar/BiCMOS Circuits Technol. Meeting, 1995, pp. 82—88.
[45] T. Meister, H. Sch¨afer, M. Franosch, W. Molzer, K. Aufinger, U. Scheler, C. Walz, M. Stolz, S. Boguth, and J. B¨ock, “SiGe base bipolar technology with 74 GHz fmax and 11 ps gate delay,” in Tech. Dig. Int. Electron Device Meeting, 1995, pp. 739—742.
[46] A. Pruijmboom, D. Terpstra, C. Timmering, W. deBoer, M. Theunissen, J. Slotboom, R. Hueting, and J. Hageraats, “Selective-epitaxial base technology with 14 ps ECL-gate delay for low power wide-band communications systems,” in Tech. Dig. Int. Electron Device Meeting, 1995, pp. 747—750.
[47] A. Sch¨uppen, H. Dietrich, S. Gerlach, and J. Arndt, “SiGe technology and components for mobile communications systems,” in Proc. IEEE Bipolar/BiCMOS Circuits Technol. Meeting, 1996, pp. 130—133.
[48] M. Kondo, K. Oda, E. Ohue, H. Shimamoto, M. Tanabe, T. Onai, and K. Washio, “Sub-10 fJ ECL/68 _A 4.7 GHz divider ultra-low-power SiGe base bipolar transistors with a wedge-shaped CVD-SiO2 isolation structure and a BPSG-refilled trench,” in Tech. Dig. Int. Electron Device Meeting, 1996, pp. 245—248.
[49] E. de Berranger, S. Brodnar, A. Chantre, J. Kirtsch, A. Monroy, A. Granier, M. Laurens, J. L. Regolini, and M. Moulis, “Integration of SiGe heterojunction bipolar transistors in a 200 mm industrial BiCMOS technology,” Thin Solid Films, vol. 294, pp. 250—253, 1997.
[50] R. People, “Physics and applications of GexSi1_x/Si strained layer heterostructures,” IEEE J. Quantum Electron., vol. QE-22, p. 1696, Oct. 1986.
[51] G. L. Patton, J. M. C. Stork, J. H. Comfort, E. F. Crabb´e, B. S. Meyerson, D. L. Harame, and J. Y.-C. Sun, “SiGe-base heterojunction bipolar transistors: Physics and design issues,” in Tech. Dig. Int. Electron Devic Meeting, 1990, pp. 13—16.
[52] B. Meyerson, “UHV/CVD growth of Si and SiGe alloys: Chemistry, physics, and device applications,” Proc. IEEE, vol. 80, p. 1592, June 1992.
[53] J. D. Cressler, D. L. Harame, J. H. Comfort, J. M. C. Stork, B. S. Meyerson, and T. E. Tice, “Silicon-germanium heterojunction bipolar technology: The next leap in silicon?,” Tech. Dig. IEEE Int. Solid-State Circuits Conf., 1994, pp. 24—27.
[54] C. Kermarrec, T. Tewksbury, G. Dawe, R. Baines, B. Meyerson, D. Harame, and M. Gilbert, “SiGe HBT’s reach the microwave and millimeter-wave frontier,” in Proc. IEEE Bipolar/BiCMOS Circuits Technol. Meeting, 1994, pp. 155—162.
[55] J. D. Cressler, “Re-engineering silicon: Si-Ge heterojunction bipolar technology,” IEEE Spectrum Mag., pp. 49—55, Mar. 1995.
[56] D. L. Harame, J. H. Comfort, J. D. Cressler, E. F. Crabb´e, J. Y.-C. Sun, B. S. Meyerson, and T. Tice, “Si/SiGe epitaxial-base transistors: Part I─Materials, physics, and circuits,” IEEE Trans. Electron Devices, vol. 40, pp. 455—468, Mar. 1995.
[57] D. L. Harame, J. H. Comfort, J. D. Cressler, E. F. Crabb´e, J. Y.-C. Sun, B. S. Meyerson, and T. Tice, “Si/SiGe epitaxial-base transistors: Part II─Process integration and analog applications,” IEEE Trans. Electron Devices, vol. 40, pp. 469—482, Mar. 1995.
[58] D. L. Harame, “High-performance BiCMOS process integration: Trends, issues, and future directions,” in Proc. IEEE Bipolar/BiCMOS Circuits
[59] D.L. Harame, et al., “SiGe HBT Technology: Device and Applications Issues,” IEEE IEDM, Dig. Of Technical Papers, pp. 731-734, Dec. 1995.
[60] Qingqing Liang; Guofu Niu; Cressler, J.D.; Taylor, S.; Harame, D.L.; “Geometry and bias current optimization for SiGe HBT cascode low-noise amplifiers” Radio Frequency Integrated Circuits (RFIC) Symposium, 2002 IEEE , 2002 Page(s): 407 -410
[61] Sorin P. Voinigescu, Member, IEEE, Michael C. Maliepaard, Member, IEEE, Jonathan L. Showell, Member, IEEE,Greg E. Babcock, David Marchesan, Member, IEEE, Michael Schroter, Member, IEEE,Peter Schvan, Member, IEEE, and David L. Harame, Member, IEEE “A Scalable High-Frequency Noise Model for Bipolar Transistors with Application to Optimal Transistor Sizing for Low-Noise Amplifier Design “, IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 32, NO. 9, SEPTEMBER 1997
[62] C. D. Hull and R. G. Meyer, “Principles of wideband feedback amplifier design,” Int. J. High speed Electron., vol. 3, no. 1, pp. 53-93, Mar. 1992.
[63] Schmidt, A.; Catala, S.,”A universal dual band LNA implementation in SiGe technology for wireless applications,” IEEE Journal of Solid-State Circuits, , Volume: 36 Issue: 7 , Jul 2001
[64] B. G. Choi, Y. S. Lee, C. S. Park, and K. S. Yoon, “Super low noise amplifier with minimum input matching network,” Electron. Lett., vol.
[65] F. Ellinger, “A 5.2 GHz variable gain LNA MMIC for adaptive antenna combining,” in IEEE Microwave Millimeter-Wave Monolithic Circuits Symp. Dig., vol. 3, 1999, pp. 501—504.
[66] K. Kobayashi, A. Oki, L. Tran, and D. Streit, “Ultra-low power dc power GaAs HBT S- and C-band low noise amplifiers for portable wireless applications,” IEEE Trans. Microwave Theory Tech., vol. 43, pp. 3055—3061, Dec. 1995.
[67] U. Erben, H. Schumacher, A. Schuppen, and J. Arndt, “Application of SiGe heterojunction bipolar transistors in 5.8 and 10 GHz low-noise amplifiers,” Electron. Lett., vol. 34, no. 15, pp. 1498—1500, July 1998.
[68] F. Behbahani, J. C. Leete, Y. Kishigami, A. Roithmeier, K. Hoshino, and A. A. Abidi, “A 2.4-GHz low-IF receiver for wideband WLAN in 6_m CMOS-architecture and front-end,” IEEE J. Solid-State Circuits, vol. 35, pp. 1908—1916, Dec. 2000.
[69] H. Samavati, H. R. Rategh, and T. H. Lee, “A 5-GHz CMOS wireless LAN receiver front end,” IEEE J. Solid-State Circuits, vol. 35, pp. 765—772, May 2000.
[70] Powei Lee, The Design and Implementation of HBT Low Noise Amplifiers, Master Thesis, NTU, 2001.
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top