臺灣博碩士論文加值系統

本研究提出金屬玻璃薄膜與可撓性基板整合之研究，金屬玻璃薄膜除了擁有金屬特性之外，還具有高強度、高韌性及高黏著性等優異的機械特性，容易沉積於高分子材料上，因此利用濺鍍技術將鋯基金屬玻璃薄膜與鐵基金屬玻璃薄膜沉積於PDMS基板上，並將此技術分別應用於可撓性導電基板及電磁微型幫浦中，經由不同濺鍍參數調整後得到鋯基金屬玻璃薄膜的最佳沉積速率為20 nm/min、鐵基金屬玻璃薄膜的最佳沉積速率為2.68 nm/min，透過溫度量測金屬玻璃薄膜濺鍍溫度的變化，以確保金屬玻璃薄膜在濺鍍後仍為非結晶結構且保有優異的機械特性。本研究製作了四種可撓性導電基板，分別將金薄膜、金/鈦薄膜、鋯基金屬玻璃薄膜、金/鋯基金屬玻璃薄膜作為導電基材，其中金薄膜的導電度較鋯基金屬玻璃薄膜高，適合作為導電層；從黏著性實驗結果得知鋯基金屬玻璃薄膜的黏著性最佳，金薄膜的黏著性最差；透過拉伸試驗結果驗證，金/鋯基金屬玻璃薄膜的拉伸應變可達到40%且電阻變化小，適合用於可撓性導電基板以提升其可靠度。另外，本研究還提出一種以微機電技術將鐵基金屬玻璃驅動膜與PDMS膜整合的研究，並與微流道結合製作微型幫浦結構，利用外部電磁線圈裝置與已受磁化的電磁驅動膜產生電磁力以驅動流體，外部電磁線圈在輸入20 V的電壓下測得最大磁場為775 G，在1 Hz、0.12 A交流電流的驅動下，電磁驅動膜產生的最大變形量為45 μm，電磁微型幫浦之流速隨著外部電磁線圈施加電流的增加而線性地增加，在1 Hz、0.12 A交流電流的驅動下，電磁微型幫浦產生的流速達到0.17 μL/ min。本研究已成功地將金屬玻璃薄膜與可撓性導電基板整合並應用於兩個研究中，未來可將此技術作為應用。

The metallic glass (MG) thin-film integrated with the flexible substrate is proposed in this study. Metallic glass not only remains metal alloy properties but also has excellent mechanical properties such as high strength, high toughness, and high adhesion. Besides, the metallic glass is easily deposited on the polymeric materials. Therefore, the Zr-based MG thin film and the Fe-based MG thin film were deposited on the PDMS substrate by the sputtering technique for the flexible conductive substrate and electromagnetic micropump applications, respectively. After optimizing the sputtering conditions, the optimum deposition rate is 20 nm/min and 2.68 nm/min for Zr-based MG and Fe-based MG, respectively. The substrate temperature during MG sputtering process was measured for maintaining the MG amorphous structure and the excellent mechanical properties. In this study, four kind flexible conductive substrates were fabricated by using the gold thin film, Au/Ti thin film, Zr-based MG thin film and Au/Zr-based MG thin film on PDMS substrate as the conductive substrates. The measured results show the gold thin film has higher conductivity than the Zr-based MG thin film. It means the gold thin film is suitable material for a conductive layer of the flexible conductive substrates. For the adhesion test, the Zr-based MG thin film shows the highest adhesion force with the PDMS substrate. In opposite, the gold thin film shows the lowest adhesion force with the PDMS substrate. The tensile test was carried out for estimating the relationship between the resistance change and applied strain. The Au/Zr-based metallic can achieve to 40% applied strain with the small resistance change. Therefore, it is suitable for flexible conductive substrates for improving reliability. Besides, the Fe-based MG actuation membrane integrated with PDMS membrane by the MEMS technology is proposed and combined with the microchannel as the micropump structure in this study. The electromagnetic force between the electromagnetic coil and the magnetized Fe-based MG actuation membrane was used to drive the microchannel fluid. The magnetic field generated by the external electromagnetic coil is dependent on the input current and the coil structure. The maximum magnetic field generated by the coil is 775 G when applied voltage of 20 V. When applied the frequency of 1 Hz and the current of 0.12 A, the maximum deflection generated by the electromagnetic actuation membrane is 45 μm. The flow rate of the electromagnetic micropump increases linearly with the increase of the current applied by the external electromagnetic coil. When applied the frequency of 1 Hz and the current of 0.12 A, the maximum flow rate produced by the electromagnetic micropump is 0.17 μL/ min. The metallic glass thin film is successfully integrated with the flexible substrate and applied to the two studies, and this technology can be used as an application in the future.

摘要 i
Abstract ii
目錄 iv
圖目錄 vi
表目錄 viii
第一章 緒論 1
1.1 前言 1
1.2 研究目標 2
第二章 文獻回顧 4
2.1 金屬玻璃相關文獻 4
2.2 可撓性導電基板相關文獻 6
2.3 微型幫浦相關文獻 8
第三章 材料與方法 11
3.1 金屬玻璃薄膜之製作 11
3.1.1 金屬玻璃薄膜之特性與濺鍍技術 11
3.1.2 金屬玻璃薄膜濺鍍參數 14
3.2 可撓性導電基板之製作 16
3.2.1 金屬玻璃與可撓性基板整合之製作 16
3.2.2 四種可撓性導電基板之製作 17
3.2.3 導電性、黏著性及拉伸試驗量測架構 19
3.3 電磁微型幫浦之製作 21
3.3.1 電磁螺線圈磁場產生原理、製作及量測架構 21
3.3.2 電磁驅動膜之致動原理、製程及量測架構 24
3.3.3 電磁微型幫浦之致動原理、製程及量測架構 32
第四章 結果與討論 38
4.1 金屬玻璃薄膜實驗結果 38
4.1.1 金屬玻璃薄膜鍍率之量測結果 38
4.1.2 金屬玻璃薄膜濺鍍溫度之量測結果 39
4.2 可撓性導電基板實驗結果 41
4.2.1 導電性實驗之量測結果 41
4.2.2 黏著性實驗之量測結果 41
4.2.3 拉伸試驗之量測結果 42
4.3 電磁微型幫浦實驗結果 45
4.3.1 線圈磁場與溫度之量測結果 45
4.3.2 驅動膜變形量之量測結果 53
4.3.3 電磁微型幫浦流速之量測結果 63
第五章 結論與未來展望 65
5.1 結論 65
5.2 未來展望 66
參考文獻 67

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