臺灣博碩士論文加值系統

由於個人電腦近年來，已經越來越普及了，對應於速度不斷提升且高瓦數的CPU，最佳化的散熱需求也已經刻不容緩，相對的各式各樣的散熱方式與散熱元件也讓人大開眼界。
LCD PC這類的產品相較於桌上型電腦的大體積以外更講究輕薄美觀，另一方面又要有桌上型電腦的效能，所以在市場上大受歡迎，再者由於大尺寸面板的大幅度降價，終究帶動未來的趨勢與流行。
傳統的LCD-PC由於空間的緣故一般是設計成類似桌上型的形式，也就是一顆大風扇吹Heat-sink，但會造成高溫持續在系統中環繞，並無法真正完成全系統散熱，然而現在大多數的使用者會漸漸的要求低噪音，這在強制對流底下是相互違背的。
本論文中最主要是針對LCD PC整體性的散熱的問題作為探討的目的，研究的方法為利用模擬軟體IcePak 來分析不同的散熱器以及風扇配對的位置對於全系統的溫度場及速度場的影響，最後輔以實機的整體測試與模擬作為比較與驗證，以得到不同設計所產生影響，進而達到最佳化的理想。
本文後段會針對下列方案進模擬:
一. 雙軸流扇吹風
二. 雙軸流扇抽風
三. CPU鼓風扇散熱模組加系統鼓風扇(抽風)
四. CPU與VGA皆為鼓風扇加散熱模組
五. CPU鼓風扇散熱模組加系統軸流扇抽風

利用熱流分析模擬軟體，可以使我們在設計實機前無樣品階段能有效率且快速的得到系統內的流場走勢及溫度場的分布情形，能夠大幅度降低設計失誤及錯誤的次數，在這個資訊講求快速的時代去縮短設計產品的週期以提高競爭力及降低因失誤所產生的成本問題。這個研究的最主要目的是讓電腦模擬出最佳的狀態以求的最完美的組合，也能夠讓其他機構工程師在設計系統時能對完整的系統散熱以及研發有所認知與參考價值。

Recently personal computers are getting more and more popular and it makes the accuracy thermal solution required constantly because more implement CPU with higher speed available in the market, in other words, all kinds of thermal solution and modules are amazing for users now.
LCD PC is not only particular to be lighter and thinner but also more efficient than desktop and it is the reason why personal computer is more and more popular in the market, moreover, a sharply cost-down for large LCD panel which makes personal computers to be a trend and wide-spread eventually.
Traditional LCD-PC normally is designed to be similar to desktop because of space limited, such like a big fan for heat-sink which leads the high temperature continuously surrounded in the system and can not makes thermal flow dispelled completely, however, most of end-customers request to have low-noise supported and this special request is against to force convection acutely.
The main purpose of this essay is to discuss overall LCD PC thermal issues and to analyze different heat-sinks as well as the system temperature and airflow caused by various fan position by simulated software IcePak. We try to used final simulation system to verify, and get more beat perfection value.
We try five different strategies in this case. The best thermal performance by using the CFD code will be compared with this case.

中文摘要 I
英文摘要 III
目錄 V
表目錄 VIII
圖目錄 X
符號說明 XV
致謝 XVI
第一章 緒論 01
11 前言 01
12 LCD PC的發展背景 02
13 研究動機與方法 03
第二章 系統介紹 05
21 LCD PC系統介紹 05
22 系統內的散熱與傳導08
第三章 熱傳分析 09
31 文獻回顧 09
32 熱傳分析 15
33 散熱模組影響關鍵 16
331 散熱模組設計階段需求17
332 散熱模組的組成19
34 熱的傳導與組抗 21
35 熱的對流 23
第四章 數值模擬與分析流程 25
41 模擬分析軟體IcePak簡介25
42 模擬的流程與步驟 27
43 系統模型建立敘述 30
44 模型建立 30
45 數值模擬分析 27
第五章 實驗規劃與測試結果 63
51 實驗規劃 63
52 LCD PC 待測物簡介 64
53 測試設備簡介 66
54 熱顯像儀結果 69
55 實驗規劃 74
551 測試條件 76
552 測試點規劃 78
56 測試結果 83
57 噪音分析 89
58 熱流模擬結果分析與實驗結果91
第六章 結論 86
結論 96
參考文獻 98

參考文獻
1.李雅雄，筆記型電腦散熱系統之主動式熱沉最佳化設計，交通大學
機械工程系碩士論文2001年。
2.R.L.Liton,”CFD Model of Electronic Enclosures”,ASME Heat Transfer in Electronic Equipment,HTD-Vol.171,pp.95-100,1991
3.R.L.Liton,and D.Agonafer, ”Thermal Model of a PC”,ASME Journal of Electronic Packaging,Vol.166,pp.134-137,1994
4.T.Y.Lee,and M.Mahalingam,”Application of a CFD Tool for System-Level Thermal SIMULATION”,IEEE Transations on Components, Packaging, and Manufacturing Technology-Part A,Vol.17,No.4,pp.564-571,1994
5.D.Lober,”Optiomizing the Integration of a Electronics System into an Exiting Enclosure Using CFD Modeling Techniques”,Proceedings of ISPS,January,1999
6.Mike Turner,and Comair Rotron”All You Need to Know About Fan”,Electronic Cooling,January,2000
7.Sathyamurthy,P.,Runstadler,P.W,”Numerical and Experimental Evalution of Planar and Staggerred Heat Sinks”,Inter Society Conference on Thermal Phenomena,Vol.5,No.7,pp.132-139,1996.
8.H.Xie,A.Ali and R.Bhatia,”The Use of Heat pipe in Computer”, 1998 Inter Society Conference on Thermal Phenomena, pp.442-448,1998
9.J.R.Rujano,R.Cardnas,M.M.Rahman and W.A.Moreno,” Development of a Thermal Management Solution for a Ruggedized Pentium Based Notebook Computer”,1998 IEEE Inter Socirty Conference on Thermal Phenomena, pp.8-14,1998
10.Thurlow,E.,Prather,E.,and Mansingh,V.,”Fan Sirwl Effect on Cooling Heat Sink and Electronic Packages”,Sixteenth IEEE SEMI-THERM Symposium,Vol 1,No,7,pp.91-98,2000
11.黃家烈,筆記型電腦散熱風扇之研究,台灣科技大學機械工程博士論文,2001
12.R.H.Yeh and M.Chang,”Optimum longitudinal convective fin arrays”,International Communication in Heat and Mass Transfer, vol.22,pp.445-460,1995
13.C.L.Chapman,S.lee,and B.L.Schmidt,”Thermal performance of an elliptical pin fin heat sink”,Tenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.IEEE,pp.24-31,1994
14.林致遠,”Penitium Ⅱ處理器上的熱傳分析”,大同工學院機械工程研究所碩士論文,1999
15.何俊民,筆記型電腦散熱片流場配置最佳設計,台灣科技大學機械工程碩士論文,2001
16.L.A.Brignoni and V.Garimella,”Experimental optimization of confined air jet impingement on a pin fin Heat sink”,IEEE Transactions on Components and Packaging Technology, vol.22, pp.300-308,2000
17.H.A.El-Sheikh and V.Garimella,”Experimental air jet impingement Heat transfer using pin-fin Heat sink”,IEEE Transactions on Components and Packaging Thechnology,vol.23, pp.300-308,2000
18.盧俊彰,筆記型電腦散熱系統測試與改良研究,清華大學工程與系統科學系碩士論文,2000.
19.Morrison,A.T.,”Optimization of Heat Sink Fin Geometries for Heat Sink in Natural Covection”,Inter Society Conference on Thermal Phenomena,1992
20.Chapman,C.L.,Lee,S.,and Schmidt,B.L.,”Thermal Performance of an elliptical pin fin heat sink”,Tenth IEEE SEMI-THERMTM,1994
21.Azar,K.,and Mandrone,C.D.,”Effect of Pin fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks”,Ninth Annual IEEE,1995
22.胡文,”風扇流場之數值模擬與量測”,國立交通大學碩士論文1998
23.陳怡如,筆記型電腦CPU不等間距散熱之最佳設計,台灣大學機械工程碩士論文,2001
24.Wirtz,R.A.,and Zheng,N.,”Methodology for Predicting Pin-Fin Fan-Sink PERformance”,The Sixth Intersociety Conference on,1998
25.Behnia,M.,Copeland,D.,and Soodphakdee,D.,”A Comparison of Heat Sink Geometries for Laminar Forced Convection Numerical Simulation of Periodically Developed Flow”,The Sixth Intersociety Conference,1998