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研究生:陳達元
研究生(外文):Chen, Ta-Yuan
論文名稱:台灣IC設計產業的經營能力及智慧資本管理研究
論文名稱(外文):Managerial Capabilities and Intellectual Capital Management of IC Design Industry in Taiwan
指導教授:楊千楊千引用關係
指導教授(外文):Yang, Chyan
學位類別:博士
校院名稱:國立交通大學
系所名稱:經營管理研究所
學門:商業及管理學門
學類:企業管理學類
論文種類:學術論文
論文出版年:2011
畢業學年度:99
語文別:英文
論文頁數:63
中文關鍵詞:IC計設單晶片系統模組化標準矽智財經營能力資料包絡法智慧資本
外文關鍵詞:IC designSoCsystem on a chipmodularitystandardsSIPmanagerial capabilityDEAintellectual capital
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過去二十年來,台灣IC設計產業經歷了快速的成長,已經成為了僅次於美國的全球第二大IC設計產業。IC設計產業具有變動快速、固定資產比率低以及知識密集度高等特性。然而,由於新技術不斷出現,IC設計產業也面臨了許多不確定性及衝擊。例如單晶片系統(SoC)技術的發展,就為台灣IC設計產業帶來了許多新的挑戰。此外,由於IC設計產業具有高度知識密集的特性,經營能力的優劣,以及對智慧資本的管理能力,就成了決定成敗的重要因素。
本論文回顧台灣IC設計產業的發展歷程,探討內在及外在的成功因素,進而探究單晶片系統技術對台灣IC設計產業可能造成的衝擊。另外本論文也針對經營能力及智慧資本的管理進行兩項實證性的研究。在經營能力的研究中,使用了三階段資料包絡法(3-stage Data Envelopment Analysis)對美國及台灣的主要IC設計公司進行相對競爭力的研究分析。在智慧資本的研究中,則以台灣IC設計公司為樣本,分析其經營效率,並提供相關的建議及管理意涵。

IC design industry in Taiwan has experienced dramatic growth over the past two decades. Taiwan IC design industry, behind the US, has become the second largest in the world. The characteristics of IC design industry are fast-changing, asset-light and knowledge-intensive. However, the emergence of new technologies may bring about uncertainty and impact. For example, the rise of System-on-a-Chip (SoC) design methodology has brought new challenges to Taiwan IC design industry. Since IC design industry is asset-light yet knowledge-intensive, the managerial capabilities and intellectual capital management are the critical issues for the industry.
The dissertation explores the external and internal factors that make Taiwan IC design industry successful. Besides, the characteristics of Taiwan IC design industry and the impact of SoC are studied. In addition, two empirical studies on managerial capabilities and intellectual capital management are conducted. The study of managerial capabilities employed 3-stage DEA to investigate the competitive landscape of dominate players in US and Taiwan IC design industry. The study of intellectual capital management compares the managerial efficiency of intellectual capital for IC design houses in Taiwan. The implications and recommendation resulting from the studies are provided.

摘 要 i
ABSTRACT ii
Table of Content iv
List of Tables vi
List of Figures vii
Chapter 1. Introduction 1
1.1. Research Background 1
1.2. Scope and Objectives 3
1.2.1. The “Temporary Champion Curse” of IC design industry in Taiwan 3
1.2.2. Managerial Capabilities of IC Design Industry 3
1.2.3. Intellectual Capital Management of IC Design Firms in Taiwan 4
1.3. Organization of the Dissertation 4
Chapter 2. The “Temporary Champion Curse” of IC design industry 6
2.1. Research background 6
2.2. Modularity 7
2.2.1. Modular system 7
2.2.2. Benefits of modular system 7
2.2.3. Technological changes and modularity 8
2.2.4. Knowledge scope and competitiveness 9
2.3. IC design industry in Taiwan 10
2.3.1. Migration of IC design industry 10
2.3.2. Characteristics of IC design industry in Taiwan 12
2.3.3. The temporary champion curse 12
2.4. Market and technological change in IC design industry 14
2.5. The enduring champion in Taiwan IC design industry 17
2.6. Conclusion and implication 18
Chapter 3. Empirical Study on Managerial Capabilities of IC Design Houses 21
3.1. Research background 21
3.2. Literature Review 23
3.2.1. Capability 23
3.2.2. Measurement of capabilities 24
3.3. Research methodology 25
3.3.1. The Three-Stage DEA Model 25
3.3.2. Stage 1: The Initial DEA Producer Performance Evaluation 26
3.3.3. Stage 2: Using SFA to Decompose Stage 1 Slacks 27
3.3.4. Stage 3: Adjusted DEA 27
3.5. Data 28
3.5.1. Data collection 28
3.5.2. Input and output variables 28
3.5.3. Environmental Variables 29
3.6. Empirical results 31
3.7. Discussion and Conclusion 37
Chapter 4. Empirical Study on Intellectual Capital Management 42
4.1. Research background 42
4.2. Measurement of intellectual capital management 43
4.3. Data Envelopment Analysis 44
4.4. Combination of DEA and PCA 45
4.5. Methodology 45
4.5.1. Data Envelopment Analysis (DEA) 45
4.5.2. Principal Component Analysis (PCA) and Biplot 46
4.6. Data 47
4.7. Results 48
4.7.1. DEA results 48
4.7.2. PCA results and biplots 49
4.8. Conclusion 53
Reference 55
Appendix 1 IC design companies in Taiwan..................................................................................63

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