臺灣博碩士論文加值系統

研磨技術的平坦化過程中，材料移除率具有相當的重要性。為了節省拋光墊成本及維持加工的品質，因此須將拋光墊加以修整，使其回復到原有的功能，此即拋光墊的平坦化。拋光墊表面承受負荷會產生變形，並對其移除量造成重大之影響。因此，本研究目的為利用具粗度微接觸彈塑性模型模擬平坦化加工並找出在平坦化過程最佳的參數。於本研究中，拋光墊表面分成具粗糙顆粒部份及平坦部份。平坦化加工一開始磨料顆粒與拋光墊的粗糙表面接觸並產生移除現象，然後再跟平坦表面接觸。首先，運用磨料顆粒對拋光墊表面具粗糙顆粒的部分進行加工移除，過程中利用彈塑性理論及材料移除理論。粗糙部分移除後，磨料顆粒再與拋光墊平坦部分接觸，兩接觸面同樣經由彈塑性理論而達到表面移除與其平整度。之後加總磨料顆粒之移除量，即可得到總移除量。最後，將欲研究之參數代入建立的模型，包括施加負載，修整輪旋轉的速度和磨料顆粒的密度…等，找出平坦化過程最佳的參數。結果顯示修整力越大拋光墊的變形量越大，且經過一定的加工時間後，表面的不平整度會趨近於定值。在相同的修整力條件下，不同厚度的拋光墊所獲得的變形曲線其變化不大；當鑽石修整輪的鑽石密度增加時，材料表面的拋除量均會跟著增加。握持器和拋光墊相對轉速接近時，拋除量也會最小。最終，研究發現使用較大的修整力並將握持器和拋光墊轉速調成接近及適度的使用握持器具平移速度似乎是最佳的平坦化加工條件，因為如此做，既可得到高拋除量又可保有較小之表面不平整度。

In planarization processes, material removal analysis is essential to the estimation of wear rate and non-uniformity. A model that describes the material removal of pad with rough surface grinding by using abrasive grains is developed. A collection of micro-contact spots is identified and subsequently deformation approach is calculated. Elastic-plastic theory and wear model are used to construct the expression for the magnitude of material removal as a function of indentation depth. First, the indentation depth of a micro-contact spots into the asperity of pad and the deformation of flat part of pad are obtained by using elastic-plastic theory. Then, the material removal caused by individual micro-contact is calculated with the help of wear theory. Finally, the macroscopic wear volume is found by summing the volumetric wear of each individual micro-contact. Moreover, parametric study is conducted to explore the influence on the material removal analysis and planarization interfacial phenomena of operational parameters. These parameters compose of the applied down force, rotational speed of dresser and density of abrasive grains. The results provide a detailed consideration of the interface phenomena and yield an insight into the physical effects of the operating parameters in the planarization process.

中文摘要 i
英文摘要 iv
誌 謝 vi
表目錄 ix
圖目錄 x
圖目錄 x
符號說明 xiii
第一章 緒論 1
1.1前言 1
1.2研究目的 1
1.3文獻回顧 2
1.4 章節瀏覽 4
1.5研究方法 4
第二章 平坦化加工機制 7
2.1基本假設 7
2.2平坦化所需要件 7
2.3 在宏觀等級情況下 8
2.4 修整輪和鑽石顆粒結構配置 9
2.5改良後旋轉摩擦路徑 9
第三章 彈塑性原理 14
3.1 拋光之彈塑性接觸模式 14
3.2 G-W model 塑性指標 14
3.3 磨料與晶圓之間接觸應力與接觸面積 16
第四章 平坦化加工理論 20
4.1 拋光墊變形理論 20
4.1.1 單一修整輪均佈負載對拋光墊表面的變形量 20
4.1.2 拋光墊承受多顆修整輪負載的變形 21
4.2 鑽石顆粒與拋光墊粗糙表面之間的微接觸理論模型 22
4.2.1 靜態接觸 22
4.2.2 滑動接觸 24
4.3 鑽石顆粒與拋光墊平坦表面之間的微接觸理論模型 25
4.3.1 靜態接觸 25
4.3.2 滑動接觸 27
4.3.3計算平坦化過程中拋除量的過程 27
4.4 磨耗移除理論 28
4.4.1 磨耗的機制與原理 28
4.4.2 鑽石顆粒和拋光墊粗糙表面之間磨耗移除理論 29
4.4.3 鑽石顆粒和拋光墊平坦表面之間磨耗移除理論 30
第五章 利用具粗度微接觸彈塑性模型模擬平坦化加工 38
5.1詳細研究方法 38
5.2 拋除量的計算模型 38
5.3理論應證與計算平坦化過程中移除量的過程 40
5.4計算的結果 41
5.5 結果討論 49
第六章 結論與建議 71
6.1 結論 71
6.2 建議與未來展望 72
參 考 文 獻 74
附錄一 78
自傳 85

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