臺灣博碩士論文加值系統

IC 封裝(Integrated circuit packaging) 是半導體製程之後段製程，主要目的為保護IC 晶片、提供散熱以及IC 晶片上元件之連結。烘烤作業則是IC 封裝製程之後段程序，接續在封膠(molding) 程序之後，其目的為藉由烘烤將IC 上封膠完全固化以及除去IC 晶片內部水氣，確保IC 功能正常。而在烘烤作業後之作業程序多為IC 外觀調整之程序，如剪切、成形以及打印，最後經過檢驗後IC封裝製程即完成。
烘烤程序需在固定溫度下持續烘烤才能使IC 中之水氣去除以及使膠體固化。若在烘烤過程開啟烤箱會使外部環境之空氣進入烤箱，導致烤箱內部溫度降低以及溼度提昇。使烘烤作業時間拉長或者沒辦法完全去除水氣、固化膠體。然而等待烤箱內IC 烘烤後取出再放入新的IC 則會使烤箱利用率不佳。
在實務上面對這個問題，是額外增加烘烤一段時間以降低頻繁開啟烤箱所造成的影響。舉例來說，若有一批物品需要完整接受烘烤八小時( 即不考慮烤箱開啟烤箱時降低烘烤的效果) 才能除去元件內部的水氣，在實務是以烘烤八個半小時甚至是九個小時來消弭頻繁開啟烤箱所造成的影響。然而這個方法並未真正解決造成烘烤不完全的原因，且這些額外烘烤時間會造成烤箱利用率降低，並非為治本的方法。
本論文即是以IC 封裝烘烤作業為研究對象，建構問題模式，並設計一演算法決定每個庫存物品的儲位以及放入與取出時間，探討如何擺放IC 以及何時擺放、取出可使烤箱開啟次數降低。

IC packaging is ‾nal stage in semiconductor device fabrication. Its main purpose is to protect IC chip and interconnect of devices. Oven operation is back-end process
of IC packaging. Oven operation makes sure normal unctions of IC chip by solidifying an encapsulant and evaporating.
Oven operation can reach the goal by baking at constant temperature and constant time. If the oven is opened during baking, the temperature of the oven will drop
and the humidity int the oven will raise. However, the oven utilization is low if putting incoming lots in the oven after baking end of lots in the oven.
This problem is solved in practice by adding extra baking time to reduce the influence of opening the oven. For example, if the baking time of the lot is 8 hours, it
will be baked 8.5 hours or 9 hours actually. This action does not settle the real reason of causing incomplete baking and extra baking time also causes lower oven utilization.
This thesis focuses on oven operation in IC packaging. Construct the problem model and then propose an algorithm to solve this problem. Decide the oven location,
start-baking time and end-baking time for each lot.

摘要i
英文摘要ii
誌謝iii
表目錄vi
圖目錄vii
第一章緒論1
1.1 研究背景與動機. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 研究假設. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 研究目的. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 研究流程. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.5 論文架構. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
第二章相關文獻回顧6
2.1 IC 封裝製程簡介. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 烘烤作業簡介. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 訂單指派分類. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3.1 跨倉儲指派. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3.2 單一倉儲指派. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.3 訂單揀取. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4 儲位指派策略. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4.1 隨機儲存. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.4.2 空位儲位指派. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.4.3 定位儲位指派. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.4.4 完全週轉率儲位指派. . . . . . . . . . . . . . . . . . . . . . . 18
2.4.5 分類儲位指派. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5 動態空間配置. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.6 小結. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
第三章問題定義與模式25
3.1 問題描述與基本假設. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.1.1 問題描述. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.1.2 基本假設. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.1.3 符號說明. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.2 模式建構. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.3 求解演算法. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
第四章數值分析40
4.1 測試資料. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
4.2 數值分析. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
4.2.1 選擇批量策略. . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
4.2.2 是否有加入空間連續判斷. . . . . . . . . . . . . . . . . . . . . 44
4.2.3 允許延遲時間. . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
4.2.4 批量在烘烤過程平均烤箱開啟次數. . . . . . . . . . . . . . . 47
4.3 小結. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
第五章結論與未來研究方向51
5.1 結論. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
5.2 未來研究方向. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
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