臺灣博碩士論文加值系統

本研究主要在探討及建構半導體產業的安全衛生管理系統，參考國際現行之職業安全衛生管理系統OHSAS 18001之架構，發展出安全衛生管理調查問卷及訪談問卷，實際進行安全衛生管理工作之探討，以深入瞭解我國半導體產業安全衛生管理工作之完整性。本研究的成果包括建立一套以問卷做調查半導體安全衛生管理之工具。本研究以此問卷對半導體產業安全衛生管理工作的作業輸入、作業處理及作業輸出做調查及訪談。結果顯示，我國半導體產業安全管理六個構面為：1.公司應讓員工清楚了解安全衛生的法令及標準；2.制定安全衛生政策要公開；3.公司應落實安全衛生管理法令的執行；4.意外事故應加以預防；5.安全訊息應有充份溝通；6.公司對安全衛生法令的規範應有完整考量。其中，半導體產業組織規模愈大，其員工愈能體認工安管理之重要性；半導體產業在安全管理投入成本愈大，其員工愈能體認工安管理之重要性。

The main point of this study is to discuss and establish the health and safety management system for semiconductor industry. The researcher practically discuss that by using the questionnaires and the interview which is developed according to the framework of the OHSAS 18001. The method of this study is to investigate and interview the input,process and output of the health and safety management of semiconductor industry by these tools. The result shows that there are six factors suggestions for the health and safety management in taiwan semiconductor industry. 1.The company should make employee more clear on the legislation and standard about health and safety. 2.The company should make the health and safety policy known to the public. 3.The company should put emphasis on the pursuance of legislation of the health and safety management. 4.The company should prevent the accidents. 5.The company should communicate largely with health and safety message. 6.The company should consider completely health and safety norm. In addition,the semiconductor industry either puts more costs on the health and safety management or has larger numbers of people,the employee should get more agree to the concernment of the health and safety management.

中文摘要................................................................................................................................................................... i
英文摘要...................................................................................................................................................................ii
誌謝...........................................................................................................................................................................iii
目錄...........................................................................................................................................................................iv
表目錄.......................................................................................................................................................................vi
圖目錄.......................................................................................................................................................................vii
第一章、緒論
§1.1 研究背景與動機........................................................................................................................................1
§1.2 研究問題與假設........................................................................................................................................2
§1.3 研究範圍....................................................................................................................................................3
§1.4 研究流程....................................................................................................................................................4
第二章、文獻探討
§2.1 半導體產業現況........................................................................................................................................5
§2.2 職業災害之相關探討................................................................................................................................6
2.2.1 我國職業災害現況..............................................................................................................................7
2.2.2 半導體業的職業災害概況..................................................................................................................7
2.2.3 事故相關理論......................................................................................................................................9
§2.3 其他相關研究之探討................................................................................................................................11
§2.4 調查工具之發展........................................................................................................................................14
§2.5 研究架構....................................................................................................................................................17
第三章、研究方法
§3.1 研究對象....................................................................................................................................................20
§3.2 問卷之編製................................................................................................................................................21
§3.3 預試............................................................................................................................................................22
§3.4 與半導體工安管理相關因素之探討........................................................................................................22
§3.5 資料分析方法............................................................................................................................................23
第四章、結果
§4.1 問卷的信度與效度....................................................................................................................................24
§4.2 樣本特性分析............................................................................................................................................31
§4.3 樣本交叉分析............................................................................................................................................32
§4.4 組織因素與工安管理變項間的關聯性....................................................................................................36
§4.5 員工個人變項與工安管理變項間的關聯性............................................................................................45
第五章、討論與結論
§5.1 討論............................................................................................................................................................55
§5.2 結論............................................................................................................................................................60
§5.3 研究限制與研究建議................................................................................................................................62
5.3.1 研究限制.............................................................................................................................................62
5.3.2 未來研究建議.....................................................................................................................................62
參考文獻...................................................................................................................................................................64
附錄一
附錄二
附錄三
附錄四

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