臺灣博碩士論文加值系統

本文主要在探討合金元素及雷射掃描製程對304不銹鋼表面氮化矽雷射被覆層顯微組織及耐磨耗性能的影響。實驗中利用SEM、EDS、EPMA、X-Ray繞射儀及微硬度儀等設備分析雷射被覆層顯微組織、元素分佈、相組成種類及硬度分布的形態，用以評估不同合金元素及雷射掃描製程對被覆層特性的影響效應。利用迴轉式磨耗機在不同磨耗條件下，對各種被覆試片進行乾磨耗試驗，以了解被覆層磨耗機理並評估顯微組織與耐磨耗能力的關係。
實驗結果顯示純氮化矽被覆層顯微組織是由γ-FeCrNi相之不規則長條狀組織、Cr3C2及CrSi2相之網狀結構及α-FeCrNi相之基地組織所組成，添加Mo合金粉末後，被覆層顯微組織明顯改變，組織中會晶出MSi2（M=Mo,Cr）及MoNi4相，此時被覆層硬度會由原先之Hv0.3 718增加到Hv0.3 1845，提高大約2.5倍。磨耗測試結果發現以添加W合金粉末之試片，在本文測試條件下，具有較佳的耐磨耗能力，以添加Co合金粉末之試片耐磨耗能力較差。不同雷射掃描製程部份，以雷射掃描２次的試片具有較佳的耐磨耗能力，原因與顯微組織改變、氣孔數量減少以及組織中第二相與基地結合強度較佳有關。

The major objective of this thesis is to investigate the stainless steel wear resistance, which improved by Si3N4 ceramic powder cladding with laser surface cladding technique. In this paper three types of laser scanning processes and four types of alloy elements, such as Mo、Co、Cr、W, was prepared for coating process , which were used to study the influence of various alloy powders and laser scanning processes effect on cladded surface wear resistance ability. The microstructure of cladding layer was characterized by scanning electron microscope (SEM) , X-ray diffraction (XRD) and electron probe micro-analysis (EPMA). Then, rotating type tribometer was used to evaluate the wear behaviors of the different cladded specimens under dry sliding conditions.
According to results, the microstructure of the pure Si3N4 cladding layer is composed of lump-likeγ-FeCrNi, net-like Cr3C2+CrSi2 and the matrix of the primary α-FeCrNi. After Mo alloy element added, the microstructure of the cladding layer changed obviously and the hardness of the cladding layer increased from Hv0.3 718 to Hv0.3 1845. The specimen cladded by Si3N4 based powder contain certain W alloy powder, had the best wear resistance performance in all specimens. In addition, the specimen cldded by laser scanning twice also having better wear resistance performance is contributed to that microstructure of the cladding layer changed, amounts of gas hole decreased and the better adhesion strength between second phases and the matrix in the cladding layer.

中文摘要………………………………………………………………..Ⅰ
英文摘要…………………………………………………………….….Ⅱ
誌謝……………………………………………………………………..Ⅲ
目錄……………………………………………………………………..Ⅳ
表索引…………………………………………………………………..Ⅸ
圖索引…………………………………………………………………..Ⅹ
第一章 前言……………………………………………………………1
第二章 文獻回顧………………………………………………………3
2.1 雷射被覆處理……………………………………………….3
2.1.1 二氧化碳雷射介紹………………………………….3
2.1.2 雷射被覆處理的特性……………………………….3
2.1.3 雷射被覆處理製程參數的影響…………………….4
2.1.4 雷射被覆處理的研究……………………………….7
2.2 不銹鋼表面改質處理……………………………………….9
2.2.1 AISI304不銹鋼的主要特性………………………..9
2.2.2 不銹鋼表面改質研究……………………………...11
2.3 氮化矽陶瓷的特性………………………………………...16
2.4 銲接強化機構……………………………………………...17
2.5 合金元素對被覆層的影響………………………………...19
2.6 磨耗機構…………………………………………………...20
2.6.1 磨耗原理…………………………………………...20
2.6.2 被覆層磨耗性質的研究…………………………...23
第三章 實驗方法與步驟……………………………………………..26
3.1 實驗步驟…………………………………………………...26
3.2 實驗材料準備……………………………………………...26
3.2.1 基材………………………………………………...26
3.2.2 被覆粉末…………………………………………...27
3.2.3 熔填焊條製作……………………………………...27
3.3 雷射表面被覆處理………………………………………...27
3.3.1 雷射加工系統……………………………………...27
3.3.2 雷射被覆參數……………………………………...28
3.4 被覆層組織及成份分析…………………………………...28
3.4.1 金相觀察…………………………………………...28
3.4.2 成份分析…………………………………………...29
3.4.3 X-Ray繞射分析……………………………………29
3.5 被覆層微硬度量測………………………………………...30
3.6 磨耗試驗…………………………………………………...30
3.6.1 磨耗試片製備……………………………………...30
3.6.2 磨耗試驗條件……………………………………...31
3.6.3 磨耗試片分析……………………………………...31
第四章 結果與討論…………………………………………………..32
4.1 被覆層顯微組織及成份分析……………………………...32
4.1.1 合金元素對被覆層顯微組織及成份的影響……...33
4.1.1.1 添加Mo合金粉末對氮化矽雷射被覆層的影響………………………………………34
4.1.1.2 添加Co合金粉末對氮化矽雷射被覆層的影響………………………………………35
4.1.1.3 添加Cr合金粉末對氮化矽雷射被覆層的影響………………………………………36
4.1.1.4 添加W合金粉末對氮化矽雷射被覆層的影響………………………………………37
4.1.2 雷射掃描製程對被覆層顯微組織及成份的影響...39
4.2 雷射掃描製程對被覆層成份分佈的影響………………...42
4.3 被覆層微硬度評估………………………………………...43
4.3.1 合金元素對被覆層微硬度分佈的影響…………...43
4.3.2 雷射掃描製程對被覆層微硬度分佈的影響……...44
4.4 被覆層磨耗行為分析……………………………………...47
4.4.1 氮化矽被覆試片磨耗測試結果…………………...47
4.4.2 合金元素對氮化矽被覆試片磨耗行為的影響…...50
4.4.2.1 添加Mo合金粉末氮化矽被覆試片磨耗結果分析……………………………………50
4.4.2.2 添加Co合金粉末氮化矽被覆試片磨耗結果分析……………………………………51
4.4.2.3 添加Cr合金粉末氮化矽被覆試片磨耗結果分析……………………………………53
4.4.2.4 添加W合金粉末氮化矽被覆試片磨耗結果分析……………………………………54
4.4.2.5 純氮化矽被覆試片磨耗結果分析………55
4.4.3 雷射掃描製程對氮化矽被覆試片磨耗行為的影響…………………………………………………...56
4.4.3.1 雷射掃描製程對純氮化矽被覆試片磨耗行為的影響…………………………………57
4.4.3.2 雷射掃描製程對添加Mo合金粉末氮化矽被覆試片磨耗行為的影響………………57
4.4.3.3 雷射掃描製程對添加Co合金粉末氮化矽被覆試片磨耗行為的影響………………58
4.4.3.4 雷射掃描製程對添加Cr合金粉末氮化矽被覆試片磨耗行為的影響……………....59
4.4.3.5 雷射掃描製程對添加W合金粉末氮化矽被覆試片磨耗行為的影響……….……...59
第五章 結論與建議………………………………………….……….61
5.1 結論……………………………………………….………..61
5.2 建議………………………………………………………...62
參考文獻………………………………………………………………..63

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