臺灣博碩士論文加值系統

近年來，隨著全球電信自由化潮流及技術日益成熟，無線通訊產業趨於活絡而使產品類別更多元化。整體而言，系統之發展方向、元件技術發展技術之方向必須符合高頻化、低損耗、小型化及模組化等三個方向。SAW目前尚無法突破整合於矽晶片中，且低溫共燒陶瓷封裝技術對於元件在小型化或模組化提供了最佳的平台，因此用低溫共燒陶瓷技術製作之陶瓷元件的特性與無線通訊市場需求之發展方向不謀而合。
本篇論文則是利用模擬方式探討表面聲波元件在低溫共燒陶瓷封裝內之特性。開始則是探討低溫共燒陶瓷技術製作過程，了解低溫共燒陶瓷技術的優缺點。之後以一個電感及電容元件為例利用全波模擬軟體HFSS (High Frequency Structure Simulator)模型化與實際量測所得作比較，確切了解模型化的正確性。最後結合全波模擬軟體HFSS及電路分析軟體的方法，去探討模擬SAW Filter 在LTCC封裝中各項設計參數對於表面聲波元件頻率響應的影響，以求取最適合的設計參數。

Recently, as fast developing in global telecommunication and personal communication getting matured, wireless communication industry tends to become more and more activating. Everyday various products related to telecommunications come to market. In general, those products, no matter they are system level or component level, must satisfy high frequency, miniaturization, and modulization. Because surface acoustic wave (SAW) device could not to integrate on silicon wafer to this day, only low temperature cofired ceramic (LTCC) technology
offers a platform to integrate components into a miniaturized module and happens to be coincident with this trend.
Hence, this thesis studies the characteristics of a SAW filter that was packaged using LTCC technique. First, the process of LTCC technology was overviewed. Then, the characteristics of a SAW filter packaged by LTCC technique was simulated using two different methods, one is by
commercial 3D EM wave simulator (High Frequency Structure Simulator, HFSS) and the other is by a high frequency circuit simulator Ansoft Harmonic. The matching circuits for the SAW filter were as embedded into the package by LTCC. The simulation results show a good agreement by both methods. The technology used in the thesis provides a convenient way to evaluate the performance of SAW devices after packaged with LTCC process.

中文摘要i
英文摘要ii
目錄iii
圖目錄v
表目錄vii
第一章 緒論1
1.1 研究背景1
1.2 研究動機2
1.3 論文架構2
第二章 SAW的工作原理與低溫共燒陶瓷簡介3
2.1 SAW 的工作原理3
2.1.1 簡介3
2.1.2 SAW 濾波器的工作原理6
2.2 低溫共燒陶瓷製程技術9
2.2.1 低溫共燒陶瓷製程簡介11
第三章 低溫共燒陶瓷電感及電容的模擬17
3.1 HFSS使用流程介紹17
3.1.1 HFSS使用流程介紹18
3.2 低溫共燒陶瓷電感的設計與模擬20
3.2.1 低溫共燒陶瓷電感種類分析與抉擇20
3.2.2 低溫共燒陶瓷電感模擬與實際量測之較23
3.3 低溫共燒陶瓷電容的設計與模擬25
3.3.1 低溫共燒陶瓷電容種類分析與抉擇25
3.3.2 低溫共燒陶瓷電容模擬與實際量測之比較26
第四章 低溫共燒陶瓷包含SAW濾波器之模擬28
4.1 前言28
4.2 Serenade模擬SAW 濾波器的匹配阻抗28
4.3 利用HFSS模擬低溫共燒陶瓷封裝結構31
4.4 比較線路模擬與HFSS模擬35
第五章結論與未來研究方向37
5.1 結論37
5.2 未來方向37
參考文獻38

中文部份
[1]林冠諭撰論文”封裝寄生效應對表面聲波元件效能的影響研究”
[2]林鴻欽撰”多層低溫共燒陶瓷製程技術”
[3]胡慶利、李文熙 博士撰” 低溫陶瓷共燒技術在無線通訊市場之應用與趨勢”
[4]楊立群撰論文”低溫共燒陶瓷嵌入式電感與電容元件之設計與模型化”
英文部份
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