臺灣博碩士論文加值系統

本研究主要係探討非導電性黏膠於可撓性基板上封裝之覆晶其凸塊與墊片經封裝過程中之固化收縮後，在溫度循環負載下，模擬半導體在時效過程中為維持介面接觸力所進行之介面機械互鎖效應。藉由改善凸塊/墊片介面接觸面特性來提昇晶片封裝的可靠度為其目的。透過變化的粗糙面與實際形狀凸塊幾何參數，比較接觸面上的正向應力來顯示機械互鎖效應引發等效接觸應力的提昇。
本研究利用ANSYS商用套裝有限元素軟體進行數值模擬，並採用2D模型對非導電性黏膠之材料性質與凸塊之幾何尺寸的變化進行敏感度分析。研究顯示，適度增加非導電性黏膠的楊氏模數與熱膨脹係數，能有效增加在固化過程中凸塊/墊片的結合力。相較直線介面，鋸齒介面能藉由機械互鎖效應提升介面正向壓力。本文的分析模式將可用於非傳導性黏膠之可撓性基板的覆晶封裝體系統，進行凸塊/墊片接觸介面的應力分析。

This paper focuses on the mechanical interlocking effects on the bump/pad interfacial contact surface of a flip chip on flex with non-conductive adhesive under thermal cycling loads after the bonding/curing process of packaging. The aim of improvement for the bump/pad interfacial contact characteristics was to enhance the reliability of chip set package through a well maintained contact surface. Comparisons of the normal stress on the interfacial contact surface with varied roughness for the true-shaped bump geometric parameters, revealed the mechanical interlocking effects, and induced the increase of equivalent contact stresses.
Finite Element Code ANSYS was used to analyze the package, and a 2D model was adopted to proceed with a parametric sensitivity analysis for the material properties of non-conductive adhesive and bump geometric dimensions varied. The results of aging by using thermal cycling showed that the bonding force between bump/pad will be improved by moderate increase of Young’s modulus and thermal expansion coefficient of non-conductive adhesive. A so-called “saw-tooth” fractal surface will raise the normal compressive force, and surpassed the flat surface by the effect of mechanical interlocking. A case-by-case interfacial stress analysis was suggested for the investigation of any realistic microelectronic package due to the complexity among all the interrelated parameters.

致謝 I
摘要 II
ABSTRACT III
目錄 IV
表目錄 VI
第一章 緒論 10
第二章 理論基礎 19
第三章 模式建構與分析 22
3.1 基本假設 22
3.2 參數設定 22
3.3 分析策略 24
3.4建模步驟 25
3.5模式驗證 32
3.6分析步驟與目的 35
第四章 分析結果 43
4.1 參數敏感度分析 43
4.2 機械互鎖效應分析 51
4.3 討論 56
第五章 結論與未來展望 58
參考文獻 60

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