臺灣博碩士論文加值系統

八木天線(Yagi-Uda)是當前最為廣泛應用的天線之一，此天線包含三個部份，第一部分為輻射天線本體(radiator)、第二部份為導波元件(director)以及最後部分為若干個反射元件(reflector) ，其優點在於，結構簡單且高增益(gain)，以三元件型態(3-element)之八木天線為例，增益可達7~8dB，適用於點對點(point-to-point)無線傳輸。
在本論文中，提出了一種新的架構，將八木天線以堆疊(stacking)型態，實現在低溫共燒陶瓷(low-temperature co-fired ceramics, LTCC)之製程上，並且以V頻帶(V-band, 57GHz~64GHz)為設計頻段。
為了實際應用在低溫共燒陶瓷的封裝技術上，除了以輻射場型(radiation pattern)為區分的五組單獨天線架構之外，本研究亦提供了兩組包含覆晶晶片(flip chip)及內建天線的晶片系統封裝實例，以上各組內容都包含設計過程、模擬結果、反射係數(reflection coefficient)量測以及輻射場型(radiation pattern)量測。以垂直基板方向輻射之天線為例，量測所得天線增益在4~5dB。

Yagi-Uda is one of the most popular antennas for all applications. It usually has three parts, including a radiator, several directors and several reflectors. Yagi-Uda antenna can be easily designed and achieve relatively high gain. For example, a properly designed three-element Yagi-Uda antenna can achieve gain of about 7~8dB. Therefore, Yagi-Uda is good for use in point-to-point wireless communication.
In this thesis, we proposed a new structure that is a stacking Yagi-Uda antenna in LTCC substrate and operating in V-band.
Five different types of Yagi-Uda antenna for different radiation directions are presented. Also transmitting and receiving modules integrated with embedded stacked Yagi-Uda antenna and flip-chip dies are also shown. Design procedures, simulation results and measurement results for all designs are given. The measured typical gain of antenna for vertical radiation is about 4~5dB.

第 1 章 簡介 1
1.1 V-band背景介紹 1
1.2 研究動機及論文檢索 4
1.2.1 準八木天線(Quasi-Yagi Antenna)[2] 4
1.2.2 晶片天線(Antenna on Chip)[3] 5
1.2.3 封裝天線(Antenna in Package)[4] 6
1.2.4 堆疊天線(Stacked Yagi Antenna)[8] 8
1.2.5 研究目標 9
1.3 低溫共燒陶瓷 9
1.4 各章節簡介 10
第 2 章 相關理論 12
2.1 定義 12
2.1.1 方向性及增益 12
2.1.2 反射係數、穿透係數及頻寬 13
2.2 輻射阻抗 16
2.2.1 短偶極天線 16
2.2.2 半波長偶極天線輻射阻抗 18
2.2.3 半波長摺疊偶極天線 21
2.3 線性陣列 22
2.3.1 線性陣列 22
2.3.2 二元件型態之準八木天線 23
2.3.3 三元件型態之八木天線 30
2.4 電路元件對天線之電磁干擾 31
2.4.1 介質波導 31
2.4.2 降低元件間耦合及電磁干擾 33
2.5 覆晶連接(Flip-chip interconnect) 34
第 3 章 LTCC內建式60GHz八木天線設計 38
3.1 內建式八木天線 38
3.1.1 三元件形態 38
3.1.2 多反射器 42
3.1.3 不同反射面的影響 45
3.2 有限基板大小對天線影響 45
3.3 饋入貝楞(Balun)及電磁干擾阻隔設計 47
3.3.1 微帶線(MS)到差動訊號之共平面帶線(Coplanar Strips) 47
3.3.2 內建於低溫共燒陶瓷之貝楞設計 50
3.4 通孔及電磁干擾阻隔設計 54
3.5 貝楞對場型及反射係數的影響 57
第 4 章 包含組裝架構之天線模擬 59
4.1 垂直基板方向輻射 59
4.1.1 正Z方向輻射且具有隔絕金屬之貝楞(typeⅠ) 59
4.1.2 正Z方向輻射且不具有隔絕金屬之貝楞(typeⅡ) 63
4.1.3 負Z方向輻射(typeⅢ) 67
4.2 平行基板方向輻射 71
4.2.1 內建於基板(typeⅣ) 71
4.2.2 建構於基板表層之全平面式(typeⅤ) 75
4.3 運用於晶片系統封裝之天線 79
4.3.1 封裝方式 79
4.3.2 發射端及接收端 81
4.4 量測方式 83
4.4.1 下針量測及模擬反射係數 83
4.4.2 轉接板量測及模擬反射係數 85
4.4.3 輻射場型量測 90
4.4.4 轉接板對天線場型的影響 91
第 5 章 結論 94
參考文獻 98

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