臺灣博碩士論文加值系統

異方性導電膠膜(Anisotropic Conductive Films, ACF)主要用於精細的覆晶技術(Flip Chip Technology)電極間連接，在各種電子產品的模組封裝技術，有著廣泛的應用。異方性導電膠膜(ACF)具有導電的功能，組成包括環氧樹脂、固化劑、導電粒子及添加劑。導電粒子組成包括內核為高分子微球及外殼Au/NiP。高分子微球經過敏化、活化及無電鍍形成導電粒子，為改善傳統敏化-活化的缺點，採取新穎的微波照射-敏化活化、微波照射-乙醇活化法等兩種，與傳統敏化活化法進行比較。
若使用微波照射-敏化/活化法，PMMA微球表面的鈀吸附量，會隨微波照射功率增加而提升，當微波照射功率為150~200 W時，鈀吸附量是傳統敏化活化法的2~3倍，鈀吸附滯留比率也會提升。若使用微波照射-乙醇活化法，可形成親水性含氧官能基與鈀原子形成配位鍵結，以提高鈀吸附量。兩種微波照射-活化法，無需添加任何分散劑，在微球表面可形成粒徑4~6 nm附近的奈米鈀，較佳的催化活性有利於無電鍍反應，可得到緻密且均勻的NiP鍍層，同時鍍層附著力比傳統敏化活化法來得佳。

Anisotropic conductive film (ACF) is generally used as an interconnection material for flip chip technology has a wide application in a variety of electronics modules packaging technologies. ACFs are adhesive films that become conductive due to consisting mainly of epoxy resins, curing agents, conductive particles and other additives agents. Conductive particles are core-polymer microspheres and shell- Au/NiP. General manufacture includes sensitization, activation and metalization of polymer microspheres. To improve the shortcomings of traditional sensitization and activation, two brand new microwave irradiation-sensitization/activation and microwave irradiation-ethanol activation are applied in this research for comparisons with traditional sensitization/activation.
Palladium adsorption on PMMA microsphere surfaces increases with the microwave irradiation power in microwave irradiation-sensitization/activation. At 150~200W of the microwave irradiation power, the palladium adsorption amount is 2~3 times the traditional sensitization/activation and the retention ratio of palladium adsorption also increases. More hydrophilic oxygen-containing functional groups are formed in microwave radiation-ethanol reduction to build possibly coordinate covalent bonds with palladium atoms or ions and increase the palladium catalyst adsorption. Palladium nano-particles of 4 to 6nm in size with better catalytic activities are formed on microsphere surfaces without dispersants in the above two microwave irradiation activation approaches. Smoother and more uniform coatings with higher adhesion are formed after electroless plating when compared with the traditional sensitization/activation.

目錄
誌謝 ii
摘要 iii
Abstract iii
目錄 v
表目錄 vi
圖目錄 vii
1.緒論 1
2.文獻回顧 13
3.實驗方法 46
4.結果與討論 56
5.結論 117
6.未來展望 118
參考文獻 119
論文發表 133
自傳

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