臺灣博碩士論文加值系統

隨著科技日新月異，消費者對於電子消費產品要求日益嚴苛，舉凡手機、筆記型電腦、PDA、數位相機等各項產品皆講求更輕、更薄、體積更小、功能更強大等。有鑒於上述需求，各家廠商無不盡全力發展穩健製程方法以提升製程穩定度，此亦推動著整個組裝製程技術進步改良。其中關鍵製程則在於表面黏著組裝作業 (Surface Mount Assembly) 之發展。而SMT之關鍵製程在於錫膏印刷 (Stencil Printing)，一般而言，60% 焊接缺點乃源自於錫膏印刷製程。
鑒於目前業界對錫膏印刷參數組合並無一個最佳化標準可依循，於新產品生產時往往需要預先多次試印，並從試誤法中找尋最佳化印刷參數組合。本研究針對此錫膏印刷製程提出一最佳化印刷參數之方法，解決生產線事前整備時間之浪費並提升印刷焊性品質減少重工與修復之成本浪費，使得印刷結果符合產品需求。此最佳化方法運用實驗設計法 (Design of Experiment) 之部分因子實驗 (Fractional factorial design)，對此印刷作業進行資料蒐集，其後利用反應曲面法找尋最佳印刷參數組合並與歷史製程統計品管 (Statistical Process Control, SPC) 資料進行比對驗證績效，並藉由基因演算法特殊之運算模式所找尋之最佳化參數組合進行比較，選擇較佳組合供業界參考使用。結果顯示，在最佳化能力上基因演算法所找尋之最佳化參數組合於SPC資料比對時印刷品質優於反應曲面法。

Following scientific and technological progress, the requirements of electronic products become increasingly thinner, lighter, smaller and functionally more powerful models, such as cell phones, laptop computers, PDAs, digital cameras and other gadgets are sought after. In view of this perspective, electronics manufacturers have been developing more stable production methods that assure greater stability, which in turn promotes the development of better technologies for printed circuits board assembly (PCBA). Of the latter, the key lies in the development of the Surface Mount Technology (SMT) assembly process. Stencil printing is one of the most important processes in SMT assembly. An average 60% of soldering defects are attributed to inadequate stencil printing parameter settings. Today, there are no standard parameter sets for stencil printing in the electronic industry. The manufacturing process of new products always requires trial printing before production launch, through which the printing parameters were obtained by trial and error approach.
In this study, two optimization models of stencil printing parameters were developed. A fractional factorial experiment design was conducted for collecting structured data to closely investigate the relationships of inputs and outputs and followed by using Response Surface Method (RSM) and Genetics algorithms (GAs) to optimize the given process. Finally, two optimized parameter sets obtained and compared with the empirical SPC data for performance assessments. Results show that the parameter combinations optimized by GAs is superior to RSM. The findings can further provide electronic manufacturers to speed up line setup procedure and improve soldering quality.

摘 要…….. I
ABSTRACT II
誌 謝…….. IV
目 錄…….. V
表目錄……. VII
圖目錄….. VIII
第一章 緒論 1
1.1 簡介 1
1.2 研究背景與動機 2
1.3 研究目的 3
1.4 研究方法與流程 3
1.5 論文架構 4
第二章 文獻探討 6
2.1印刷電路板簡介 6
2.2 PCBA 製程 7
2.3 表面黏著技術 (Surface Mounting Technology, SMT) 製程 12
2.3 錫膏印刷製程 16
2.3.1 錫膏印刷品質衡量 17
2.3.2 影響錫膏印刷品質變數 19
2.4 反應曲面法 23
2.5.1 二水準因子設計 (Two-level factorial design) 25
2.5 基因演算法 28
第三章 研究方法 32
3.1 實驗設計 32
3.1.1 基本原理 32
3.1.2 部分因子實驗設計 34
3.1.3 印刷體積之量測 35
3.2 反應曲面法 36
3.3 基因演算法 37
3.3.1 基因演算法之基本理論 38
3.3.2 基因演算法機制 39
第四章 模式發展與分析 43
4.1 實驗工廠環境相關資料 43
4.2 錫膏印刷參數最佳化模式之建構 43
4.2.1 以實驗設計萃取結構化之錫膏印刷製程數據 44
4.2.2 建構反應曲面模型 45
4.2.3 模型之最佳化輸出 51
4.2.4 基因演算法模型之建立 52
4.3 績效比較 56
第五章 結論與建議 58
5.1 結論 58
5.2 未來研究方向 59
參考文獻.. 60
附 錄…… 67

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