臺灣博碩士論文加值系統

本論文研究首先應用有效的熱網路數值分析方法，針對離散二維/三維電子構裝鑲嵌於多層結構板未結合或結合各類型冷板的熱傳與流體流動摩擦特性，作一系列的理論分析，並將計算之熱流結果與前人之理論解析解及實驗數據相比較，皆相當吻合；進而，在研究中亦針對影響上述散熱結構組合之熱流特性的相關參數做有系統的探討。
另外，針對離散二維/三維電子構裝鑲嵌於多層結構板結合各類型冷板設計，本研究更成功地提出一完整且有系統的最佳化設計方法。此最佳化設計方法乃結合反應曲面法及序列二次規劃法，可使設計者有效且快速地在多個限制條件下找出最佳化的散熱設計。在設計過程中，首先利用工程統計分析所作出的敏感度測試可定量地分析出系統中各相關影響參數之貢獻度；接著應用反應曲面法搭配實驗計劃法來求得滿足其熱流特性之二階迴歸曲面關係式；最後再藉由數值最佳化方法來有效地求出在各種限制條件下的最佳化散熱設計。在本研究中，成功地將前述之最佳化設計方法及流程應用於中央處理器冷卻及多層印刷電路板冷卻之各類型冷板最佳化設計之研究上。
以前述之理論模式結合最佳化設計方法及流程為基礎，研究中更進一步的成功開發出二套應用於中央處理器冷卻以及應用於多層印刷電路板冷卻之各類型冷板的電腦輔助最佳化設計系統。系統中包括人機介面操作相當友善的前置處理器、根據所發展之理論模式而建立的散熱分析器、具有自動建立實驗設計、建構迴歸曲面以及預測最佳設計等功能的最佳化運算器、應用多媒體互動技術的後置處理器、執行軟體過程中親和的使用者介面、以及相關的材料及熱流特性資料庫。最後，本研究成功地應用自行開發出之電腦輔助最佳化設計系統於多限制條件下之離散二維/三維電子構裝鑲嵌於多層結構板結合各類型冷板最佳化設計上，其結果皆驗證此電腦輔助最佳化設計系統的獨特性及優越性。

A series of thermal analyses with an effective thermal network method on heat transfer and flow friction characteristics of compact cold plates with discrete two-dimensional/three-dimensional electronic packages mounted on a multi-layer structure have been performed. Comparisons between the predicted thermal performance of discrete two-dimensional/three-dimensional electronic packages mounted on a multi-layer structure without or with compact cold plates by the present developed thermal analyzer and existing data have been made with satisfactory agreements. A series of parametric studies on thermal performance for discrete two-dimensional/three-dimensional electronic packages mounted on a multi-layer structure without and with compact cold plates have been explored, respectively.
In addition, a systematical design optimization method with the Response Surface Methodology and Sequential Quadratic Programming techniques for performing the thermal optimization of compact cold plates with discrete two-dimensional/three-dimensional electronic packages mounted on a multi-layer structure under multiple constraints has been successfully developed. First, a statistical method for the sensitivity analysis has been performed to determine the critical factors of the design; and a response surface methodology has been applied to establish a series of performance correlations in terms of the design factors with a well-organized design of experiments. By employing the gradient-based numerical optimization technique, a series of globally optimal designs have been efficiently performed. With the developed design optimization method, two applications for thermal optimization of compact cold plates with discrete two-dimensional/three- dimensional electronic packages mounted on a multi-layer structure under multiple constraints have been systematically explored. They are (1) thermal optimal design for compact cold plates in CPU cooling and (2) thermal optimal design for compact cold plates in multi-layer PCB cooling.
Furthermore, two novel interactive and user-friendly thermal optimal computer-aided design systems, which are composed of pre-processor, thermal network analyzer, optimizer, post-processor and user interface for automatically predicting the optimal thermal performance for generalized compact cold plates in CPU cooling and in multi-layer PCB cooling have been successfully developed. In the pre-processor, a user-friendly interface has been constructed to collect the required data for the thermal analyzer and optimizer. A thermal analyzer for compact cold plates with discrete two-dimensional/three-dimensional electronic packages mounted on a multi-layer structure has been successfully established by using an effective thermal network method. Corresponding to the presented design optimization method, the design optimizer has been established with the functions of conducting the design of experiments, automatically constructing response surface models, and then performing numerical optimization. After obtaining the optimal design, the real-time three-dimensional model, predicted color isotherms, and all the predicted performances have been displayed in the developed post-processor to provide a direct communication between user and computer. With the present developed thermal optimal computer-aided design systems, the optimal thermal design applied to generalized compact cold plates under multiple constraints with either a minimum thermal resistance or a minimum pressure drop/mass in CPU cooling and in multi-layer PCB cooling have been effectively performed. The superiority of the developed thermal optimal computer-aided design systems has been demonstrated.

ABSTRACT i
ACKNOWLEDGMENTS iv
LIST OF TABLES xiii
LIST OF FIGURES xvi
NOMENCLATURE xlii
CHAPTER 1 INTRODUCTION AND BACKGROUND 1
1.1 INTRODUCTION 1
1.2 LITERATURE SURVEY 3
1.2.1 Three-dimensional Multi-layer Structures with Discrete Heat Sources 3
1.2.2 Compact Cold Plates 15
1.2.3 Three-dimensional Multi-layer Structures Integrated with Compact Cold Plates 18
1.2.4 Design Optimization Techniques 20
1.2.5 Computer-Aided Design System 29
1.3 RESEARCH TOPICS AND OBJECTIVES 35
1.3.1 Thermal Analysis for Discrete Electronic Packages Mounted on a Multi-layer Structure 37
1.3.2 Thermal Analysis for Compact Cold Plates with Discrete Electronic Packages Mounted on a Multi-layer Structure 38
1.3.3 Thermal Optimal Design for Compact Cold Plates with Discrete Electronic Packages Mounted on a Multi-layer Structure 38
1.3.4 Development of Thermal Optimal CAD System for Compact
Cold Plates in CPU Cooling 39
1.3.5 Development of Thermal Optimal CAD System for Compact
Cold Plates in Multi-layer PCB Cooling 40
1.4 THESIS ORGANIZATION 41
CHAPTER 2 THERMAL ANALYSIS FOR DISCRETE ELECTRONIC
PACKAGES MOUNTED ON A MULTI-LAYER
STRUCTURE 44
2.1 ESTABLISHMENT OF THERMAL MODEL 44
2.1.1 Finite-Volume Model Generation 45
2.1.2 Thermal-Network Model Generation 49
2.2 THERMAL NETWORK ANALYZER 52
2.2.1 Fundamental Theory 53
2.2.2 Numerical Methods 61
2.2.3 Procedure of Performing Thermal Network Analysis 74
2.2.4 Grid Test 76
2.3 RESULTS AND DISCUSSION 78
2.3.1 Validation 78
2.3.2 Parametric Studies 88
CHAPTER 3 THERMAL ANALYSIS FOR COMPACT COLD PLATES WITH DISCRETE ELECTRONIC PACKAGES MOUNTED ON A MULTI-LAYER STRUCTURE 134
3.1 FUNDAMENTAL THEORIES FOR COMPACT COLD PLATES 134
3.1.1 Design Equation 135
3.1.2 Definition of LMTD and ε-Ntu Method 135
3.1.3 Fin and Weighted Passage Efficiency 137
3.1.4 Multi-Stack Cold Plate with Asymmetric Two-Sided Heating Loads 138
3.1.5 Generalized Prediction for Heat Transfer Surface Geometry 142
3.1.6 Pressure Drop and Mass Evaluations 144
3.1.7 Design Procedure for Multi-Stack Compact Cold Plates 145
3.2 THERMAL MODEL FOR COMPACT COLD PLATES WITH
DISCRETE ELECRONIC PACKAGES MOUNTED ON A
MULTI-LAYER STRUCTURE 147
3.3 THERMAL ANALYZER FOR COMPACT COLD PLATES WITH
DISCRETE ELECRONIC PACKAGES MOUNTED ON A
MULTI-LAYER STRUCTURE 148
3.4 RESULTS AND DISCUSSION 157
3.4.1 Validation 157
3.4.2 Parametric Studies 160
CHAPTER 4 THERMAL OPTIMAL DESIGN FOR COMPACT COLD PLATES WITH DISCRETE ELECTRONIC PACKAGES MOUNTED ON A MULTI-LAYER STRUCTURE 187
4.1 OPTIMAL DESIGN METHODOLOGY 187
4.1.1 Design of Experiments 187
4.1.2 Response Surface Methodology 188
4.1.3 Accuracy and Adequacy of Regression Model 196
4.1.4 Numerical Optimization Techniques 200
4.2 APPLICATIONS 203
4.2.1 Thermal Optimal Design for Compact Cold Plates in CPU Cooling 204
4.2.2 Thermal Optimal Design for Compact Cold Plates in Multi-layer PCB Cooling 226
CHAPTER 5 DEVELOPMENT OF THERMAL OPTIMAL CAD
SYSTEM FOR COMPACT COLD PLATES IN CPU COOLING 303
5.1 CONFIGURATIONS OF THERMAL OPTIMAL CAD SYSTEM 303
5.2 PRE-PROCESSOR 304
5.2.1 Computer Graphics and User Interface 305
5.2.2 Problem Definition and Model Generating 306
5.2.3 Data Pre-processing 308
5.3 ANALYZER 309
5.4 OPTIMIZER 309
5.4.1 DOE Planning 309
5.4.2 Response Surface Regression 310
5.4.3 Numerical Optimization Programming 311
5.5 POST-PROCESSOR 312
5.5.1 Optimal Design Solutions 312
5.5.2 Realtime 3-D Modeling and Graphical Visualization 313
5.5.3 Data Post-processing and Report 314
5.6 INTEGRATION OF OPTIMAL CAD SYSTEM 314
5.7 APPLICATIONS 316
5.7.1 Optimal Thermal Design for Generalized Compact Cold Plates under Multiple Constraints with a Minimum Thermal
Resistance 316
5.7.2 Optimal Thermal Design for Generalized Compact Cold Plates under Multiple Constraints with a Minimum Pressure Drop or Mass 324
CHAPTER 6 DEVELOPMENT OF THERMAL OPTIMAL CAD
SYSTEM FOR COMPACT COLD PLATES IN
MULTI-LAYER PCB COOLING 375
6.1 CONFIGURATIONS OF THERMAL OPTIMAL CAD SYSTEM 375
6.2 PRE-PROCESSOR 376
6.2.1 Problem Definition and Model Generating 377
6.2.2 Data Pre-processing 379
6.3 ANALYZER 379
6.4 OPTIMIZER 380
6.4.1 DOE Planning 380
6.4.2 Response Surface Regression 381
6.4.3 Numerical Optimization Programming 381
6.5 POST-PROCESSOR 382
6.5.1 Optimal Design Solutions 382
6.5.2 Realtime 3-D Modeling and Graphical Visualization 383
6.5.3 Data Post-processing and Report 384
6.6 INTEGRATION OF OPTIMAL CAD SYSTEM 384
6.7 APPLICATIONS 385
6.7.1 Optimal Thermal Design for Generalized Compact Cold Plates under Multiple Constraints with a Minimum Thermal
Resistance 385
6.7.2 Optimal Thermal Design for Generalized Compact Cold Plates under Multiple Constraints with a Minimum Pressure Drop or Mass 394
CHAPTER 7 CONCLUSIONS AND RECOMMENDATIONS 456
7.1 CONCLUSIONS 456
7.2 RECOMMENDATIONS 460
REFERENCES 462
APPENDIX A COOLANT PROPERTIES 479
APPENDIX B MATERIAL PROPERTIES 482
VITA 488
LIST OF PUBLICATIONS 489

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