臺灣博碩士論文加值系統

本文探討傾斜位移路徑下，利用BGA銲點試片測試系統負荷-位移修正法及試片夾具勁度值將63Sn/37Pb BGA試片位移-負荷數據修正成錫球位移-負荷數據。 下之拉-扭循環比例位移路徑使用循環內涵時間黏塑性理論之塊材63Sn/37Pb核心函數，預測各 下之循環應力-應變曲線，並建立錫球的等效非彈性應變振幅 與等效應力振幅 關係式為 ，以及BGA試片位移振幅 及對應 之關係式： 。上述方法連結業界BGA試片結果與學界銲錫本構模式之研究結果。
對BGA試片在循環傾斜位移測試下初始壽命預估，本文循環損傷在物理現象下依循環圈數及 上升加大其損傷強度依此，可推導出 -修正之損傷乘冪方程式並決定63Sn/37Pb及Sn/3.5Ag/0.75Cu之損傷指數n。結合損傷演化方程式與前述Endochronic Viscoplasticity 可推導出以 -Modified Lee-Coffin-Manson( -LCM) 方程式： ，及 -LBGA方程式： 。上述方程式對63Sn/37Pb、Sn/3.5Ag/0.75Cu BGA疲勞壽命數據皆有良好之預估結果；再與文獻所提供之預估結果做評論。

In this paper, the force -oblique displacement correction methods of the BGA solder joint specimens and the values of grip stiffness were used to correct the force-oblique displacement curves of the 63Sn/37Pb BGA specimens into the force-displacement data of their solder balls under proportional strain cyclic test. The kernel function of Endochronic cyclic viscoplasticity of 63Sn/37Pb bulk material was employed to predict the cyclic proportional stress-strain curves and then construct the relationship of the effective inelastic strain amplitude and the effective stress amplitude : . Also the BGA oblique displacement amplitude has a relation with of solder ball by . This result connects the research of BGA solder joint specimen in industry and the research of constitutive models in academic.
Based on physical phenomena, dependent damage degree depends positively on N cycle and , then the -modified damage power equation and the -Modified Lee-Coffin-Manson equation( -LCM) for the fatigue initiation life of solder ball: can be derived. Finally the -LBGA equation for the fatigue life of BGA specimens: can be obtained. Using the -LBGA equation, both of 63Sn/37Pb and Sn/3.5Ag/0.75Cu BGA fatigue life can be predicted very well.

摘要 I
Abstract II
誌謝 IV
符號說明 V
目錄 IX
表目錄 XIV
圖目錄 XV
第一章 緒論 1
1-1 前言 1
1-2 研究動機 2
1-3 文獻回顧 3
第二章 傾斜位移角度下BGA試片測試系統負荷-位移修正法 6
2-1 本章介紹 6
2-2 BGA負荷-位移修正法 7
2-2-1 Sn/3.5Ag/0.75Cu負荷-位移修正結果 10
2-2-2 63Sn/37Pb負荷-位移修正計算及結果 13
第三章 BGA試片在傾斜位移角度下內涵時間黏塑性本構方程式及壽命預估公式 14
3-1 本文介紹 14
3-2 錫球循環比例應變 下含損傷增量本構方程式 15
3-3 錫球循環比例應變內涵損傷演化方程式之建立 23
3-4 錫球Endochronic疲勞壽命 -LCM公式 27
3-5 錫球 - Modified損傷公式 28
3-6 BGA試片Endochronic疲勞壽命( -LBGA)公式 29
第四章 BGA試片傾斜位移角度下內涵時間黏塑性理論之計算與實驗比較 30
4-1 本章介紹 30
4-2 錫球內涵時間黏塑性理論之材料參數 30
4-2-1 以單剪試驗( )為基準決定內涵時間黏塑性理論之材料參數 30
4-2-2 定溫下以位移振幅( )為基準之核心函數 32
4-2-2-1 Sn/3.5Ag/0.75Cu之核心函數 32
4-2-2-2 63Sn/37Pb之核心函數 33
4-2-3 函數 之決定 34
4-2-3-1 Sn/3.5Ag/0.75Cu材料函數 之結果 34
4-2-3-2 63Sn/37Pb材料函數 之計算 35
4-2-4 材料參數 及 方程式建立 36
4-2-4-1 Sn/3.5Ag/0.75Cu材料函數 與 之結果 36
4-2-4-2 63Sn/37Pb材料函數 與 37
4-2-5 63Sn/37Pb循環軸向位移( )之計算結果與實驗之比較 38
4-2-6 63Sn/37Pb循環比例位移角度( )之計算結果與實驗之比較 38
4-2-7 等效循環應力-應變關係式之建立 40
4-2-7-1 Sn/3.5Ag/0.75Cu等效循環應力-應變關係式 41
4-2-7-2 63Sn/37Pb等效循環應力-應變關係式 43
4-3 BGA位移路徑-等效非彈性應變振幅關係式之建立 45
4-3-1 Sn/3.5Ag/0.75Cu BGA試片位移路徑-等效非彈性應變關係式 46
4-3-2 材料63Sn/37Pb BGA試片位移路徑-等效非彈性應變關係式 47
第五章 錫球在循環比例位移路徑下 -LCM及 -損傷公式中參數之決定 50
5-1 本章介紹 50
5-2 決定材料參數n與m 50
5-2-1 Sn/3.5Ag/0.75Cu之n與m 51
5-2-2 63Sn/37Pb之n與m 51
5-3 決定 和 52
5-3-1 Sn/3.5Ag/0.75Cu之 和 52
5-3-2 63Sn/37Pb之 和 54
5-4 決定 和 55
5-4-1 Sn/3.5Ag/0.75Cu之 和 值 56
5-4-2 63Sn/37Pb之 和 值 56
5-5 決定 57
5-5-1 Sn/3.5Ag/0.75Cu之 函數 57
5-5-2 63Sn/37Pb之 函數 59
5-6 決定 60
5-6-1 Sn/3.5Ag/0.75Cu之 函數 60
5-6-2 63Sn/37Pb之 函數 60
第六章 63Sn/37Pb及Sn/3.5Ag/0.75Cu BGA試片在循環傾斜位移測試下初始壽命預估-含循環損傷內涵時間黏塑性理論之應用 61
6-1 錫球Endochronic疲勞壽命 -LCM預估結果及討論 61
6-1-1 Sn/3.5Ag/0.75Cu 錫球Endochronic疲勞壽命 -LCM預估結果及討論 61
6-1-2 63Sn/37Pb錫球Endochronic疲勞壽命 -LCM預估結果及討論 62
6-2 BGA試片Endochronic疲勞壽命 -LBGA預估結果及討論 62
6-2-1 Sn/3.5Ag/0.75Cu BGA試片Endochronic疲勞壽命 -LBGA預估結果及討論 62
6-2-2 63Sn/37Pb BGA試片Endochronic疲勞壽命 -LBGA預估結果及討論 64
第七章 結論 67
附表 69
附圖 71
參考文獻 122

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