臺灣博碩士論文加值系統

本文主要利用微機電製程於四吋晶圓上製作壓電式微機電麥克風，在設計方面先由ANSYS做模擬，由應力分佈與模態分析中，來設計出壓電式微麥克風的基本外型，再由設計的外型設計不同參數，分別為長寬比，在振膜固定端增加溝槽設計降低自然頻率，與不同厚度的壓電薄膜，希望由這一些參數得到較佳的麥克風設計。
經由微機電製程及溶凝膠製程得到六層PZT壓電薄膜之微麥克風，其中製程最後一道步驟的矽晶片長時間背蝕難度較高，晶片的正面必須以萜烯酚樹脂做保護，再放入鐵氟龍模具中，邊緣再以瀝青膠帶做密封保護矽晶片。
在麥克風性能量測時音源使用G.R.A.S. type 44AA人聲模擬器，壓電式微麥克風將接收到的標準聲音訊號轉換成電訊號，再經過擴大器放大傳送到電腦，量測後得到麥克風靈敏度為5 μV/μbar。
本研究是國內首次利用壓電薄膜製作微機電麥克風，研究中設計分析不同振膜長寬比及溝槽，藉此得到最佳化的麥克風設計。製程中克服背蝕的困難完成麥克風元件，未來將探討壓電薄膜厚度對性能的影響。

In this thesis, the piezoelectric MEMS microphone fabricated on 4〞 wafers by MEMS techniques is researched. At first, the stress gradient and modal analysis was simulated to design the optimal profile parameter of piezoelectric MEMS microphone by ANSYS, including the number of corrugation, aspect ratio and different thickness of piezoelectric thin film. Finally, the microphone with 6-layers PZT thin film was assembled by MEMS techniques and Sol-Gel process. The back etching of chip is more difficult in final step since the front side of chip coating with terpene - phenol resin and the edge of chip sealed by asphalt tape in Teflon mold.
The source of piezoelectric MEMS microphone will be received and translated standard signal by G.R.A.S. type 44AA with sensitivity of 5μV/μbar.
This study is the first one piezoelectric MEMS microphone by PZT thin film in Taiwan. Aspect ratio, the number of corrugation and thickness of piezoelectric thin film are simulated to design the optimal profile parameter of piezoelectric MEMS microphone by ANSYS. The back etching for piezoelectric MEMS microphone of MEMS technique is the more complicated. The thickness of PZT thin film will be researched in future work.

中文摘要…………………………………………………………I
英文摘要…………………………………………………………II
目錄………………………………………………………………IV
表目錄……………………………………………………………VII
圖目錄……………………………………………………………VIII
第一章 序論……………………………………………………1
1.1前言…………………………………………………………1
1.2文獻回顧……………………………………………………3
1.3研究動機……………………………………………………5
1.4論文架構……………………………………………………6
第二章 壓電材料及聲學基礎理論……………………………11
2.1 壓電材料簡介…….………………………………………11
2.2 鋯鈦酸鉛 PZT基本性質介紹……………………………12
2.3 聲學基本原理……………………………………………14
2.4 麥克風基本原理…………………………………………16
2.5 麥克風性能參數…………………………………………18
2.6 有限元素法原理…………………………………………20
第三章 ANSYS麥克風振膜模擬………………………………25
3.1研究方法……………………………………………………25
3.2實驗配置……………………………………………………25
3.3 振膜靜力分析………………………………………………26
3.4 振膜模態分析………………………………………………26
第四章 實驗與製程………………………………………………33
4.1 PZT壓電薄膜製作…………………………………………33
4.2 壓電式微麥克風製程……………………………………35
4.3 壓電材料極化處理………………………………………41
4.4 壓電式微麥克風測試配置………………………………42
4.5 實驗設備……………………………………………………43
第五章 結果與討論………………………………………………47
5.1 振膜模擬…………………………………………………47
5.1.1 靜力模擬分析………………………………………47
5.1.2 振動模態模擬分析…………………………………48
5.2 製程分析……………………………………………………48
5.2.1 氮化矽薄膜沈積……………………………………48
5.2.2 旋鍍壓電溶液的參數………………………………49
5.2.3 鉑下電極的形狀定義………………………………50
5.2.4 矽晶圓背蝕…………………………………………50
5.3 試片外型……………………………………………………51
5.4 壓電式微麥克風量測………………………………………52
第六章 結論與未來展望…………………………………………62
6.1 結論…………………………………………………………62
6.2 未來展望……………………………………………………63
參考文獻……………………………………………………………64

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