臺灣博碩士論文加值系統

本研究之目的為利用噴印金屬化技術，於軟性PET、PI上製備金屬線路圖形。光學等級之PET基材具有透光特性，且成本低廉，是良好之光學應用材料； PI則是具有高平整性以及優良的耐化學性質、耐高溫特性與低膨脹係數，是良好的電子元件基材。研究使用自製奈米鈀金屬觸媒墨水，可透過噴印技術輸出墨水，形成觸媒圖形後，利用觸媒催化活性，透過無電電鍍的方式析鍍沉積鎳金屬，形成金屬圖形。此即為噴印金屬化技術，全程皆以低溫濕式之方式製備金屬圖形，製程成本低廉，優於傳統金屬化方法。
研究過程中探討以矽烷偶合劑作為附著度促進劑，改質PET、PI等軟性基材表面，提升噴印金屬化鍍層之附著性。針對基材之表面改質過程，有別於傳統乾式電漿預處理，本文嘗試以環保型酸洗溶液，作為基材之預處理，以增進矽烷偶合劑與基材間之自組裝反應。實驗中探討不同矽烷耦合劑的濃度、反應時間對基材表面改質程度之影響，並找出最佳表面改質之條件，以提升噴印金屬鍍層之附著度。實驗結果以接觸角測量以及FTIR等檢測基材表面改質程度，歸納最佳的實驗參數。
噴印金屬化製程，在PET以及PI等軟性基材表面，製備金屬鍍層之厚度與附著度，鍍層厚度依不同改質方式PET分別可達到6.1 μm及12.8 μm，且附著能力達到百格膠帶測試規範(ASTM d3359)中的5B等級，電阻率約為6.67 ×10-7 Ωm。PI方面，鍍層厚度依不同改質方式皆可達到3.9 μm，附著能力達到百格膠帶測試規範中的5B等級。研究成果在軟性電子元件之應用上，極具潛力。

Preparation of metal lines or patterns on flexible PET and PI substrates were studied in this thesis. The optical grade PET substrate having light-transmissible property and low cost is a good material for optical applications. PI is a polymer with high smoothness, excellent chemical resistance, high temperature resistance and low coefficient of expansion, which is good for application of the substrates of electronic devices. In this thesis, our typical catalytic ink containing palladium (Pd) nano-particles was used to print lines or patterns on the PET and PI substrates with ink-jet printing. These substrates were then electroless plated with nickel (Ni) to form metallic lines or patterns. Since the whole process was completed at lower temperature and was low cost, it is superior to the traditional method of metallization on nonconductive substrates.
Using silane as the coupling agent to modify PET and PI substrates and increase their adhesion with plated Ni layer was studied. In contrast to the traditional dry plasma pretreatment, this study attempts to use environment-friendly pickling solution to do the pre-processing of the substrate to improve the self-assembly reaction between silane coupling agent and substrate. The influence of process parameters such as the concentration of silane coupling agent and the reaction time on the degree of surface modification of the substrate was evaluated to find the optimal process parameters for the best adhesion between metallic pattern and substrate. The silane-modified surface of substrates were analyzed with contact angle measurements and FTIR spectroscopy to evaluated their modification effect.
The results show that our typical ink-jet printing and electroless plating process can successfully deposit 6.1 μm and 12.8 μm Ni layer on PET substrates respectively according to different ways of PET modification. The adhesion between Ni layer and substrate passed the 5B degree of ASTM-d3359 test. The resistivity of the deposited Ni film was about 6.67 × 10-7 Ωm. As for the PI substrates, the deposited Ni layer can achieve 3.9 μm for different modification methods. The adhesion between Ni layer and substrate also passed the 5B degree of ASTM-d3359 test. These results indicate that the metallic patterns fabricated with our typical ink-jet printing and electroless plating method has potential for the application of flexible electronic devices.

致謝 i
摘要 ii
Abstract iii
目錄 v
1. 前言 1
1.1 軟性印刷電路板 1
1.2 噴墨技術在印刷電路板中之應用 5
1.3 研究動機 6
1.4 研究目的 8
2. 文獻回顧 10
2.1 噴印技術發展 10
2.2 金屬化觸媒墨水 16
2.3 無電鍍技術 18
2.4 自組裝法改質技術(Self-assembly) 20
2.5 濕式化學蝕刻(Wet Chemical Etching) 23
3. 實驗 25
3.1 實驗藥品與設備 25
3.1.1 實驗藥品 25
3.1.2 實驗設備 26
3.1.3 檢測方法 26
3.2 實驗流程 31
3.2.1 製備奈米鈀觸媒墨水 31
3.2.2 基材表面改質處理 32
3.2.3 噴印奈米鈀觸媒墨水 34
3.2.4 無電鍍金屬化實驗 35
4. 結果與討論 37
4.1 PET表面金屬化 37
4.1.1 聚電解質(PDDA)前處理 38
4.1.2 矽烷偶合劑前處理 50
4.2 PI表面金屬化 54
4.2.1 聚電解質(PDDA)前處理 56
4.2.2 矽烷偶合劑前處理 63
5. 結論 67
6. 參考文獻 68

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