臺灣博碩士論文加值系統

利用先前發表的聚芳香醚(P1)透過三種合成進行改質，且具有低介電常數的特性，P1的苯酚部分进行。首先，將P1的苯酚部分用醋酸酐進行酯化，並將其產物利用不同的商業環氧樹脂進行固化，由於其活性酯基降低的固化物的極性，使得材料的介電常數下降，但其熱性質也降低。
接下來將P1與甲基丙烯酸酐進行酯化，並將其產物利用不同的商業環氧樹脂進行固化。此外，甲基丙烯酸基團透過升溫固化交聯將其降低介電常數，且有不錯的熱性質
第三部分P1的苯酚部分透過4-氯甲基苯乙烯進行改質以形成具有苯乙烯型末段的聚合物，將其進行固化，其擁有最優異的熱性質且不錯的介電性質。

To prepare materials with low dielectric constant, three synthetic approaches were performed by modifying the phenol moiety of phosphinated poly(aryl ether), P1. First, the phenol moiety of P1 was esterified with acetic anhydride. The product was cured with various commercial epoxy resins by the active ester moiety. The polarity of thermosets were decreased so that the dielectric constant of materials were decreased. But the thermal properties were also decreased.
The esterification of P1 was performed with methacrylic anhydride in the second approach. The product was also cured with various commercial epoxy resins by the active ester moiety. Furthermore, the methacrylic moiety would crosslink by the curing procedure. The dielectric constant of thermosets were reduced without sacrificing too much in glass transition temperature (Tg).
The phenol moiety of P1 was also modified by 4-chloromethylstyrene in this research to form a polymer with styrene-type terminals. The self-polymerization of this product was carried out by thermal curing. Thermoset products exhibits the best thermal and dielectric properties.

摘要 i
Abstract ii
第一章 緒論 1
第二章 文獻回顧 2
2.1環氧樹脂於電路板材應用之發展 2
2.1.1環氧樹脂硬化劑 3
磷系環氧樹脂硬化劑 4
2.2芳香族聚醚高分子簡介 8
具活性官能基聚醚高分子 8
2.3低介電常數材料 11
研究動機 18
第三章 實驗 19
3.1藥品及溶劑 19
3.2 儀器設備 21
3.3化合物合成 25
3.1.1 BPA-PEEK 合成 25
3.1.2 P1 合成 26
3.1.3 P1-act 合成 27
3.1.4 P1-mma 合成 28
3.1.5 P1-sty 合成 29
3.4薄膜製備 30
3.4.1 P1-act固化物 30
3.4.2 P1-mma固化物 30
3.4.3 P1-sty固化物 31
第四章 結構鑑定與分析 32
4.1 P1-act 光譜鑑定與分析 32
4.1.1 1H-NMR 光譜鑑定 32
4.1.2 FT-IR 光譜鑑定 33
4.2 P1-mma 光譜鑑定與分析 34
4.2.1 1H-NMR 光譜鑑定 34
4.3.2 FT-IR 光譜鑑定 35
4.3 P1-sty 光譜鑑定與分析 36
4.3.1 1H-NMR 光譜鑑定 36
4.3.2 FT-IR 光譜鑑定 37
第五章 結果與討論 38
5.1化合物的合成與固化探討 38
5.1.1 P1-act 38
5.1.1 P1-mma 43
5.1.3 P1-sty 46
5.2 熱性質分析 47
5.2.1 P1-act 47
酯化前後與環氧樹脂固化後之熱性質探討 47
固化時間之熱性質探討 47
5.2.2 P1-mma 50
5.2.3 P1-sty 52
P1-sty在不同固化環境下的DMA分析 52
5.3 熱穩定性分析 55
5.3.1 P1-act 55
5.3.2 P1-mma 57
5.3.3 P1-sty 59
5.4 介電性質分析 61
5.4.1 P1-act 61
5.4.2 P1-mma 63
5.4.3 P1-sty 65
第六章 結論 66
第七章 參考資料 67

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