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研究生:陳羽綺
研究生(外文):Yu-Chi Chen
論文名稱:含矽氧烷基高分子之奈米貴金屬觸媒墨水製備與應用
論文名稱(外文):Preparation and Application of Alkyl Silicone Polymer Noble Metal Nanoparticle Catalyst Ink
指導教授:葛明德葛明德引用關係張章平
指導教授(外文):Ming-Der GerChang-Pin Chang
口試委員:楊勝俊曾俊傑劉益銘葛明德張章平
口試委員(外文):Sheng-Jyun YangChun-Chieh TsengYih-Ming LiuMing-Der GerChang-Pin Chang
口試日期:2014-07-08
學位類別:碩士
校院名稱:國防大學理工學院
系所名稱:化學工程碩士班
學門:工程學門
學類:化學工程學類
論文種類:學術論文
論文出版年:2014
畢業學年度:102
語文別:中文
論文頁數:92
中文關鍵詞:矽氧烷基
外文關鍵詞:Oxysilane
相關次數:
  • 被引用被引用:3
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本研究使用苯乙烯(Styrene)單體、γ-甲基丙烯酰氧基丙基三甲氧基矽烷(MPS)單體,經由自由基聚合反應(Free-Radical Polymerization)合成出具矽氧烷基之寡分子共聚物,再利用共聚物官能基自身還原反應,製備出穩定分散之奈米鈀貴金屬粒子,形成高分子/奈米金屬複合材料,稱為[poly(St-co-MPS)/Pd]觸媒墨水。由於矽氧烷化合物具有自身縮合以及與羥基反應鍵結之能力,可藉此增加墨水於基材之附著力,並利用鈀金屬觸媒之催化能力,藉以無電電鍍方式,在基材上製備出高連續性之導電金屬鍍層。合成之寡聚物可藉由霍氏紅外線光譜儀(FT-IR)、故態核磁共振儀(13C-NMR、29Si-NMR)分析檢定分子結構分析與鍵結官能基改變的狀況,GPC測量分子量大小,並利用穿透式電子顯微鏡(TEM),觀察共聚寡分子還原金屬後的型態與微分散狀況,再以奈米粒子穩定性分析儀(LUM)觀察其穩定性。
將觸媒墨水塗佈於玻璃基材上進行無電鍍金屬化,藉由不同烘烤之溫度觀察矽氧烷與玻璃基材鍵結程度,並以光電子能譜儀(XPS)鑑定分析,並浸泡不同pH值水溶液進行交聯反應,藉此提升墨水與基材之附著力,最後可於基材上製備出鍍層厚度高達8.51 μm,經由百格測試可達5 B之等級。
應用部分利用最佳參數之觸媒墨水與新穎之噴印技術作結合,直接將觸媒墨水噴印在玻璃機殼基材上,來製備手機WWAN天線,再透過觸媒活化後,即以無電電鍍方式,成形金屬圖案於玻璃基材上,製備應用金屬元件,利用天線規範訊號之反射損失(Return Loss,RL)來測量訊號,結果發現在特殊頻率1.0-2.0 GHz之間,反射損失在低於-10 dB之頻帶出現,表示該天線得以運作。

In this study, the preparation of St-co-MPS copolymer with both styrene(St) monomer and γ-methacryloxypropyltrimethoxysilane (γ-MPS) monomer by free radical polymerization. Poly(St-co-MPS)/Pd was prepared via self-reduction of palladium ions by St-co-MPS oligomer without using any reducing agent or surfactant. It was shown that Pd was reduced by the chain-end sulfate groups of styrene when copolymer reacted with the metallic ions. These St-co-MPS copolymer was characterized by 13C-NMR, 29Si-NMR and FTIR to confirm polymer composition and quantity sulfonation, and those self-assembly polymer-metal nanocomposites were characterized by electron microscopy (TEM), observe the stability of LU Misizer(LUM).
The Poly(St-co-MPS)/Pd used as ink for catalytic pattern of glasses, which allows to from the metallic pattern by electroless deposition. The cross-linking extend of Poly(St-co-MPS)/Pd ink and glasses dipping with different pH condition was characterized by X-ray photoelectron spectroscope(XPS) to enhance the adhesion of the Poly(St-co-MPS)/Pd ink and glass substrate. The pattern thickness of Ni layer about 8.51 μm.
Finally, we used Inkjet printing metallization process has been used in the fabricated of mobile antenna on special glass case, The WWAN five band antenna was made on the new glass case substrate by the printing of the catalyst activation and electroless plating forming the metal pattern. It will simplify the institutions of the antenna, and resolve the configuration problems of the limited space in the mobile phone's.

誌謝 ii
摘要 iii
Abstract iv
目錄 v
表目錄 vii
圖目錄 viii
1. 緒論 1
1.1前言 1
1.2研究動機 3
1.3研究目的 3
2. 文獻回顧 5
2.1矽氧烷化合物 5
2.2高分子還原奈米金屬粒子 11
2.3印刷金屬化墨水 18
2.4無電電鍍原理 20
3. 實驗 28
3.1實驗流程及參數 28
3.1.1苯乙烯-矽氧烷共聚寡分子之合成 28
3.1.2苯乙烯-矽氧烷共聚寡分子還原貴金屬奈米粒子 30
3.1.3聚矽氧烷觸墨水分析與鍵定 31
3.1.4聚矽氧烷觸媒墨水無電電鍍金屬化實驗 33
3.1.5聚矽氧烷觸媒墨水製備天線 34
3.2 實驗藥品與設備 35
3.2.1 實驗藥品 35
3.2.2 實驗設備 36
3.2.3 檢測方式 37
4. 結果與討論 41
4.1 Poly(St-co-MPS)寡分子之合成與還原貴金屬奈米粒子 41
4.1.1 Poly(St-co-MPS)寡分子之製備與鑑定 41
4.1.2 poly(St-co-MPS)寡分子還原貴金屬奈米粒子之探討 51
4.2金屬化製程參數對鍍層附著度之影響 57
4.2.1烘烤溫度影響基材與高分子鍵結程度之影響 57
4.2.2環境pH值對高分子交聯反應之影響 64
4.3墨水應用於金屬天線之研究 76
5. 結論 82
參考文獻 83
自傳 91



[1]Cheng, K., Yang, M. H., Chiu, W. W., Huang, C. Y., Chang, J., Ying, T. F., and Yang, Y.,“Ink-jet Printing, Self-Assembled Polyelectrolytes, and Electroless Plating : Low Cost Fabbrication on Circuits on aFlexible Substrate at Room Temperature,” Macromolecular Rapid Commumications., Vol. 26, pp. 247-264, 2005.
[2]Shah, P., Kevrekidis, Y., and Benziger, J., “Ink-jet Printing of Catalyst Patterns for Electroless Metal Deposition,” Langmuir, Vol. 15, pp. 1584-1587, 1999.
[3]Busato, S., Belloli, A., and Ermanni, P.,“Inkjet Printing of Palladium Catalyst Patterns on Polyimide Film for Electroless Copper Plating,”Sensors and Actuators B, Vol.123, pp. 840-846, 2007.
[4]李光亮,有機矽高分子化學,科學出版社,第1-3頁.
[5]張豐志,應用高分子手冊,五南圖書出版股份有限公司,第89-91頁
[6]Clarson, S. J., and Semlyen, J. A., Siloxane Polymers, PRT Prentice Hall , New Jersey, pp. 1-40, 1993.
[7]黃明宏,“聚二鉀基矽氧烷應用於可撓液晶顯示器的研究”,碩士論文,國立中山大學光電工程研究所,高雄,第1頁,1997.
[8]Farhood, N., Mohammad, N., and Sarbolouki,“Polymer Communication: Preparation of Biodegradable Poly[(dimethyldichlorosilane)-alt- (fumaricacid/sebacic acid)]-co-PEG Block Copolymer,”Polymer , Vol.43, pp. 6363–6368, 2002.
[9]Wang, X. L., Oh, I. K., and Xu, L., “Electro-Active Artificial Muscle Based on Irradiation-Crosslinked Sulfonated Poly(styrene-ran-ethylene) ,”Sensors and Actuators B, Vol. 145, pp. 635-642, 2010.
[10]Mimura, S., Naito, H., Kanemitsu, Y., Matsukawa, K., and Inoue, H.,“Optical Properties of Organic–Inorganic Hybrid Thin Films Containing Polysilane Segments Prepared from Polysilane–Methacrylate Copolymers,”Journal of Organometallic Chemistry, Vol. 611 ,pp. 40-44, 2000.
[11]Hu, H. R. Brown, J. T. Koberstein, R. Bhatia, J. Lingelser, and Y. Gallot.,“Adhesion Enhancement of Polymer Blend Interfaces by Reactive Block Copolymer Brushes,”C. R. Chimie, Vol. 9, pp. 45-59, 2006.
[12]Zhang, S., Zhou, S., Weng, Y., and Wu, L., “Synthesis of Silanol-Functionalized Latex Nanoparticles through Miniemulsion Copolymerization of Styrene and 3-Methacryloxypropyltrimethoxysilane,”Langmuir , Vol. 22, pp. 4674-4679, 2006.
[13]Yuen, S., Ma, C. M., Chiang, C., Chang, J., Huang, S., Chen, S., Chuang, C., Yang, C., and Wei, M.,“Silane-Modified MWCNT/PMMA Composites-Preparation, Electrical Resistivity, Thermal Conductivity and Thermal Stability,” Composites: Part A ,Vol. 38, pp. 2527-2535, 2007.
[14] Wu, Y., Wu, C., Xu, T., Yu, F., and Fu, Y.,“Novel Anion-Exchange Organic-Inorganic Hybrid Membranes: Preparation and Characterizations for Potential Use in Fuel Cells,”Journal of Membrane Science, Vol. 321, pp. 299-308, 2008.
[15] Pantoja, M., Diaz-Benito, B., Vwlasco, F., Abenojar, J., and Real, J. C.,“Analysis of Hydrolysis Process of r-Methacryloxypropyltrimethoxysilane and its Influence on the Formation of Silane Coatings on 6063 Aluminum Alloy ,” Applied Surface Science , Vol. 255 ,pp. 6386-639, 2009.
[16]Gao, L., Zhang, K., and Chen, Y.,“Functionalization of Shaped Polymeric Nanoobjects Via Bulk Co-Self-Assembling Gelable Block Copolymers with Silane Coupling Agents ,” Polymer , Vol. 52 ,pp. 3681-3686, 2011.
[17] 郭清癸、黃俊傑、牟中原,“金屬粒子的製造”,物理雙月刊,第23卷,第6期,12月,2001。
[18]Mafuné, F., Kohno, J.Y., Takeda, Y., Kondow, T., and Sawabe, H.,“Structure and Stability of Silver Nanoparticles in Aqueous Solution Produced by Laser Ablation,” J. Phys. Chem. B ,Vol. 104, pp. 8333-8337, 2000.
[19]Mafuné, F., Kohno, J. Y., Takeda, Y., Kondow, T., and Sawabe, H.,“Formation and Size Control of Silver Nanoparticles by Laser Ablation in Aqueous Solution,” J. Phys. Chem. B, Vol. 104, pp. 9111-9117, 2000.
[20]Mafuné, F., Kohno, J. Y., Takeda, Y., Kondow, T., and Sawabe, H.,“Formation of Gold Nanoparticles by Laser Ablation in Aqueous Solution of Surfactant,”J. Phys. Chem. B, Vol. 105, pp. 5114-5120, 2001.
[21]Chen, Y. H., and Yeh, C. S.,“Laser Ablation Method:Use of Surfactants to form the Dispersed Ag Nanoparticles,”Colloids andSurfaces A:Physicochemical and Engineering Aapects,Vol. 197, pp. 133-139, 2002.
[22]Gondal, M. A., Yawfik, Saleh, A., and Drmosh, Q.A.,“Synthesis of Nickel Oxide Nanoparticles Using Pulsed Laser Ablation in Liquids and Their Optical Characterization,”Applied Surface Science , Vol. 258, pp. 6982-6986, 2012.
[23]Mottaghi, N., Ranjbar, M., Farrokhpour, H., Khoshouei, M., Kameli, P., Salamati, H., Tabrizchi, M., and Jalilian-Nosrati, M.,“Ag/Pd-Shell Nanoparticles by A Successive Method:Pulsed Laser Ablation of Ag in Water and Reduction of PdCl2,”Applied Surface Science, Vol. 292, pp. 892-897, 2014.
[24]Yu, L., Lv, Y., Zhang, X., Zhang, Y., Zou, R., and Zhang, F.,“Vapor-Liquid-Solid Growth Route to ALN Nanowires on Au-Coated Si Substrate by Direct Nitridation of Al Powder,”Journal of Crystal Growth, Vol. 334, pp. 57-61, 2011.
[25]Li, Y., Kim, W., Zhang, Y., Rolandi, M., Wang, D., and Dai, H.,“Growth of Single-Walled Carbon Nanotubes from Discrete Catalytic Nanoparticles of Various Sizes,”J. Phys. Chem. B, Vol. 105, pp. 11424-44431, 2001.
[26]Xu, S., Dong, S., and Wang, E.,“One-Step Polyelectrolyte-Based Route to Well-Dispersed Gold Nanoparticles:Synthesis and Insight,”Materials Chemistry Physics, Vol. 96, pp. 29-33, 2006.
[27]Barmatov, E. B., Pebalj, D. A., and Barmatova, M. V.,“Infuence of Silver Nanpoparticles on the Phase Behavior of Side-Chain Liquid Crystalline Polymers,”Langmuir, Vol. 20, pp. 10868-10871 , 2004.
[28]Santos, I. P., Luis, M., and Marzan, L.,“Formation of PVP-Protected Metal N anoparticles in DMF,”Langmuir, Vol. 18, pp. 2888-2894 , 2002.
[29]Raja, M. V., Yew, C. K., and Abdul, K. R.,“Chemical Reduction Methods for Synthesizing Ag and Al Nanoparticles and Their Respective Nanoalloys,”Materials Science and Engineering B, Vol. 176, pp. 187-203, 2011.
[30]Ko, S. H., Chung, J., Pan, H., and Poulikakos, D.,“Fabrication of Multilayer Passive and Active Electric Components on Polymer Using Inkjet Printing ans Low Temperature Laser Processing,”Sensors and Actuators A, Vol. 134, pp. 161-168, 2007.
[31]Smith, P. J., Shin, D. Y., Stringer, J. E., and Derby, B.,“Direct Ink-Jet Printing and Low Temperature Conversion of Conductive Silver Patterns,”Journal of materials science , Vol. 15, pp. 4153-4158, 2006.
[32]Lee, H., Chou1, K. S., and Huang, K. C.,“Inkjet Printing of Nanosized Silver Colloids,”Nanotechnology, Vol. 16, pp. 2436-2441 , 2005.
[33]Lee, K. J., Jun, B. H., Kim, T. H., and Joung, J., “Direct Synthesis and Inkjetting of Silver Nanocrystals Toward Printed Electronics,”Nanotechnology, Vol.17, pp. 2424-2428, 2006.
[34]Perelaer, J., and Gans, B. J.,“Inkjet Printing and Microwave Sintering of Conductive Silver Tracks,"Adv. Mater, Vol.18, pp. 2101-2104, 2006.
[35]Dearden, A. L., Smith, P. J., Reis, N., Derby, B., and Brien, P.,“A Low Curing Temperature Silver Ink For Use in Ink-Jet Printing and Subsequent Production of Conductive Tracks,”Macromolecular Rapid Communications, Vol. 26, pp. 315-318, 2004.
[36]Wind, J., Spah, R., Kaiser, W., Bohm, G., “Metallic Bipolar Plates for PEM Fuel Cells,” Power Sources, Vol.105, pp.256 , 2002.
[37]Matsumoto, T., Niikura, J., Ohara, H., Uchida, M., Gyoten, H., Hatoh, K., Yasumoto, E., Kanbara, T., Nishida, K., and Sugawara, Y., Europeon Patent, EP1094535, p. 25 , 2001.
[38]Wu, H. C.,“Development of a Mathematical Model for piezoelectric Micro-droplet Ejection and Its Experimental Study,”Ph.D. Dissertation, Department of Materials Science and Engineering , National Cheng Kung, University,Taian, pp.108-110, 2004.
[39]Liu, Z., Su, Y., and Varahramyan, K.,“Inkjet-Printed Silver Conductors Using Silver Nitrate Ink and Their Electrical Contacts with Conducting Polymers,”Thin Solid Films, Vol. 478, pp. 275-279, 2005.
[40]Teng, K. F., Vest, and R. W.,“IEEE Transactions on Components,”Hybrids & Manufacturing Technology, Vol. 11, pp. 3, 1988.
[41]Kawase, T., Sirringhaus, H., Friend, R. H., and Shimoda, T.,“All-Polymer Thin Film Transistors Fabricated by High-Resolution Ink-Jet Printing,”Electron Devices Meeting, IEDM Technical Digest, pp. 623-626, 2000.
[42]Sirringhaus, H., Kawase, T., Friend, R. H., Shimoda, T., Inbasekaran, M., Wu, W., and Woo, E. P.,“High-Resolution Inkjet Printing of All-Polymer Transistor Circuits,”Science, Vol. 290, pp. 2123-2126, 2000.
[43]Liu, Z., Su, Y. and Varahramyan, K., “Inkjet-Printed Silver Conductors Using Silver Nitrate Ink and Their Electrical Contacts with Conducting Polymers,”Thin Solid Films, Vol. 478, pp. 275- 279, 2005.
[44]Mabrook, M. F., Pearson, C., and Petty, M. C.,“An Inkjet-Printed Chemical Fuse,”Journal of Physics: Conference Series, Vol. 15, pp. 39-44, 2005.
[45]江文彥,“導電性高分子的出現與科學上的偶然”,科學發展,359期,11月,第68-71頁,2002。
[46]Gans, B. J. and Schubert, U. S.,“Inkjet Printing of Polymer Micro-Arrays and Libraries: Instrumentation, Requirements, and Perspectives,”Macromol. Rapid Commun, Vol. 24, pp. 659-666, 2003.
[47]Tseng, C. C., Chang, C. P., Yuh, S., Chen, Y. C., and Ger, M. D.,“A novel Method to Produce Pd Nanoparticle Ink for Ink-Jet Printing Technology,”Colloids and Surfaces A: Physicochem. Eng, Vol. 339 , pp. 206-210, 2009.
[48]Tsenga, C. C., Linc, Y. H., Shub, Y. Y., Chen, C. J., and Ger, M. D.,“Synthesis of Vinyl Acetate/Pd Nanocomposites as Activator Ink for Ink-Jet Printing Technology and Electroless Copper Plating,”Journal of the Taiwan Institute of Chemical Engineers , Vol. 42 , pp. 989-995, 2011.
[49]Mofatt Kennedy, R., and Minten, k.,“Growth structures of electroless copper films for printed wiring boards,”J. Vac. Sci. Technol. B,Vol. 9, pp. 735-738, 1991.
[50]陳永甡,“印刷電路板之探討”,電子月刊,第4卷,第1期,第103-116頁,1998。
[51]Lin, C., and Ting, P.,“Selective Electroless Copper for VLSI Interconnection,” Electron Device Letters, Vol. 9, pp. 423 - 425, 1989.
[52]逢板哲爾,“化學反應製造金屬薄膜”, 表面處理工業雜誌,第3期,第25-31
頁,1986年。
[53]Horkans, J.,“A TEM Study of The Effect of Accelerators on Pd-Sn Colloidal Catalysts and on The Initiation of Electroless Cu Deposition on Epoxy,” Journal of The Electrochemical Society, Vol. 134, pp. 300-304, 1987.
[54]曾俊傑,“奈米貴金屬觸媒墨水製備與應用於噴墨列印金屬化製程之研究”,博士論文,國防大學理工學院國防科學研究所,桃園,第24頁,2008。
[55]Dubin, V. M., “Electroless Ni-P Deposition on Silicon with Pd Activation,” J. Electrochem. Soc , Vol. 139, pp. 1289-1294 , 1992.
[56]Jackson, R. L.,“Pd+2/Poly(acrylic acid) Thin Films as Catalysts for Electroless Copper Deposition: Mechanism of Catalyst Formation,” J. Electrochem. Soc, Vol. 137, pp. 95-101, 1990.
[57]蕭文鏡,“利用無電鍍技術結合膜板法製備純鎳金屬奈米管及空心球之研究” ,碩士論文,國立中央大學材料科學與工程研究所,桃園,第2頁,2007。
[58]Smith, S. H.,“Methal Finishing,”Science , Vol.47, pp. 60-75, 1979.
[59]Hexing, L., Haiying, C., Shuzhong, Jianshu, D. Y., and Jing-Fa,D.,“Study on the Crystallization Process of Ni-P Amorphous Alloy, ”Applied Surface Science, Vol . 125, pp.115-119, 1998.
[60]Zhang, B., and Xei, H.,“Effect of alloying elements on the amporphous formation and corrosion resistance of electroless Ni-P based alloys,”Materials Science and Engineering A,Vol.281, pp.286-291, 2000.
[61]Lukes, M. R.,“Plating,”Science , Vol.15, pp. 969, 1964.
[62]Malecki, A., and Micek-Ilnicka, A.,“Electroless Nickel Plating from Acid Bath,”Surface and Coating Technology, Vol. 123, pp. 72-77, 2000.
[63]林彥呈,“光照射對無電鍍銅影響之研究”,碩士論文,中原大學應用物理研究所,桃園,第15-16頁,2006。
[64]Cao, J., Wu, Z., Yanga, J., Li, S., Tanga, H.,and Xiec, G.,“Site-Selective Electroless Plating of Copper on a Poly(ethylene terephthalate) Surface Modified with a Self-Assembled Monolayer,”Colloids and Surfaces A: Physicochem. Eng. Aspects , Vol. 415, pp. 374-379, 2012.
[65]Jie, Y.,“Growth of nickel nanoparticles on an organic self-assembled monolayer template by means of electroless plating,”Colloids and Surfaces A: Physicoch. Eng. Aspects, Vol. 415, pp. 374-379, 2012.
[66]Wu, Z., Ge, S., Zhang, M., Li, W., and Tao, K.,“Synthesis of Nickel Nanoparticles Supported on Metal Oxides Using Electroless Plating: Controlling the Dispersion and Size of Nickel Nanoparticles,”Journal of Colloid and Interface Science, Vol. 330 , pp. 359-366, 2009.
[67]Sua, W., Yaoa, L., Yang, F., Li, P., Chen, J., and Liang, L.,“Electroless Plating of Copper on Surface-Modified Glass Substrate,”Applied Surface Science , Vol. 257 , pp. 8067-8071, 2011.
[68]Zhang, Q., Wu, M., and Zhao, W.,“Electroless Nickel Plating on Hollow Glass Microspheres,”Surface & Coatings Technology, Vol. 192 , pp. 213- 219, 2005.



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