臺灣博碩士論文加值系統

本實驗以無電鍍銅法製備銅密封鍍層光纖。無電鍍銅鍍液成份包含硫酸銅、甲醛、氫氧化鈉、乙二胺四乙酸、亞鐵氰化鉀及2,2'-聯吡啶。實驗製程條件包含：改變鍍液中的甲醛含量以及控制析鍍時間等，並以光學顯微鏡、掃描式電子顯微鏡與原子力顯微鏡，分別觀察銅鍍層光纖的表面狀態、鍍層的膜厚及表面粗度。由光學顯微鏡觀察得知當甲醛含量為 15 mL/L、起始pH值為 12.4 與析鍍溫度為 70 °C 時，析鍍的銅密封鍍層光纖有最平整的表面。於此製程條件下更改析鍍時間，分別製備出膜厚為 41、62、89、127、154、165、206 及 251 nm 的銅密封鍍層光纖。經由原子力顯微鏡的量測得知，當鍍層厚度為 89 nm 時，有最低的表面粗度，其平均粗度 Ra 為 2.78 nm。經由拉伸試驗的量測得知：當鍍層厚度為 89 nm 時，銅密封鍍層光纖有最大的拉伸強度，為 372 MPa 將銅鍍層光纖浸入液態氮一天後，經由光學顯微鏡觀察熱應力誘發的裂孔，發現鍍層厚度為 62 nm 時，銅鍍層光纖表面有最少的裂孔。

In this work, the hermetically copper-coated optical fibers were prepared by electroless plating method. The bath composition of electroless copper includes copper sulfate, formaldehyde, sodium hydroxide, ethylene diamine tetraacetic acid, potassium ferrocyanide and 2,2’-bipyridine. The experimental process includes: changing the concentration of formaldehyde and controlling the plating time. The surface appearance that film thickness and surface roughness of copper coatings were investigated using the optical microscope (OM), scanning electron microscope (SEM) and atomic force microscope (AFM), respectively. The OM observation shows that if the concentration of formaldehyde is 15 mL/L, the initial pH value is 12.4 and the plating temperature is 70°C, the hermetically copper-coated optical fiber has the best smooth surface. Using the above experimental conditions, the copper coatings in a variety of thickness were uniformly deposited on the glass fiber surface by controlling the plating time, and the coating thicknesses of 41, 62, 89, 127, 154, 165, 206 and 251 nm were obtained. The AFM measurement revealed that the copper film thickness of 89 nm has the lowest surface roughness (Ra at 2.78 nm). The copper-coated optical fibers resulted in a maximum tensile strength (372 MPa) as the thickness of Cu-deposits at 89 nm. Optical microscope was used to examine the thermal stress induced voids on the surface of copper coatings after the copper-coated optical fibers immersed in the liquid nitrogen for one day. A minimum number of stress voids was induced on the surface for the copper coatings at 62 nm.

中文摘要 …………………………………………………………… Ⅰ
Abstract ……………………………………………………………… Ⅱ
總 目 錄 ……………………………………………………………… Ⅲ
圖 目 錄 ……………………………………………………………… Ⅵ
表 目 錄 ……………………………………………………………… Ⅸ
第一章 緒論 ………………………………………………………… 1
第二章 實驗原理 …………………………………………………… 11
2. 1 無電鍍 ………………………………………………………… 11
2. 2 無電鍍銅製程之發展 ………………………………………… 11
2. 3 無電鍍銅製程之特性 ………………………………………… 12
2. 4 無電鍍銅製程之前處理 ……………………………………… 12
2. 5 無電鍍銅鍍浴之組成與特性 ………………………………… 13
2. 6 無電鍍銅之化學反應式與反應機制 ………………………… 18
2. 6. 1 化學反應式 ………………………………………………… 18
2. 6. 2 反應機制 …………………………………………………… 19
2. 7 近年來無電鍍銅的發展及應用 ……………………………… 21
2. 8 無電鍍銅於深次微米領域的應用 …………………………… 21
第三章 實驗流程 …………………………………………………… 22
3. 1 試片準備 ……………………………………………………… 23
3. 2 玻璃光纖前處理 ……………………………………………… 23
3. 2. 1 敏化 ………………………………………………………… 23
3. 2. 2 活化 ………………………………………………………… 24
3. 3 銅鍍層光纖製備 ……………………………………………… 25
3. 3. 1 製程條件 …………………………………………………… 26
3. 3. 2 製程條件(一)：改變甲醛含量 …………………………… 27
3. 3. 3 製程條件(二)：改變析鍍時間 …………………………… 27
3. 4 表面型態觀察 ………………………………………………… 27
3. 5 表面粗度量測 ………………………………………………… 28
3. 6 鍍層結構分析 ………………………………………………… 30
3. 7 拉伸強度量測 ………………………………………………… 31
3. 8 低溫環境試驗 ………………………………………………… 32
第四章 結果與討論 ………………………………………………… 34
4. 1 甲醛濃度對於表面型態之影響 ……………………………… 34
4. 2 銅鍍層厚度對於銅鍍層表面型態之影響 …………………… 41
4. 3 銅鍍層厚度對於表面粗度之影響 …………………………… 43
4. 4 銅鍍層厚度對於銅鍍層結構之影響 ………………………… 46
4. 5 銅鍍層厚度對於拉伸強度之影響 …………………………… 47
4. 6 銅鍍層厚度對於溫變之影響 ………………………………… 49
4. 7 銅鍍層厚度對於機械應力及熱應力之影響 ………………… 52
第五章 結論 ………………………………………………………… 58
參考文獻 …………………………………………………………… 60
誌 謝 ……………………………………………………………… 67
作者簡介 …………………………………………………………… 68

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