臺灣博碩士論文加值系統

近年來，應用微波積體電路完成所需的收、發設機是現今微波通訊系統的發展趨勢。它有著精密度高、體積小、重量輕、功率低及成本低等優點。但是微波積體電路的電磁特性相當複雜，影響了收、發設機的性能。通常，在電路設計完成後，仍需經過電磁特性模擬才有利於製成。
本文逕以Yee氏結構的擴散節點進行分析工作，並藉由SPT-TLM之基礎，發展出一套能夠在個人電腦上執行的電腦輔助設計軟體。針對微波積體電路中微帶線電路與封裝(Packaging)等,進行電磁特性的分析，以為日後設計與分析主、被動元件及其S參數的參考。

Recently, the application of microwave integrated circuits (MICs) is the trend for the development of tranceiver in microwave communication systems. It has advantages in accuracy, small volume, light weight, low power, and low cost etc. The electromagnetic characteristics in MICs are complicated, and then limit the performance of tranceivers. Usually, it is necessary to have the EM simulation before the implementation of MICs.
In this thesis, based on sinusoidal pulse train tarnsmission line matrix (SPT-TLM) method, we adopted the Yee-based expanded node to develop the EM simulation program which can be processed in personal computer. In practical, we analyze the electro-magnetic characteristics of the microstrip line circuits and packaging in MICs with the simulator. The results can be applied in analyzing the S parameter of active and passive devices.

1.前言..........................................................................1
1.1.簡介.....................................................................1
1.2.分析方法之回顧................................................2
1.2.1.近似靜態法....................................................2
1.2.2.色散模式法....................................................2
1.2.3.全波分析法....................................................2
1.3.研究動機.............................................................4
2.傳統TLM基本理論.................................................6
2.1.基本原理.............................................................6
2.1.1.惠更斯擴散原理...........................................6
2.1.2.傳輸線原理....................................................8
2.2.傳輸線矩陣法.....................................................8
2.2.1.擴散矩陣.........................................................8
2.2.2.一維傳輸線矩陣法......................................11
2.2.3.二維傳輸線矩陣法......................................13
2.2.4.三維傳輸線矩陣法......................................15
2.2.4.1.三維擴散節點..........................................15
2. 2.4.2.三維非對稱濃縮節點..................................17
2.2.4.3 三維對稱濃縮節點.......................................20
2.3.Yee氏結構的擴散節點之應用........................22
2.3.1.邊界條件的設定...........................................22
2.3.2.運算單元的構建...........................................24
2.4.誤差與剔冗.........................................................26
2.4.1.截斷誤差........................................................26
2.4.2.巨網目誤差....................................................27
2.4.2.1.漸增網目...................................................28
2.4.2.2.外插法.......................................................28
2.4.3.速度誤差........................................................28
2.4.4.排列誤差........................................................30
3.SPT-TLM基本原理.................................................31
3.1.SPT-TLM基本概念............................................31
3.1.1.激發模式........................................................31
3.1.2.響應特性........................................................32
3.1.3.誤差.................................................................32
3.2.離散弦波之條件與限制...................................34
3.2.1.離散數目的設定...........................................34
3.2.2.離散等差量化的限制..................................34
3.2.3.模式中數目的篩選......................................35
3.3.誤差與剔冗........................................................37
3.3.1.離散弦波之模式誤差..................................37
3.3.2.幾何結構誤差...................................................37
3.3.3.遞迴次數誤差...............................................38
4.SPT-TLM之應用.....................................................39
4.1.SPT-TLM與S參數之關係.................................39
4.2.不連續結構之表示式.......................................42
5.模擬與驗證.............................................................47
5.1.激發模態與激發方式.......................................47
5.2.程式流程與工作序列.......................................48
5.3.離散數目的誤差驗證.......................................50
5.4.各種微帶電路之模擬與討論............................66
6.結論..........................................................................81
參考文獻....................................................................82
附錄.............................................................................84
附錄A 非均質與損耗模型......................................85
附錄B 激發模態........................................................88
附錄C 激發方式........................................................92
自傳.............................................................................94

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