臺灣博碩士論文加值系統

本研究目的在藉由改善聚縮醛(POM)的表面性狀，以促進無電解電鍍銅之上鍍性(platability)與鍍層附著強度(adhesive strength)。實驗的進行係使用二組不同的水溶液(鹽酸或硫酸)，在不同的濃度(100-500cc/l)、溫度(20-70C)、以及時間(0-20min)條件下，探討聚縮醛腐蝕後的表面形態對於銅鍍層附著力之影響。其研究結果如下所述︰
在腐蝕過程中，溶液濃度越高，聚縮醛的單位面積重量損失率也隨之增加，亦即反應速率隨著溶液濃度的增加而增加，並且反應速率和溶液濃度符合下列關係式︰
Ln (反應速率) = n  Ln (溶液濃度) + 常數
其中n為濃度指數。
對於濃度指數與溫度的關係而言，濃度指數隨著溫度的增加而呈現S曲線，亦即在溫度20C時，濃度指數數值最低，接著隨著溫度的上升，濃度指數也隨之迅速增加，當溫度繼續上升至70C時，濃度指數的增加速率趨緩，並呈現類似飽和之現象。
此外，在腐蝕過程中，反應速率皆符合阿倫尼亞斯方程式(Arrhenius equation)，其中鹽酸與硫酸的活化能分別為385與650kcal/mol。
在表面性狀方面，聚縮醛表面粗糙鍍(Ra、Rt)的數值隨著腐蝕溶液濃度或溫度的增加而增加，而表面凹孔的產生也隨著溶液濃度或溫度的增加而越趨顯著，當溶液濃度或溫度繼續增加，表面凹孔會形成相互連接的網狀孔穴，也就是說，聚縮醛表面提供鍍層機械投錨(mechanical locking)的位置隨著溶液濃度或溫度的增加而增加。
在鍍層形成和機械性質方面，只有當表面凹孔密度較大時，無電解電鍍後聚縮醛表面才會產生連續的鍍層；而鍍層的附著強度也會因表面網狀孔穴的形成而增加，然而，當凹孔的尺寸過大時，附著強度不再增加或有減小的趨勢。

This research aims to improve the platability and adhesive strength of electroless plating copper on POM by modifying the surface morphology using sulfuric acid or hydrogen chloride solution and various conditions.
It is found:
High concentration of etching solution has an increasing rate on weight loss per unit area of POM in etching process. It means that the reaction rate increases with etchant concentration, and the reaction rate as well as concentration adapt to the following equation:
Ln (rate) = n  Ln (concentration) + constant
Where n is the concentration index.
To the relation of concentration index and temperature, the concentration index increases with temperature and expresses an S-shaped curve. The lowest concentration index happens at temperature 20C. And, the concentration index increases rapidly with raising temperature. Up to temperature 70C, the increasing rate of concentration index gets slowly and approaches to a saturation-like situation.
On the other side, the reaction rate corresponds to Arrhenius equation in etching process. The activation energy of sodium acid and sulfuric acid are 385 and 650 kcal/mole respectively.
In surface morphology, the surface roughness (Ra, Rt) of POM increases with etchant concentration and raising temperature, the surface pits significantly increase as well. As etchant concentration or temperature continuous increasing, the surface pits enlarge and connect to form network tunnels. It also means that higher etchant concentration and raising temperature on POM surface contributes more mechanical locking positions for plating deposit.
To form plating deposit and mechanical properties, only a larger surface pit density of POM can generate a continuous deposit layer in electroless plating. The adhesive strength of deposit increases with the number of network tunnels on POM surface. However, the adhesive strength does not increase or decrease when the pit size keeps growing.

中文摘要…………………………………………………………….. I
英文摘要…………………………………………..……………….. III
總目錄……………………………….. ……………………………...V
圖目錄……………………………………………………………. .VII
表目錄……………………………………………………………. XIII
符號說明………………………………………………………......XIV
壹、 導論………..…………………...………………………………1
1-1 前言………………………………………………………..1
1-2文獻回顧……….………………………………………..…2
1-3研究範疇…………………. …. …. …. …. …. …. …. …...7
貳、 實驗步驟………..…………………………………………….10
2-1電鍍銅製程……………………………………………….10
2-1.1前處理………………………………………………10
2-1.2粗化及粗糙度量測… …………………………….. 11
2-1.3無電鍍銅… ……………………………. …. …. .... 11
2-2 接著強度測試 .………………………..………………...12
2-2.1 接著系統設計……………………………………...12
2-2.1 拉伸測試…………………………………………...12
2-3顯微結構觀察…………………………………………… 13
2-3.1光學顯微鏡觀察….………………………………...13
2-3.2 原子力顯微鏡觀察...………………………………13
2-3.3 掃描式電子顯微鏡觀察………………...…………14
參、 結果與討論…………………………………. ……………….18
3-1硫酸系統之粗化機制…………………………………….19
3-1.1硫酸濃度對粗化的影響……………………………19
3-1.2硫酸溫度對粗化的影響……………………………20
3-1.3時間對粗化的影響…………………………………20
3-2鹽酸系統之粗化機制…………………………………….21
3-2.1鹽酸濃度對粗化的影響……………………………21
3-2.2鹽酸溫度對粗化的影響……………………………21
3-2.3時間對粗化的影響…………………………………22
3-3接著性質………………………………………………….22
3-3.1 POM經粗化後之顯微結構……..…………………22
3-3.2粗糙度對接著強度影響……………………………23
肆、 結論………………………………………………………...…88
伍、 參考文獻…………………………..………………….………92

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