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研究生:馬英豪
研究生(外文):Ying Hao Ma
論文名稱:一個低硬體成本消耗,適用於晶片內單通道每秒三十億筆資料傳輸之匯流排介面電路設計
論文名稱(外文):A low hardware overhead bus circuit design for 3Gbps/ch on-chip data communication
指導教授:蘇朝琴
指導教授(外文):Chau Chin Su
學位類別:碩士
校院名稱:國立交通大學
系所名稱:電機與控制工程系所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2007
畢業學年度:96
語文別:中文
論文頁數:51
中文關鍵詞:最佳化連接線全區域連接線中繼器嵌入式緩衝器最佳化連接線寬度及行距最佳化頻寬
外文關鍵詞:optimizationinterconnectglobal interconnectsrepeaterbuffer insertionoptimal interconnect width and spacingoptimal bandwidth
相關次數:
  • 被引用被引用:0
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  • 下載下載:30
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本論文提出一個使用嵌入式中繼器來降低全區域連接線功率及面積消耗的最佳化理論。為了平衡全區域連接線的頻寬、功率及面積的消耗,利用一個公制的比較表來使得全區域連接線設計可以到達最高的效能。我們可以獲得擁有最高公制比較值的全區域連接線且利用HSPICE比較過後的模組。其模擬結果顯示,在電壓為1.8伏特時,對於傳統的最佳化設計,此公制比較值至少增加了百分之七十五。
在本篇論文中,我們實現了一個在晶片內部傳輸線頻寬為每秒三十億筆資料,傳輸距離為一公分的電路。使用台積電 0.18 m 1P6M CMOS 製程來實現,此全區域傳輸線電路在1.8伏特的電源供應下消耗功率9.2毫瓦。
This thesis proposes an optimal method to reduce the power consumption and area of global interconnects by buffer insertion. In order to balance the bandwidth, the power, and the area, the figure of merit is introduced to guide the design of the global interconnects to achieve high performance. The optimal design is obtained and result is compared with HSPICE simulation. The simulation results show that at 1.8V the figure of merit increases 75% as compared to other conventional design.
To verify the design, a 3Gbps for 10mm long on-chip interconnects has been designed. It is implemented in TSMC 0.18 m 1P6M CMOS process, the global interconnects consume 9.2mW on a 1.8V power supply.
Chapter 1
1.1INTRODUCTION 1
1.2MOTIVATION 2
1.3THESISORGANIZATION 4
Chapter 2
2.1 ELMORE DELAY 5
2.2 EFFECTIVE RESISTANCE 6
2.3 CROSSTLAK EFFECT 8
2.4 OPTIMZATION FOR MINIMUM DELAY 9
2.5 OPTIMZATION FOR POWER DISSIPATION 10
2.6 SUMMARY 12
Chapter 3
3.1 GLOBAL INTERCONNECTS 13
3.2 MODEL PARAMETER 14
3.3 MODEL OF GLOBAL INTERCONNECTS 15
3.4 PERFORMANCE OF GLOBAL INTERCONNECTS 16
3.5 FIGURE OF MERIT FOR OPTIMZATION 22
3.6 OPTIMZATION FLOW 29
3.7 OPTIMAL DESIGN PARAMETER 30
3.8 SUMMARY 31
Chapter 4
4.1 SINGLE INTERCONNECT STRUCTURE 32
4.2 GLOBAL INTERCONNECTS STRUCTURE 34
4.3 GENERATION OF RANDOM DATA 36
4.4 OUTPUT BUFFER 38
4.5 LAYOUT AND SIMULATION 39
4.6 PERFORMANCE COMPARISON 44
4.7 MEASUREMENT CONSIDERATIONS 46
4.8 SUMMARY 47
Chapter 5
5.1 CONCLUSION 48
5.2 FUTURE WORK 49
Bibliogrphy 50
[1]Neil H. E. Weste and David Harrris, A Circuits and Systems perspective, Third Edition.
[2]Xiaoliang Bai and Sujit Dey “High-Level Crosstalk Defect Simulation Methodology for System-on-Chip Interconnects’’ IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, VOL. 23, NO. 9, SEPTEMBER 2004
[3]H. B. Bakoglu, Circuits, Interconnections and Packaging for VLSI. Addision-Wesley,1990.
[4]Kaustav Banerjee, Member, IEEE, and Amit Mehrotra, Member, IEEE “A Power-Optimal Repeater Insertion Methodology for Global Interconnects in Nanometer Designs” IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 49, NO. 11, NOVEMBER 2002
[5]Wei Jin, Philip C. H. Chan, Senior Member, IEEE, and Mansun Chan, Member, IEEE “On the Power Dissipation in Dynamic Threshold Silicon-on-Insulator CMOS Inverter” IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 45, NO. 8, AUGUST 1998
[6]Man Lung Mui, Kaustav Banerjee, Senior Member, IEEE, and Amit Mehrotra, Member, IEEE “A Global Interconnect Optimization Scheme for Nanometer Scale VLSI With Implications for Latency, Bandwidth, and Power Dissipation” IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 51, NO. 2, FEBRUARY 2004
[7]K. Banerjee, A. Mehrotra, A. Sangiovanni-Vincentelli, and C. Hu, “On thermal effects in deep submicron VLSI interconnects,” in Proc. Design Automation Conf., 1999, pp. 885–891.
[8]Xiao-Chun Li, Jun-Fa Mao, Senior Member, IEEE, Hui-Fen Huang, and Ye Liu “Global Interconnect Width and Spacing Optimization for Latency, Bandwidth and Power Dissipation” IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 52, NO. 10, OCTOBER 2005
[9]Min Tang and Jun-Fa Mao “Optimization of Global Interconnects in High Performance VLSI Circuits” Proceedings of the 19th International Conference on VLSI Design (VLSID’06)
[10]HARRY J. M. VEENDRICK “Short-Circuit Dissipation of Static CMOS Circuitry and Its Impact on the Design of Buffer Circuits” IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. SC-19, NO. 4, AUGUST 1984
[11]A.B. Kahng, S. Muddu and E. Sarto, “Tuning Strategies for Global Interconnects in High-Performance Deep Submicron IC’s’’ VLSI Design 10(1), 1999, pp.21-34
[12]Dinesh Pamunuwa, Li-Rong Zheng, and Hannu Tenhunen “Maximizing Throughput Over Parallel Wire Structures in the Deep Submicrometer Regime’’IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, VOL. 11, NO. 2, APRIL 2003
[13]Rizwan Bashirullah, Member, IEEE, Wentai Liu, Senior Member, IEEE, Ralph Cavin III, Fellow, IEEE, and Dale Edwards, Member, IEEE “A 16 Gb/s Adaptive Bandwidth On-Chip Bus Based on Hybrid Current/Voltage Mode Signaling” IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 41, NO. 2, FEBRUARY 2006
[14]Vinita V. Deodhar and Jeffrey A. Davis, Member, IEEE “Optimization of Throughput Performance for Low-Power VLSI Interconnects” IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, VOL. 13, NO. 3, MARCH 2005
[15]Vinita V. Deodhar and Jeffrey A. Davis “Voltage Scaling, Wire Sizing and Repeater Insertion Design Rules for Wave-Pipelined VLSI Global Interconnect Circuits” Proceedings of the Sixth International Symposium on Quality Electronic Design (ISQED’05)
[16]Richard T. Chang, Student Member, IEEE, Niranjan Talwalkar, Student Member, IEEE, C. Patrick Yue, Member, IEEE, and S. Simon Wong, Fellow, IEEE “Near Speed-of-Light Signaling Over On-Chip Electrical Interconnects” IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 38, NO. 5, MAY 2003
[17]Daniël Schinkel, Student Member, IEEE, Eisse Mensink, Student Member, IEEE, Eric A. M. Klumperink, Member, IEEE, Ed (A. J. M.) van Tuijl, and Bram Nauta, Senior Member, IEEE “A 3-Gb/s/ch Transceiver for 10-mm Uninterrupted RC-Limited Global On-Chip Interconnects” IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 41, NO. 1, JANUARY 2006
[18]Joshua Jaeyoung Kang, Jun Young Park and Michael P Flynn “Global High-Speed Signaling in Nanometer CMOS” Asian Solid-State Circuits Conference, 2005 , Page(s):393 – 396, Nov. 2005
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