臺灣博碩士論文加值系統

摘要
隨著半導體工業的發展，使用大尺寸晶圓已經是現今的趨勢，如何能夠了解並運用不穩定手指狀流的產生，並順利將光阻液塗滿晶圓且塗佈均勻，是旋轉塗佈過程中的重點。
本實驗利用實驗結果與數值模擬分析，探討科氏力應用於大尺寸晶圓的塗佈上，對於不穩定手指狀流所產生的影響，發現科氏力雖然對於薄膜的厚度分布並無太大的影響；但是由於製程中科氏力的介入，使得不穩定手指狀流偏向產生匯流的狀況，使得流體的塗佈面積增大，反而利於旋轉塗佈製程。並且探討預塗薄膜應用於旋轉塗佈的影響，發現預塗薄膜對相對黏滯係數較高的流體影響較大，由於表面張力減小的關係，使得相對黏滯係數較高的流體之臨界半徑較晚產生，而且注液時薄膜波前行進速度較未預塗時加快許多，並且沒有停滯的現象，因此晶圓可以很容易的就被塗佈。

Spin coating is utilized widely in the microelectronics industry to form thin uniform films of photoresist, spin-on-glass, polyimide, and low dielectric constant materials on silicon wafers. This coating technique is quick and efficient. But, liquids such as photoresist are very expensive. During coating process, the maximum radius that can be coated is limited by a contact line instability, leading to the formation of rivulets or “fingers” at the leading edge. The onset of fingering instability makes the coating process inefficient and significantly affects whether a wafer can be fully coated. One of the most critical roles for spin coating systems is to properly cast a thin film of photoresist on the surface of a silicon wafer.
In this project, a new spin coating process is proposed to overcome the problem of partially coated especially for large size wafer such as the wafer with diameter 300 mm or even 450 mm. The perwetting spin coating decreases the rotational speed of the wafer, thus preventing the wind shear effect. And experimental results show that coriolis force broadens the width of fingers. We can utilize the results to find a new spin coating technique so that a uniform film can be obtained.

目錄
摘要I
目錄II
表目錄IV
圖目錄V
第一章 緒論1
1-1 前言1
1-2 文獻回顧2
1-3 研究動機7
第二章 實驗設備與方法9
2-1 注液系統簡介9
2-2 真空吸引式晶圓變轉速控制系統簡介10
2-3 影像擷取系統11
2-4 實驗方法12
第三章 實驗結果與討論14
3-1 科氏力對旋轉塗佈的影響14
3-2 預塗薄膜黏滯係數對旋轉塗佈的影響18
第四章 結論22
參考文獻24
附表27
附圖28
表目錄
表 一 實驗流體性質表27
圖目錄
圖 一 可變流率注液系統28
圖 二 真空吸引式晶圓變轉速控制系統29
圖 三 影像擷取分析系統…………………………………………30
圖 四 實驗系統整合示意圖………………………………………31
圖 五 Emslie利用Gaussian initial contour所計算之膜厚對時間與半徑的關係圖……………………………………………...32
圖 六 Emslie利用Slowly-falling initial ontour所計算之膜厚對時間與半徑的關係圖33
圖 七 利用Gaussian initial contour加入科氏力影響所計算之膜厚對時間與半徑的關係圖34
圖 八 利用Slowly-falling initial ontour加入科氏力影響所計算之膜厚對時間與半徑的關係圖35
圖 九 不穩定手指狀流偏向圖36
圖 十 5、50、500cp之數值偏向角度示意圖37
圖 十一 無因次化之Re與θ關係圖38
圖 十二 不穩定手指狀流受到科氏力之影響之情形39
圖 十三 忽略科氏力影響之旋塗過程40
圖 十四 不同預塗薄膜對注液不同黏滯係數矽油之臨界半徑關係圖41
圖 十五 不同預塗薄膜對注液不同黏滯係數矽油之臨界半徑產生時間關係圖42
圖 十六 注液1000cp之矽油在乾表面與預塗100cp、1000cp之波前與時間的關係圖43
圖 十七 注液500cp之矽油在乾表面與預塗100cp、1000cp之波前與時間的關係圖44
圖 十八 注液100cp之矽油在乾表面與預塗100cp、1000cp之波前與時間的關係圖 45
圖 十九 未預塗薄膜與預塗薄膜之不穩定手指狀流之比較46
圖 二十 注液100cp與1000cp在預塗100cp上之變注意速率與臨界半徑之關係圖47
圖 二十一 注液1000cp在預塗100cp與未預塗表面上之變注意速率與臨界半徑之關係圖48
圖 二十二 注液100cp在預塗100cp與未預塗表面上之變注意速率與臨界半徑之關係圖49

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