臺灣博碩士論文加值系統

本論文中，我們以高功率紅外線光源擬似熱源，建立出一套新的熱阻量測系統。此量測系統藉由紅外線熱像儀量測溫度，並求得待測物之熱阻，本論文中以此系統針對各種目前市面上可獲得不同之LED封裝基板做熱阻量測，並與有限元素分析法建立之模型得到理想熱阻值加以比照。另外針對同一製程的基板和晶片不同bonding在基板上之熱阻表現可由實驗結果與模擬結果相互比對以推估不同基板之接面熱阻值。

In this thesis, we used a high power infrared light source to emulate the heat source and built a novel system for thermal resistance measurement. In this system, a thermal camera is used to measure the temperature distribution. With the temperature distribution over the entire sample measured, we can obtain the thermal resistance of the test sample. All commercially available high power LED packages’ thermal resistances were measured based on the system that we constructed. The measurement results were compared with theoretical models which base on the finite element analysis method. Contact thermal resistance can also be estimated by comparing the experimental measurement results with the FEA simulation results. A brief discussion was provided about the contact thermal resistance contributed by different bonding methods which using different bonding material based on the analysis developed.

摘要.............................................................................................................I
Abstract.....................................................................................................II
致謝..........................................................................................................III
第一章 緒論………………………………………………………………1
1.1 前言………………………………………………………….1
1.2 研究動機與目的…………………………………………….3
1.3 論文大綱…………………………………………………….3
第二章 基本理論………………………………………………………...4
2.1 引言………………………………………………………….4
2.2 基本熱傳導原理…………………………………………….5
2.2.1 傳導…………………………………………………..…5
2.2.2 對流……………………………………………..………7
2.2.3 輻射……………………………………………..………7
2.3 熱阻……………………………………………..…………...8
第三章 熱阻量測實驗………………………………………………....10
3.1 實驗架構………………………………………...…………10
3.2 量測結果與討論……………………………………....…...10
第四章 有限元素數值模擬分析與實驗結果討論................................32
4.1 有限元素分析簡介…………………………...………...….32
4.2物件之幾何參數及材料參數……………………….……...33
4.3定義數值模擬之邊界條件……………………………….....38
4.4模擬數值分析與量測結果之比對……………………..…...49
4.5 不同LED封裝bonding接面熱阻之分析…………………59
第五章 結論與未來展望…………………….………………………...65
5.1 結論………………...…………….………………………...65
5.2 未來展望………………………...…………….………...…66
參考文獻……………………………………………………………….67
中英文名詞對照表…………………………………………………….69

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