臺灣博碩士論文加值系統

隨著半導體、微機電等製程技術提升，元件尺寸縮小化，對於製程品質也越來越嚴格，因此需要以非破壞性及非接觸性進行檢測。本文以Nikon Eclipse 50i顯微鏡作為實驗基台，搭配Mirau干涉式物鏡組發展一套結合具顯微鏡放大影像功能及干涉技術的顯微干涉儀，配合相移術或垂直掃描術量測方法，運用於不同的量測應用。以相移術量測方法，來取得測試光與參考光的相位差，進而可求出待測體物的高度值，可應用於量測待測物之平整度及重建三維表面輪廓結構。垂直掃描術量測方法，以白光同調長度短的特性，再結合微調平台之螺旋測微器及驅動PZT推動Mirau物鏡組，提升縱向深度量測範圍，可量測相移術所限制的不連續表面，本文應用於量測透明待測物的厚度及折射率。本文所測量之實驗數據將與HP5529A雙頻雷射量測系統量測數據作比對，以證實此實驗方式之理論及架設的可行性和正確性。

With the improvement of fabrication in the semiconductor and MEMS (Micro-Electro-Mechanical Systems) field and the miniaturization of the device size, the requirement for the processing quality is stricter. Accordingly, it is necessary to conduct non-destructive and untouchable inspection.
The thesis does the research that utilize the microscope Nikon Eclipse 50i as its experimental foundation equipped with the Mirau interference objective set to develop interferometric microscope which has magnifying images function and interference technique. Combined with the phase-shifting measuring method or vertical scanning measuring method, the interferometric microscope can be employed for various applications about measurement.
Phase-shifting measuring method can detect the phase shift of test light and reference light and then figures about the height of tested object can be obtained. It can be used to measure the Roughness of tested object and can rebuild the 3D surface structure of its contour.
Joined the Fine tune platform and driving PZT to propel the Mirau objective set, vertical scanning measuring method which utilize the character of short coherence length white light source can increase the measuring range of vertical depth and measure discontinuous area correctly beyond the limitation of phase shift. The method is applied in this experiment to measure the thickness of the transparent object and its refractive index. the measured statistic in the experiment is compared with the statistic measured by HP5529A dual-frequency laser interferometer to prove the feasibility and correctness on the theory and setup of the experiment method.

中文摘要i
英文摘要ii
誌謝iv
目錄v
表目錄vii
圖目錄viii
第一章 緒論1
1.1 前言1
1.2 研究動機1
1.3 論文架構2
第二章 量測折射率及厚度的方法之文獻探討3
2.1 橢圓偏振儀3
2.2 雷射量測方法5
2.3 Mach-Zehnder干涉儀7
2.4 雙頻雷射干涉儀 9
2.4.1 以雙頻雷射干涉儀量測折射率9
2.5 衍射光柵12
2.6 總結14
第三章 顯微干涉技術15
3.1 干涉原理15
3.1.1 雷射干涉16
3.1.2 白光干涉18
3.2 顯微干涉儀類型 21
3.2.1 Michelson干涉儀21
3.2.2 Linnik干涉儀 21
3.2.3 Mirua干涉儀 22
3.3 顯微干涉儀之量測方法23
3.3.1 移相術23
3.3.2 垂直掃描術25
3.3.3 波長掃描術26
第四章 實驗原理、架設與量測 28
4.1 推論以垂直掃描術量測方法之折射率公式28
4.2 實驗架設31
4.3 實驗量測34
4.3.1 實驗量測步驟 34
第五章 實驗結果與討論37
5.1 正確性實驗驗證結果 37
5.1.1 Mirau顯微干涉儀量測厚度及折射率數據37
5.1.2 實驗驗證方式 37
5.1.3 實驗驗證結果與討論38
5.2 應用性驗證結果39
第六章 結論與未來展望41
參考文獻43

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