|
[1]Visvesh S. Sathe, Srikanth Arekapudi, Alexander Ishii, Charles Ouyang, Marios C. Papaefthymiou and Samuel Naffziger, “Resonant-Clock Design for a Power-Efficient, High-Volume x86-64 Microprocessor,” IEEE Journal of Solid-State Circuits., vol. 48, no. 1, pp. 140-149, Jan. 2013.
[2]Marcelo Brandalero and Antonio Carlos S. Beck, “A Mechanism for Energy-Efficient Reuse of Decoding and Scheduling of x86 Instruction streams,” in Proc. Design, Automation & Test in Europe Conference & Exhibition (DATE)., Lausanne, Switzerland, Mar. 2017, pp. 27-31.
[3]Fern Nee Tan, Sze Geat Pang, Lee Kee Yong and Chee Siong Lee, “Power gating techniques on Platform Controller Hub,” in Proc. IEEE Conference Publications., San Melaka, Feb. 2010, pp. 1-7.
[4]Intel, 575232_KBL_H_PDG_Rev2.0, KBL Platform Design Guide.
[5]Onur Mutlu; Rich Belgard; Thomas R. Gross; Norman R. Jouppi; John L. Hennessy; Steven Przybylski; Chris Rowen; Yale N. Patt; Wen-Mei W. Hwu; Stephen W. Melvin; Michael C. Shebanow; Tse-Yu Yeh; Andy Wolfe, “Common Bonds: MIPS, HPS, Two-Level Branch Prediction, and Compressed Code RISC Processor,” IEEE Computer Society., vol. 36, no. 4, pp. 70-85, Aug. 2016.
[6]Hui Jun Wu, “Kernel Service Protection for Client Security,” IEEE Security & Privacy., vol. 8, no. 5, pp. 14-19, Oct. 2010.
[7]Rafael Rodrigues Machado and Gustavo Maciel Dias Vieira, “UEFI BIOS Accessibility for the Visually Impaired,” in Proc. Computing Systems Engineering (SBESC)., Curitiba, Nov. 2017, pp. 6-10.
[8]H. N. Lin, J. L. Chang, and C. K. Chen, “Radiated EMI Coupling Analysis Between High-Speed Modules and Receiving Antennas of Mobile Devices,” in Proc. 2012 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC 2012)., Singapore, May 2012, pp. 373-376.
[9]Chulsoon Hwang, David Pommerenke, Jun Fan, Takashi Enomoto, Junji Maeshima and Kenji Araki, “Modeling and Estimation of LCD Noise Modulation for Radio Frequency Interference,” IEEE Transactions on Electromagnetic Compatibility., vol. 59, no. 6, pp. 1685-1692, Dec. 2017.
[10]Ping Li and Lijun Jiang, "A novel characterization method of the radiation emission for electromagnetic compatibility," Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on, pp.264-269, Aug. 2011.
[11]Xin Tong, David W. P. Thomas, Angela Nothofer, Phillip Sewell and Christos Christopoulos, “Modeling Electromagnetic Emissions From Printed Circuit Boards in Closed Environments Using Equivalent Dipoles,” IEEE Transactions on Electromagnetic Compatibility., vol. 52, no. 2, pp. 462-470, May 2010.
[12]Jun Wang, Jianmin Lu, Yang Liu, Xiuqin Chu and Yushan Li, “Effective Radii of On-Chip Decoupling Capacitors Under Noise Constraint,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems., vol. 24, no. 12, pp. 3415-3423, Dec. 2016.
[13]Hui-Fen Huang, Qing-Xin Chu and Jian-Kang Xiao, “Microstrip Mismatching Technique for Reducing SSN in High Speed Integrated Circuit,” IEEE Transactions on Components and Packaging Technologies., vol. 31, no. 2, pp. 439-443, Jun. 2008.
[14]Sebastian Müller, Torsten Reuschel, Renato Rimolo-Donadio, Young H. Kwark, Heinz-Dietrich Brüns and Christian Schuster, “Energy-Aware Signal Integrity Analysis for High-Speed PCB Links,” IEEE Transactions on Electromagnetic Compatibility., vol. 57, no. 5, pp. 1226-1234, Oct. 2015.
[15]U. Olgun, C. C. Chen and J. L. Volakis, “Energy-Aware Signal Integrity Analysis for High-Speed PCB Links,” IET Microwaves, Antennas & Propagation., vol. 6, no. 11, pp. 1200-1206, Aug. 2012.
[16]Madhavan Swaminathan and A. Ege Engin, “Power Integrity Modeling and Design for Semiconductors and Systems” Chapter 1, Prentice Hall, 2008.
[17]Yinghao Ye, Domenico Spina, Paolo Manfredi, Dries Vande Ginste and Tom Dhaene, “A Comprehensive and Modular Stochastic Modeling Framework for the Variability-Aware Assessment of Signal Integrity in High-Speed Links,” IEEE Transactions on Electromagnetic Compatibility., vol. 60, no. 2, pp. 456-467, Jul. 2017. [18]Wangxin Huang and Jaber A. Abu Qahouq, “Energy Sharing Control Scheme for State-of-Charge Balancing of Distributed Battery Energy Storage System,” IEEE Transactions on Industrial Electronics., vol. 62, no. 5, pp. 2764-2776, May 2015.
[19]ACPI 6.0 specifications, http://www.uefi.org/sites/default/files/resources/ACPI_6.0.pdf.
[20]Sachin Kumar, Student Member and Michael Pecht, “Baseline Performance of Notebook Computers Under Various Environmental and Usage Conditions for Prognostics,” IEEE Transactions on Components and Packaging Technologies., vol. 32, no. 3, pp. 667-676, Sept. 2009.
[21]Langyuan Wang, Menglian Zhao, Xiaobo Wu, Xiaohan Gong and Liuqing Yang, “Fully Integrated High-Efficiency High Step-Down Ratio DC–DC Buck Converter with Predictive Over-Current Protection Scheme,” IET Power Electronics., vol. 17, no. 14, pp. 1959- 1965, Nov. 2017.
[22]Intel, 543842_SKL_KBL_HS_PAG_Rev1p5, IMVP8 Power Architecture Guide.
[23]Shuyu Zhang, Menglian Zhao, Xiaobo Wu and Haozhou Zhang, “Current-balance method for multi-phase DC–DC buck converters with wide duty ratio applications in both CCM and DCM,” Electronics Letters., vol. 53, no.15, pp. 1062-1074, Jul. 2017.
[24]Intel, 559100_559100_KBL_EDS_Vol_1, KBL External Design Specification.
|