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研究生:郭景宜
論文名稱:三維多層結構結合高性能冷板之即時互動電腦輔助散熱設計
論文名稱(外文):Real-time interactive thermal CAD system for 3-D multilayer strustures with compact cold plates
指導教授:洪英輝
學位類別:碩士
校院名稱:國立清華大學
系所名稱:動力機械工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2003
畢業學年度:91
語文別:中文
論文頁數:231
中文關鍵詞:多層結構平板冷板電腦輔助散熱設計接觸熱阻熱傳表面特性
外文關鍵詞:multilayerCADthermal designcold platecontact resistance
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針對考量多層結構平板間接觸熱阻影響的三維多層結構結合高性能冷板之即時互動電腦輔助散熱設計,本研究成功地在微軟視窗2000工作平台上發展出一套具有親和力的即時3D動態多媒體電腦輔助設計系統。此電腦輔助設計系統之特點,乃在於能處理多層結構平板間接觸熱阻的影響以及任意結構冷板的表面熱傳幾何特性參數。此外,本系統結合OpenGL程式庫,提供使用者一個具有即時3D動態效果的互動式操作介面。
此多媒體電腦輔助設計系統包括前置處理次系統、多層結構冷板的散熱分析次系統、後置處理次系統及相關資料庫,在本論文中簡要的介紹所有相關次系統的基本設計概念與方法。本研究開發出的前置處理次系統擁有極具親和力之彩色視窗介面,能輕易讓一般使用者經由視窗介面設定改良型多層結構冷板散熱設計所需之輸入參數。在主視窗中包含下列五個設計選項供使用者選擇,即(1)離散熱源幾何形狀、位置與發熱量;(2)多層結構體材質、結構體間接觸面的介質與施加壓力;(3)冷板內部結構種類;(4)工作流體種類;(5)環境條件。在前置處理次系統的資料庫中共內建了五十四種散熱片結構相關幾何及熱流特性,十八種多層結構材質特性,四種結構體接觸面介質特性,七種結構體表面加工特性,七種冷板散熱片材質特性及兩種工作流體特性。其中在使用者選取冷板內部結構種類時,可自訂散熱片尺寸而不必侷限於五十四種內建的散熱片。當所需的輸入參數完成後,使用者可以看到整個設計的立體模型,並考量做進一步的修改。在研究中亦成功地建立三維多層結構冷板的散熱次分析系統,此散熱分析能有效考量結構體間接觸熱阻對整體散熱效果的影響。經由此分析軟體計算,能得到冷板外側之多層結構體表面上的溫度分佈數據。此溫度分佈數據可應用本研究中所發展出之後置處理次系統繪出彩色等溫圖於前置處理次系統中建立的立體模型表面上。使用者可以將模型針對x, y, z軸做旋轉或是改變視窗大小來檢視最終結果。因此,在研究中更進一步地整合上述前後置處理次系統、熱分析軟體與資料庫,而完成一套多媒體電腦輔助設計系統。
最後,本研究應用此開發出的多媒體電腦輔助設計軟體從事一系列參數探討與實際應用的設計範例探討,結果皆驗證了本研究中開發出的改良型多層結構冷板電腦輔助設計系統的優越性。

A novel 3-D real-time animated thermal CAD system for electronics multilayer structures having interfacial contact resistances integrated with a compact cold plate has been successfully developed on Microsoft Windows 2000 system. The thermal CAD system is composed of pre-processor subsystem, thermal analyzer, post-processor subsystem and relevant user interfaces and databases. The fundamental design concepts for the developed pre-processor, thermal analyzer, and post-processor are introduced. The developed pre-processor has six options such as the selection of heat sources, multilayer structures, cold-plate core, working fluid, ambient conditions, and current data. The effect of thermal contact resistance between contact solids has been considered in the thermal analyzer. In addition, a new set of curve-fitting correlations related to the dimensionless pumping power factor (F) and heat transfer performance factor (J) have also been installed in the analyzer. The post-processor can interactively generate real-time color isotherms on the heated surface of 3-D cold-plate model. Furthermore, new multimedia technologies with OpenGL libraries, such as graphical illustrations and real-time 3-D visualization, employed in the present developed CAD system provide a very friendly and interactive interface for users. To explore the parameters and conditions influencing thermal performance, a series of parametric studies have been systematically performed. The parameters and conditions explored include the size and heat dissipation rate of heat sources, the first-layer material of multilayer structures, contact conditions between multilayer structures, type of core configuration, coolant properties and type of convection at external ambient. With the developed thermal CAD system, three practical thermal design cases for multilayer structures integrated with a compact cold plate have been studied. The superiority of the developed CAD system has been demonstrated.

摘要
目錄
第一章 緒論
第二章 熱分析軟體之發展
第三章 前置處理系統與後置處理系統
第四章 電腦輔助系統的整合
第五章 結果與討論
第六章 結論與建議
參考文獻

Antonetti, V. W., Whittle, T. D., and Simons, R. E., 1991, “An Approximate Thermal Contact Conductance Correlation,” In Experimental/ Numerical Heat Transfer in Combustion and Phase Change, HTD-Vol.170, ASME, New York, pp.131-134.
Antonetti, V. W., Whittle, T. D., and Simons, R. E., 1993, “An Approximate Thermal Contact Conductance Correlation,” ASME Journal of Electronic Packaging, Vol.115, pp.131-134.
Antonetti, V. W., and Yovanovich, M. M., 1984, “Thermal Contact Resistance in Microelectronic Equipment,” In Thermal Management Concepts in Microelectronic Packaging from Component to System, ISHM Technical Monograph Series 6984-003, pp.135-151.
Barkakati, N, 1990, X Windows System Programming, Howard W. Sams, USA.
Chen, Y. Y., 1996, "Thermal CAD Development for Multilayer PCB Structures with A Multi-Stack Cold Plate," Master's Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan.
Chiou, Y. M., 1994, "Pre-Processor and Post-Processor Development for Multi-Layer Cold Plates with Arbitrary Heating Loads," Master's Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan.
Chun, Y. H., 1993, "A Theoretical Study on Cold-Plate Performance with Arbitrary Heating Loads," Master's Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan.
Ellison, G. N., 1973, "The Effect of Some Composite Structures on the Thermal Resistance of Substrates and Integrated Circuit Chips," IEEE Transactions on Parts, Hybrids, and Packaging, Vol.ED-20, No.3, pp.233-238.
Ellison, G. N., 1976, "The Thermal Design of an LSI Single-Chip Package," IEEE Transactions on Parts, Hybrids, and Packaging, Vol.PHP-12. No.4, pp.371-378.
Ellison, G. N., 1984, Thermal Computations for Electronic Equipment, van Nostrand Reinhold Co., New York.
Foley, J. D., van Dam, A., Feiner, S. K. and Hughes, J. F., 1990, Computer Graphics: Principles and Practice, 2nd ed., Addison-Wesley Publishing Company, Inc., New York.
Hung, Y. H., and Chun, Y. H., 1994, "Thermal Performance Analysis of Cold Plates for Multilayer Structures with Arbitrary Heating Loads," In Heat Transfer in Electronic System, HTD-Vol.292, ASME, New York, pp.137-144.
Kays, W. M., 1960, “Basic Heat Transfer and Flow Friction Characteristics of Six High Performance Heat Transfer Surfaces,” J. Eng. Power, Vol.82, pp.27-32.
Kays, W. M., and London, A. L., 1964/1984, Compact Heat Exchangers, 2nd/3rd ed., McGraw-Hill, New York.
Kern, D. Q., and Kraus, A. D., 1972, Extended Surface Heat Transfer, McGraw-Hill Book Company, New York.
Kraus, A. D., 1961, “Efficiency of the Cold Plate Heat Exchanger,” Proc. Natl. Aeronaut. Electron. Conf., Dayton, Ohio, p.381.
Kraus, A. D., 1962, “Optimization of the Cold Plate Heat Exchanger,” Proc. Natl. Aeronaut. Electron. Conf., Dayton, Ohio, p.78.
Kraus, A. D., 1982, Analysis and Evaluation of Extended Surface Thermal Systems, Hemisphere Publishing Corporation, Washington.
Kraus, A. D., and Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Corporation, Washington.
Kraus, A. D., Chu, R. C., and Bar-Cohen, A., 1982, “Thermal Management of Microelectronics: Past, Present, and Future,” Computers. Mech. Eng., October, pp.69-79.
Kraus, A. D., Snider, A. D., and Doty, L. F., 1978, "An Efficient Algorithm for Evaluating Arrays of Extended Surface," ASME J. Heat Transfer, Vol.100, pp.288-293.
LaHaye, P. G., Neugebauer, F. J., and Sakhuja, R. K., 1974, "A Generalized Prediction of Heat Transfer Surfaces," ASME J. Heat Transfer, Vol.96, pp.511-517.
Lee, C. C., Min, Y. J., and Palisoc A. L., 1989, "A Generation Algorithm for the Inverse Fourier Transform of Four-Layer Infinite Plate Structures," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.12, No.4, pp.710-716.
Lee, C. C., and Palisoc A. L., 1988, "Real-Time Thermal Design of Integrated Circuit Devices," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.11, No.4, pp.485-492.
Lee, D. H. and Pearce, J. A., 1989, "Drawing an Isothermal Contour Map Using a Tree Search Strategy," the 11th Annual International Conference, IEEE Engineering in Medicine & Biology Society, Albany, New York, pp.559-560.
Lindsted, D. R., and Sturty, R., 1972, "Steady-State Junction Temperatures of Semiconductor Chips," IEEE Trans. Electron Device, Vol.ED-19, No.1, pp.41-44.
Ling, F. F., 1958, “On Asperity Distributions of Metallic Surfaces,” Journal of Applied Physics, Vol.29, No.8, August.
Mikic, B. B., and Rohsenow, W. M., 1966, “The Effect of Surface Roughness and Waviness upon the Overall Thermal Contact Resistance,” EPL Rept. No. 79361-43, Massachusetts Institute of Technology, Cambridge, Mass..
Palisoc, A. L., and Lee, C. C., 1988a, "Thermal Properties of the Multilayer Infinite Plate Structure," J. Appl. Phys., Vol.64, pp.410-415.
Palisoc, A. L., and Lee, C. C., 1988b, "Exact Thermal Representation of Multilayer Rectangular Structure by Infinite Plate Structures Using the Method of Image," J. Appl. Phys., Vol.64, pp.6851-6857.
Pieper, R. J., and Kraus, A. D., 1995a, "Cold Plate with Asymmetric Heat Loading Part I - The Single Stack," In Advances in Electronic Packaging, EEP-Vol.10-2, ASME, New York, pp.865-870.
Pieper, R. J., and Kraus, A. D., 1995b, "Cold Plate with Asymmetric Heat Loading Part I - The Double Stack," In Advances in Electronic Packaging, EEP-Vol. 10-2, ASME, New York, pp.871-876.
Wright, S., and Sweet, M., 1999, OpenGL SuperBible 2nd Edition, Waite Group Press, Florida.
Song, S., and Yovanovich, M. M., 1987, “Correlation of Thermal Accommodation Coefficient for Engineering Surfaces”, In Fundamentals of Conduction and Recent Developments in Contact Resistance, ed. by Imber, M. and Peterson, G. P. and Yovanovich, M. M., HTD-Vol.69, ASME, New York, pp.107-116.
Wang, L. S., 1995, "Computer-Aided Design for Multi-Layer Cold Plates," Master's Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan.
Ye, Q. L., 2001, “Multimedia Thermal CAD Package for Multilayer Structures with Compact Cold Plates,” Master's Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan.
Yovanovich, M. M., 1981, “New Contact and Gap Correlations for Conforming Rough Surfaces,” AlAA-81-1164, AlAA 16th Thermophysics Conference, Palo Alto, CA..
Yovanovich, M. M., 1991, “Theory and Applications of Constriction and Spreading Resistance Concepts for Microelectronic Thermal Management,” In Cooling Techniques for Computers, ed. by Aung, W., Hemisphere Publishing Corporation, Washington, pp.277-332.
Yovanovich, M. M., Culham, J. R., and Teertstra, P., 1997, “Calculating Interface Resistance,” Electronics Cooling Magazine, Vol.3, No.2, pp.24-29.

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