臺灣博碩士論文加值系統

本論文敘述IEEE802.11b無線網路卡電路設計與測試，電路組成的元件包含基頻處理器RF3002、中射頻收發器RF2958、功率放大器RF5189、射頻濾波器、射頻切換開關、中頻SAW濾波器及電源穩壓器等元件。無線網路卡電路使用四層PCB電路板佈局，可提供IEEE802.11b規格之1Mbps(DSSS)、2Mbps(DSSS)、5.5Mbps(CCK)及11Mbps(CCK)四種資料速率。軟體方面使用Keil撰寫C語言程式碼，並由USB線下載到微處理器，以控制及協調無線網路卡硬體之間的動作。
論文第一章為導論，簡介IEEE802.11無線區域網路。第二章敘述IEEE 802.11b實體層規格及電路系統設計。第三章敘述電路設計，包含基頻處理器電路、中頻及射頻電路、功率放大器電路、前端電路、電源電路、PHY介面電路、MAC控制電路及鏈路計算。第四章是電路佈局，說明如何將設計的電路，轉化為電路板佈局，以及最後的佈局結果。第五章為電路測試，包含各分項電路測試及發射接收整合測試。第六章則為論文結論。

In this thesis, the design and test of IEEE 802.11b WLAN circuits are described. The circuit blocks consist of baseband processor RF3002, IF and RF transceiver RF2958, power amplifier RF5189, RF filter, RF switches, IF SAW filter and regulators. The circuits are fabricated with four-layer PCB process. The implemented wireless LAN card can provide four kinds of data rates which are 1Mbps(DSSS), 2Mbps(DSSS), 5.5Mbps(CCK), and 11Mbps(CCK) based on IEEE802.11b specification. For the software implementation, the C language code compiled by Keil is downloaded to the microprocessor by the USB interface to control and coordinate the functions between the circuit blocks of WLAN card.
The introduction of IEEE 802.11 WLAN standard is presented in Chapter 1. Chapter 2 describes the specification of the 802.11b WLAN physical layer and circuit system design. The circuit design consisted of baseband processor, IF and RF transceiver, power amplifier, front-end circuit, dc power circuits, PHY interface circuits, MAC control circuits, and link budget are described in Chapter 3. Chapter 4 gives the circuit layout to realize the designed circuit on a four layer PCB. Chapter 5 describes the test results of each circuit and demonstrates the data transmitting and receiving of the developed WLAN cards. Finally, the conclusion is given in the Chapter 6.

誌謝..............................................................I
摘要..............................................................II
Abastract.........................................................III

第一章 導論......................................................1
1.1 IEEE802.11無線區域網路簡介................................1
1.2 章節介紹..................................................3

第二章 IEEE 802.11b實體層規格及電路系統設計......................4
2.1 實體層規格................................................4
2.1.1 頻率範圍與頻道分配........................................4
2.1.2 封包格式..................................................5
2.1.3 攪碼器與解攪碼器..........................................8
2.1.4 調變技術..................................................10
2.1.4.1 直接序列展頻概念..........................................10
2.1.4.2 使用於1Mbps及2Mbps傳輸速率之直序展頻調變規格..............11
2.1.4.3 使用於5.5Mbps及11Mbps傳輸速率之互補碼調變規格.............15
2.1.5 發射規格..................................................19
2.1.5.1 最高幅射功率..............................................19
2.1.5.2 輸出頻譜遮罩..............................................20
2.1.5.3 輸出載波抑制..............................................20
2.1.5.4 調變準確度................................................21
2.1.6 接收規格..................................................22
2.1.6.1 接收靈敏度................................................22
2.1.6.2 最大接收功率..............................................23
2.2 電路系統設計..............................................23
2.2.1 傳收電路架構..............................................23
2.2.1.1 傳統超外差式架構..........................................24
2.2.1.2 使用鏡像抑制混頻器之超外差式架構..........................25
2.2.1.3 直接轉換架構..............................................26
2.2.2 電路系統架構..............................................27
2.2.2.1 發射路徑..........................................29
2.2.2.2 接收路徑..................................................29

第三章 電路設計..................................................31
3.1 基頻處理器電路............................................31
3.1.1 RF3002內部電路說明........................................31
3.1.2 RF3002電氣規格............................................35
3.1.3 RF3002發射與接收控制方式..................................37
3.1.3.1 暫存器控制................................................37
3.1.3.2 發射控制..................................................38
3.1.3.3 接收控制..................................................39
3.1.4 RF3002對中射頻接收電路之天線分集選擇及自動增益控制演算法..40
3.1.5 RF3002淨空通道評估........................................42
3.1.6 電路設計..................................................43
3.2 中頻及射頻電路............................................44
3.2.1 RF2958內部電路說明........................................44
3.2.2 RF2958電氣規格............................................47
3.2.3 R2958發射與接收控制方式...................................50
3.2.4 SAW濾波器電氣規格.........................................52
3.2.5 電路設計..................................................53
3.3 功率放大器電路............................................54
3.3.1 RF5189內部電路說明........................................54
3.3.2 RF5189電氣規格............................................55
3.3.3 功率偵測用之類比數位轉換器................................55
3.3.4 電路設計..................................................57
3.4 前端電路..................................................58
3.4.1 切換開關..................................................58
3.4.2 射頻濾波器................................................59
3.4.3 電路設計..................................................60
3.5 電源電路..................................................60
3.6 實體層介面電路............................................62
3.7 媒介存取控制層控制電路....................................63
3.7.1 記憶體電路................................................64
3.7.2 微處理器Cypress CY7C64613介紹及輸入/輸出規劃..............65
3.7.3 微處理器Cypress CY7C68013介紹及輸入/輸出規劃..............67
3.8 鏈路計算..................................................68
3.8.1 發射鏈路..................................................68
3.8.2 接收鏈路..................................................69
3.8.2.1 靈敏度....................................................70
3.8.2.2 鏡像抑制能力..............................................71

第四章 電路佈局..................................................72
4.1 電路板分層結構................................................72
4.2 佈局結果......................................................73
4.2.1 上層......................................................73
4.2.2 第二層....................................................75
4.2.3 第三層....................................................76
4.2.4 下層......................................................77

第五章 電路測試..................................................79
5.1 基頻電路測試..............................................79
5.1.1 發射......................................................80
5.1.2 接收......................................................86
5.2 中頻及射頻電路測試........................................95
5.2.1 發射..............................................95
5.2.2 接收..............................................100
5.3 功率放大器電路測試........................................103
5.4 前端電路測試..............................................107
5.4.1 發射......................................................108
5.4.2 接收......................................................110
5.5 發射電路整合測試..........................................111
5.6 接收電路整合測試..........................................114

第六章 結論......................................................118

參考資料..........................................................120

附錄一：RFMD 基頻處理器RF3002規格.................................122
附錄二：RFMD 中頻及射頻RF2958規格.................................148
附錄三：RFMD 功率放大器RF5189規格.................................166
附錄四：SAWTEK SAW濾波器856278規格................................174
附錄五：TI 類比數位轉換器ADS7827規格..............................179
附錄六：Skyworks切換開關AS179-92規格..............................198
附錄七：Soshin射頻濾波器MDR642E規格...............................201
附錄八：TI FIFO記憶體SN74V263規格.................................203
附錄九：Cypress微處理器CY7C64613規格..............................220
附錄十：Cypress微處理器CY7C68013規格..............................247
附錄十一：控制程式................................................283

[1]邵喻美,潘育群, “電腦網路”, 東華, 2003.
[2]M. S.Gast, “802.11 Wireless Network : The Definitive Guide”‚ O’Reilly, 2003.
[3]IEEE Standard 802.11b, “Higher-Speed Physical Layer Extension in the 2.4 GHz Band”, 1999.
[4]趙軒慶, “IEEE802.11b基頻傳送器與接收框架器之製作”, 碩士論文, 中興大學, 2003.
[5]莊登凱, “高速無線區域網路基頻處理器之設計與製作”, 碩士論文, 台灣大學, 1999.
[6]Intersil corporation, “HFA3861B Direct Sequence Spread Spectrum Baseband Processor” , 2002.
[7]Simon Haykin, “Communication System”, Wiley, 1994.
[8]B. Razavi, “RF Microelectronics”, Prentice Hall, 1998.
[9]何俊慶, “以0.18um CMOS積體電路技術研製5.2GHz鏡像抑制混頻器”, 碩士論文, 元智大學, 2002.
[10]RFMD Micro Device, “RF3002 Spread-Spectrum Baseband Modem”, 2004.
[11]張義和, “例說DXP 2004”, 新文京, 2004.
[12]RFMD Micro Device, “RF2958 2.4GHz Spread-Spectrum Transceiver”, 2004.
[13]SAWTEK, “856278 374MHz SAW Filter”, 2003.
[14]RFMD Micro Device, “RF5189 3V, 2.45GHz Linear Power Amplifier”, 2004.
[15]Texas Instruments, ”10/8/12-Bit High Speed 2.7 V Analog-To-Digital converter”, 2003.
[16]Skyworks, “AS179-92 PHEMT GaAs IC SPDT Switch DC–3 GHz”, 2000.
[17]SOSHIN, “MDR642E 2.45GHz BPF for Wireless LAN & Bluetooth”, 2003.
[18]Intersil corporation, “Tutorial on Basic Link Budget Analysis”, 1998.
[19]Mark I. Montrose, “EMC and the Printed Circuit Board Design, Theory, and Layout Made Simple”, Wiley, 1999.
[20]Mark D. Heerema, “Designing for Electromagnetic Compatibility”, Hewlett-Packard, 1997.
[21]陳揚文, “2.4GHz無線網路卡射頻電路設計與測試”, 碩士論文, 台灣大學, 2004.
[22]Stephen H. Hall, “High-Speed Digital System Design, A Handbook of Interconnect Theory and Design Practices”, Wiley, 2000.
[23]Ralph Morrison, “Grounding and Shielding Techniques”, Wiley, 1998.
[24]Agilent Technologies, “E4438C Vector Signal Generator Documentation”, September 2002.