跳到主要內容

臺灣博碩士論文加值系統

(216.73.216.42) 您好!臺灣時間:2025/10/01 16:53
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果 :::

詳目顯示

: 
twitterline
研究生:李佳霖
研究生(外文):Chia-lin lee
論文名稱:鑽石磨棒高速磨削氧化鋁陶瓷之研究
論文名稱(外文):A study of high speed grinding alumina ceramic for diamond tools
指導教授:羅勝益羅勝益引用關係
指導教授(外文):Shenq-Yih Luo
學位類別:碩士
校院名稱:華梵大學
系所名稱:機電工程學系博碩專班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2009
畢業學年度:97
語文別:中文
論文頁數:113
中文關鍵詞:鑽石磨棒氧化鋁陶瓷磨削壓力磨削
外文關鍵詞:Diamond toolAluminaGrindingPressure grinding
相關次數:
  • 被引用被引用:7
  • 點閱點閱:921
  • 評分評分:
  • 下載下載:133
  • 收藏至我的研究室書目清單書目收藏:0
本研究目的在探討使用小直徑鑽石磨棒高速粗磨削與細磨削氧化鋁陶瓷,分析磨削條件對鑽石磨耗、磨削力與表面粗糙度的影響,實驗分成四部分: (1)電鑄鑽石和金屬燒結鑽石的磨棒,鑽石粒號為#270/325,使用工具顯微鏡和SEM觀察磨削過程中,磨棒鑽石磨耗情況,將磨削前後之鑽石顆粒磨耗種類量化,並探討磨削正向力及工件表面粗糙度等。實驗結果以燒結鑽石磨棒較適於長時間磨削氧化鋁陶瓷,相對地,電鑄鑽石磨棒在較低進給與較低主軸轉速下用於較短時間磨削。(2)粗磨部份,用金屬燒結鑽石磨棒,鑽石粒號為#80/100,以較低主軸轉速10,000rpm的條件,所得磨削比較高為2452,材料去除效率較高;反之,在較高主軸轉速30,000rpm時,磨削比較低為503,材料去除效率較低。(3)細磨削時,用鑽石粒號#1000的金屬燒結鑽石磨棒,以高主軸轉速50,000rpm,低切深1μm,所得工件表面粗糙度為Ra 0.33μm。(4)使用壓力磨削方式,可得到更佳的氧化鋁陶瓷表面粗糙度Ra 0.23μm,其比高速細磨削者能得到較佳的表面粗糙度,可用於粗磨後的精修。
The purpose of the paper was to investigate the rough grinding and fine grinding of alumina ceramic using small diameter of diamond tools under high spindle speed. The effect of the grinding conditions on diamond wear, grinding forces, and surface roughness was discussed. The four types of experiments were carried out: (1) the electroplated diamond tool and metal sintered diamond tool with grit mesh of #270/325 were used to grind alumina. Toolmaker microscope and SEM were used to observe the diamond wear conditions after and before grinding and calculate their wear proportions. Besides, the grinding force and the workpiece surface roughness obtained displayed a moderate long time of grinding alumina for the metal sintered diamond tool. Relatively, the electroplated tool can be used to grind the alumina under a relatively lower feed and spindle speed for a short periods. (2) For rough grinding of alumina, when a metal sintered diamond tool of grit mesh #80/100 under a lower spindle speed of 10000 rpm was used, the relatively higher grinding ratio of 2452 and the higher material removal efficiency were obtained. Oppositely, for a higher spindle speed of 30000 rpm, the lower grinding ratio of 503 and the lower material removal efficiency were produced. (3) For fine grinding of alumina, when the metal sintered diamond tool of grit mesh #1000 under a higher spindle speed of 50000 rpm and a lower depth of cut of 1μm was employed, the resulting better surface roughness obtained was Ra 0.33 μm. (4) The pressure grinding of alumina was used to obtain a better surface roughness of Ra 0.23μm than the high speed fine grinding. Hence, it can be used as an ultra finishing after rough grinding.
目錄
致謝 I
摘要 II
目錄 IV
表錄 VI
圖錄 VIII
第一章 緒論 1
1.1 研究動機 1
1.2文獻回顧 2
1.3 研究目的 7
1.4 本文內容 8
第二章 理論基礎 9
2.1 磨削加工原理 9
2.1-1 磨粒加工 9
2.1-2 硬脆材料受壓印的特性 12
2.1-3 脆性材料磨削情況 14
2.1-4鑽石磨棒工具磨削中切刃之變化 17
2.2 磨削模式 19
2.3 鑽石的種類 21
2.4陶瓷材料特性 24
第三章 實驗程序與設備 25
3.1磨削加工實驗之架構與流程 25
3.2 分析儀器及設備 32
第四章 實驗結果與討論 40
4.1磨棒型態 40
4.1-1磨削力 40
4.1-2 工件表面粗糙度分析 45
4.1-3 鑽石工具磨耗情形 50
4.2 粗磨用金屬燒結鑽石磨棒對氧化鋁陶瓷之影響 54
4.2-1 進給對磨削力之影響 54
4.2-2進給對表面粗糙度之影響 58
4.2-3 耐磨試驗 74
4.3 細磨用金屬燒結鑽石磨棒對氧化鋁陶瓷之影響 81
4.3-1轉速及切深對磨削力與表面粗糙度之影響 81
4.3-2壓力磨削對氧化鋁陶瓷粗糙度之影響 87
第五章 結論 94
參考文獻 96
[1] H. Huang, Y.C. Liu, ”Experimental investigations of machining characteristics and removal mechanisms of advanced ceramics in high speed deep grinding”, International Journal of Machine Tools and Manufacture, Vol.43, pp.811-823, 2003.
[2] 羅勝益,金屬結合鑽石刀具之製造與磨耗分析,博士論文,國立台灣大學,1990。
[3] H. Huang, L. Yin, “Grinding characteristics of engineering ceramics in high speed regime”, International Journal Abrasive Technology, Vol.1, No. 1, 2007.
[4] T. Altan, B.W. Lilly, J.P. Khairy, “Advanced techniques for die and mold manufacturing“, Annals of the CIRP, Vol.42, No.2, pp.707, 1993.
[5] Zhang, Y. Fulun, W. Jiexin, Z. Zhenqi, M. Richard, “Stock removal rate and workpiece strength in multi-pass grinding of ceramics”, J. Mater. Process Technology, Vol.104, pp.178-184, 2000.
[6] V. Pacitti C. Rubenstein, “The influence of the dressing depth of cut on the performance of a single point diamond dresser alumina grinding wheel”, Int.J.Mach. Tool Des. Res, Vol.12, pp.267-279, 1972.
[7] H. Huang, “Machining characteristics and surface integrity of yttria stabilized tetragonal zirconia in high speed deep grinding”, Material Science and Engineering, Vol.345, pp155-163, 2003.
[8] O. Desa, S. Bahadur, ”The effect of lubricants in single point scratching and abrasive machining of alumina and silicon nitride”, Wear, Vol.251, pp.1085-1093, 2001.
[9] 余宗翰,類LIGA技術製造為鑽石磨錠工具之研究,博士論文,華梵大學,2009。
[10] Sanjay Agarwal, P. Venkaeswara Rao, ”Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding”, International Journal of Machine Tools & Manufacture, Vol.48, pp.698-710, 2008.
[11] Z. W. Zhong, ”Ductile or partial ductile mode machining of brittle materials”, International Journal Advanced Manufacturing Technology Vol.21, pp.579-585, 2003.
[12] H. Huang, Y.C. Liu, ”Experimental investigations of machining characteristics and removal mechanisms of advanced ceramics in high speed deep grinding”, International Journal of Machine Tools & Manufacture, Vol.43, pp.811-823, 2003.
[13] Z.J. Pei, Alan Strasbaugh, ”Fine grinding of silicon wafers”, International Journal of Machine Tools & Manufacture, Vol.41, pp. 659–672, 2001.
[14] S.Y. Luo, Y.C. Liu, C.C. Chou, T.C. Chen, ”Performance of power filled resin-bonded diamond wheels in the verical dry grinding of tungsten carbide”, Journal of Material Processing Technology, Vol.118, pp.329-336, 2001.
[15] S.F. Krar, E. Ratterman, Superabrasives: Grinding and machining with CBN and diamond, McGraw-Hill, New York, 1990.
[16] 何靖國,鑽石磨棒磨削多晶鑽石加工之研究,碩士論文,華梵大學,2006。
[17] K. Subramanian, S. Ramanath and M. Tricad, ” Mechanisms of material removal in the precision production grinding of ceramics”, Journal of Manufacturing Secience and Engineering , Vol.199, pp.509-519, 1997.
[18] 賴耿楊譯著,“精密加工新技術全集”,復漢出版社,2001。
[19] 蔡宗河譯,“陶瓷的機械加工”,全華科技圖書股份有限公司,1991。
[20] T.G. Bifano, T.A Dow, R.O Scattergood, “Ductile-regime grinding: a new technology for machining brittle materials”, ASME Journal of Engineering for Industry, Vol.113, pp.184-189, 1991.
[21] J. E. Fied, The Properties of Diamond, Academic 1Press, New York, 1979.
[22] 江信( FACT )公司型錄。
[23] 精密鑽石工具,松祿文化事業股份有限公司,1992。
[24] 徐明堅編著,“最新切削加工技術”,復漢出版社,1992。
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top