臺灣博碩士論文加值系統

本研究係合成含氟多面體倍半矽氧烷寡聚物(OFG)導入聚亞醯胺(PI)主鏈中形成交聯結構PI-OFG奈米複合材料，希望PI中導入OFG能有效降低介電常數、增加熱性質及機械性質。由FTIR及1H-NMR光譜得知OFG結構具有平均四隻含氟基和四隻環氧基。在熱性質的方面，將OFG導入PAA骨架中，OFG的環氧基能與PAA反應形成交聯結構，其交聯結構能有效增加PI的Tg點(PI：Tg=350.91℃；PI-OFG 7wt%：Tg=362.1℃)。但熱裂解溫度卻隨OFG量增加而減少，是因為在PAA在亞醯胺化時，由29Si-NMR得知一部份交聯結構被破壞，以及OFG支鏈具低熱裂解溫度的因素所造成。在機械性質，在低組成時能增加機械性質，但高組成時會因OFG聚集形成相連結(phase interconnection)而減少。相形態學上，PI結構中導入少量的OFG時(PI-OFG 3、7wt% )，OFG奈米粒子具有良好分散性(＜10nm)，由模形結構(model compound)得知OFG的環氧基與PAA反應性快於PAA本身亞醯胺化反應。另一方面，在高組成時(PI-OFG 10、15wt%)因導入PI之OFG含量較多，因相容性的因素使OFG的聚集產生相連結的形態。在介電性質上，利用DEA分析得知PI-OFG的介電值隨OFG增加而減少(PI：Dk=3.19；PI-OFG 15wt%：Dk=2.3)。影響介電性質的因素為自由體積、親疏水性、極性等。在自由體積量測，主要是由密度計算出相對孔隙度(the relative porosity increase，Ψr %)，發現隨著導入OFG的量增加相對孔隙度也伴隨著增加，因此導入PI主鏈中可以有效增加PI的自由體積(free volume，FFV)。(PI：FFV=0.044；PI-OFG 15wt%：FFV=0.319；PI：Ψr =0.044；PI-OFG 15wt%：Ψr =0.044 %)。親疏水性、極性量測係利用靜態接觸的測量及理論公式的計算，發現隨著導入OFG含量增加，能有效降低極性及增加疏水性。(PI：γs=47.7 mN/m；PI-OFG 15wt%：γs =29.0 mＮ/m；PI： =0.044；PI-OFG 15wt%： =0.319)。由上述結果得知，因此添加OFG能夠有效增加PI的熱性質及機械性質，能更有效降低介電常數。

In this study, the reactive fluorine POSS was introduced in polyimide structure to form a curing framework of PI-OFG nanocomposite and it was expected to enhance the thermal and mechanical properties and decreased the dielectric constant of PI. The OFG chemical structure was characterized by FTIR and 1H-NMR. The OFG possessed average four epoxy and four fluorine groups. In the thermal properties, the OFG was able to cured with PAA to form curing structure during the imidization. Due to the curing structure of PI-OFG nanocomposite, the Tg of PI was increased with increasing OFG. The thermal stability of PI-OFG was decreased with increasing OFG, due to the damage of curing structure of PI-OFG and low thermal stability of OFG. The 14Si-NMR revealed the curing structure was broken of PI-OFG. In mechanical property, the lower OFG content of PI-OFG possessed good mechanical property. For high OFG content, the OFG aggregation form phase interconnected to decrease the mechanical property. In morphology, the lower OFG content of PI-OFG (OFG3、7 wt%) displayed good dispersion (<10 nm). The model compound results show that the curing reaction of OFG and PAA POSS was earlier than imidization of PAA. For higher OFG content, the poor miscibility between OFG and PAA to form severe POSS aggregation (phase interconnected). The factors of decreasing the dielectric constant of polymer was free volume, hydrophobic and polarity of polymer. In free volume, the relative porosity and free volume was determined by measurement of density of polymer. The relative porosity and free volume of PI-OFG were increased with increasing OFG(PI：FFV=0.044；PI-OFG 15wt%：FFV=0.319；PI：Ψr =0.044；PI-OFG 15wt%：Ψr =0.044). The hydrophobic and polarity of PI-OFG was measured by static contact angle and it revealed that the decreasing polarity and increasing hydrophobic of PI-OFG(PI：γs=47.7 mN/m；PI-OFG 15wt%：γs =29.0 mＮ/m；PI： =0.044；PI-OFG 15wt%： =0.319). Therefore, the OFG was introduced into the PI structure to enhance the thermal and mechanical properties and reducing the dielectric constant of PI.

目 錄

中文摘要 …………………………………………………………… I
英文摘要 …………………………………………………………… III
研究架構 …………………………………………………………… V
目錄 …………………………………………………………… VI
表目錄 …………………………………………………………… IX
圖目錄 …………………………………………………………… X
第一章 序論……………………………………………………… 1
1-1 前言……………………………………………………… 1
1-2 封裝材料………………………………………………… 2
1-3 降低聚亞醯胺介電常數主要的方法…………………… 3
1-4 奈米複合材料之簡介…………………………………… 5
1-5 奈米複合材料應用於低介電常數……………………… 6
1-6 研究動機………………………………………………… 7
第二章 文獻回顧………………………………………………… 14
2-1 多面體倍半矽氧烷寡聚物簡介………………………… 14
2-1.1 多面體倍半矽氧烷寡聚物的定義與製備……………… 14
2-1.2 多面體倍半矽氧烷寡聚物與其它填的充料…………… 17
2-1.3 多面體倍半矽氧烷寡聚物與高分子共聚方法………… 18
2-1.4 國內外多面體倍半矽氧烷寡聚物相關之發展 19
2-2 聚亞醯胺簡介…………………………………………… 20
2-2.1 聚亞醯胺的種類………………………………………… 21
2-2.2 聚亞醯胺酸之合成與亞醯胺化………………………… 22
2-3 低介電常數之材料……………………………………… 25
2-3.1 介電原理………………………………………………… 25
2-3.2 相對介電常數…………………………………………… 27
2-3.3 時間延遲運與介電常係數……………………………… 28
第三章 實驗部分………………………………………………… 35
3-1 實驗藥品………………………………………………… 35
3-2 含氟多面體倍半矽氧烷寡聚物的合成………………… 40
3-3 聚亞醯胺酸的合成……………………………………… 41
3-4 Model Compound………………………………………… 42
3-5 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料的製備…………………………………………………… 43
3-6 薄膜之密度量測………………………………………… 44
3-7 實驗儀器原理及操作程序……………………………… 45
第四章 結果與討論……………………………………………… 55
4-1 含氟多面體倍半矽氧烷寡聚物的合成鑑定與性質分析分析………………………………………………………
55
4-1.1 含氟多面體倍半矽氧烷寡聚物之傅立葉紅外光光譜儀鑑定……………………………………………………… 56
4-1.2 含氟多面體倍半矽氧烷寡聚物之1H-NMR組成鑑定………………………………………………………… 57
4-1.3 含氟多面體倍半矽氧烷寡聚物之玻璃轉移溫度分析………………………………………………………… 59
4-1.4 含氟多面體倍半矽氧烷寡聚物之熱裂解溫度分析
…………………………………………………………… 59
4-2 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之合成鑑定……………………………………………… 60
4-2.1 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料
之傳立葉紅外光光譜儀鑑定…………………………… 61
4-2.2 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料
之13C-NMR分析鑑定…………………………………… 62
4-3 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之相形態學分析………………………………………… 63
4-3.1 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之X光繞射分析鑑定結果……………………………… 63
4-3.2 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之場發射掃描式電子顯微鏡分析結果………………… 65
4-3.3 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之原子力顯微鏡分析結果……………………………… 68
4-3.3.1 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料反應性因素與形態學之相關性……………………… 71
4-3.3.2 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺酸之微差掃描熱卡計…………………………………………………… 72
4-3.3.3 Model Compound之紅外線光譜分析與13C-NMR分析………………………………………………………… 72
4-3.4 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之原子力顯微鏡分析結果…………………………… 74
4-4 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之熱性質與機械性質分析……………………………… 75
4-4.1 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之動態機械分析儀分析結果…………………………… 75
4-4.2 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之熱重分析儀分析結果………………………………… 76
4-4.2.1 熱亞醯胺過程產生之斷鍵對熱裂解溫度的影響……… 76
4-4.2.2 多面體倍半矽氧烷寡聚物主結構的裂解……………… 79
4-4.3 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之熱膨脹係數分析結果……………………………… 79
4-4.4 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之機械性質分析結果………………………………… 80
4-5 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之介電性質分析………………………………………… 82
4-5.1 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之自由體積分析………………………………………… 83
4-5.2 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之相對孔隙度增加分析………………………………… 84
4-6 含氟多面體倍半矽氧烷寡聚物/聚亞醯胺奈米複合材料之表面能分析…………………………………………… 86
第五章 結論……………………………………………………… 124
參考文獻 …………………………………………………………… 125
















表 目 錄

表1-1 封裝材料性質之需求………………………………………… 10
表1-2 目前應用於封裝材料製的高分子…………………………… 11
表1-3 一般聚亞醯胺之特性………………………………………… 12
表1-4 低介電封裝材料之介電常數主要應用範圍………………… 13
表2-1 多面體倍半矽氧烷寡聚物與其它填充料之特性比較……… 30
表2-2 多面體倍半矽氧烷寡聚物與高分子共聚方式優缺點……… 31
表2-3 物質之介電常數……………………………………………….. 32
表3-1 含氟多面體倍矽氧烷寡聚物/聚亞醯胺奈米複合材料的組成列表…………………………………………………………… 50
表4-1 OFG/PI奈米複合材料之粒徑分佈分析……………………… 88
表4-2 OFG/PI奈米複合材料熱性質與機械性質分析……………… 89
表4-3 OFG/PI奈米複合材料之元素分析、實際重量百分比與實際莫耳百分比…………………………………………………… 90
表4-4 OFG/PI奈米複合材料之介電常數、自由體積與相對孔隙度增加分析………………………………………………………
91
表4-5 OFG/PI奈米複合材料之靜態接觸角與表面能分析………… 92



















圖 目 錄

圖2-1 多面體倍半矽氧烷寡聚物之結構…………………………… 33
圖2-2 多面體倍半矽氧寡聚物與高分子材料共聚型態…………… 34
圖3-1 OFG化合物之合成反應圖…………………………………… 51
圖3-2 PAA化合物之合成反應圖…………………………………… 52
圖3-3 Model Component化合物之合成反應圖…………………… 53
圖3-4 OFG/PI奈米複合材料之合成反應圖………………………… 54
圖4-1 Q8M8H、AGE、OFG的紅外線光譜圖………………………… 93
圖4-2 Q8M8H的1H-NMR光譜圖……………………………………… 94
圖4-3 AGE的1H-NMR光譜圖……………………………………… 95
圖4-4 AHFPE的1H-NMR光譜圖…………………………………… 96
圖4-5 OFG的1H-NMR光譜圖……………………………………… 97
圖4-6 OFG的DSC…………………………………………………… 98
圖4-7 OFG的TGA與DTG圖……………………………………… 99
圖4-8 Q8M8H的TGA與DTG圖…………………………………… 100
圖4-9 OFG/PI的FT-IR圖…………………………………………… 101
圖4-10 PI-OFG 3 wt%的13C-NMR…………………………………… 102
圖4-11 PI-OFG 15 wt%的13C-NMR………………………………… 103
圖4-12 OFG/PI奈米複合材料的XRD圖……………………………… 104
圖4-13 PI-OFG 3 wt%的SEM(A)70k(B)100k圖…………………… 105
圖4-14 PI-OFG 7 wt%的SEM(A)70k(B)100k圖……………………… 106
圖4-15 (A)PI-OFG 10%(70k)(B)PI-OFG 15%(70k)的SEM圖………… 107
圖4-16 PI-OFG 3wt反應情形………………………………………… 108
圖4-17 PI-OFG 15wt反應情形………………………………………… 109
圖4-18 OFG/ PAA的DSC圖…………………………………………… 110
圖4-19 Model Component的13C-NMR圖……………………………… 111
圖4-20 Model Component的FT-IR圖………………………………… 112
圖4-21 PI-OFG 3wt% AFM的相圖…………………………………… 113
圖4-22 PI-OFG 15wt% AFM的相圖…………………………………… 114
圖4-23 (A)PI-OFG 3wt%(B)PI-OFG 15wt% AFM的立體圖………… 115
圖4-24 OFG/ PI 奈米複合材料DMA(損耗模數)圖………………… 116
圖4-25 OFG/ PI 奈米複合材料DMA(tanδ)圖……………………… 117
圖4-26 OFG/ PI 奈米複合材料TGA(DEC)圖……………………… 118
圖4-27 OFG/ PI 奈米複合材料TGA(DTG)圖………………………… 119
圖4-28 PI-OFG 3wt%和PI-OFG 15wt%之13C-NMR…………………… 120
圖4-29 PI-OFG 3wt%和PI-OFG 15wt%之29Si-NMR…………………… 121
圖4-30 OFG/PI奈米複合材料之介電常數與自由體積、相對孔隙度增加關係圖…………………………………………………… 122
圖4-31 OFG/PI奈米複合材料之表面能與介電常數關係圖………… 123

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