臺灣博碩士論文加值系統

本研目的為對Ti50Ni49Si1合金於電解液磷酸中進行定電壓微弧氧化處理，討論微弧氧化電壓 (80V、120V及150V)對氧化膜微結構與特性(表面粗糙、親水性、及氧化膜附著力)之影響。Ti50Ni49Si1合金晶格常數為a=2.8878Å、b=4.13208 Å、c=4.6240 Å、β=96.487˚，常溫下為麻田散體(B19’)結構，相轉換溫度Ms為72.76℃與Mf為48.83℃以及As為81.27℃與Af為112.19℃，經微弧氧化合金相變態溫度隨電壓上升而下降。提高微弧氧化電壓造成合金表面孔徑、氧化膜厚度、粗糙度及磷含量上升，同時，微弧氧化電壓上升造成氧化膜孔隙率與水滴接觸角下降，且合金形狀回復率下降。微弧氧化膜為非晶結構，微米級孔洞與奈米級孔洞各分部在氧化膜外部與內部，微弧氧化電壓愈高微米級孔洞尺寸增加。氧化膜拉伸附著力超過ISO13779規範(15MPa)，且氧化膜無剝落，拉伸與彎曲試驗指出微弧氧化電壓愈高氧化膜附著性愈差。

Ti50Ni49Si1 shape memory alloy (SMA) surfaces were modified by micro-arc oxidation in phosphoric acid by applying constant voltages. The microstrusture and oxide-film properties (surface roughness, wettability, and film adhesion) were investigated. The results indicated that the pore size, film thickness, and P content increased with applied voltage. The porosity of surface, water contact angle, and shape recovery rate decreased with applied voltage. The micro-arcoxidized film, comprising Ti oxide, Ni oxide, and phosphate compounds, exhibited a glassy amorphous structure. Many micropores and nanopores distributed in the oxide film. The adhesive strengths of all the oxide films exceeded the requirements of ISO 13779 and no fracture of the oxide films occurred. The adhesion of the oxide film decreased with increasing applied voltage according to tensile and bending tests.

目錄
摘要 i
Abstract ii
圖目錄 vi
表目錄 ix
符號說明 x
第一章 前言 1
第二章 文獻回顧 2
2.1 形狀記憶合金簡介 2
2.2 熱彈性型麻田散體變態 2
2.3 形狀記憶效應介紹 5
2.4 擬彈性效應（Pseudoelastic Effect, PE） 10
2.5 TiNi合金的結構與相變態 15
2.6 第三元素的添加對TiNi合金變態行為的探討 19
2.7 微弧氧化 21
2.8 微弧氧化技術之應用 29
第三章 實驗方法 30
3.1合金的配製 30
3.2合金之熔煉 31
3.3微弧氧化 34
3.4 DSC量測 36
3.5 維克氏硬度量測 37
3.6 形狀記憶效應 37
3.7 表面粗糙度量測 39
3.8 SEM及EDS成份分析 40
3.9 XRD 晶體繞射分析 41
3.10 FIB TEM試片製作 41
3.11 XPS分析 42
3.12 TEM 晶體結構分析 42
3.13 水滴接觸角量測 43
3.14 附著力量測 44
3.15 恆電位儀 45
第四章 結果與討論 46
4.1 TiNiSi合金相變態行為探討 46
4.2維克氏硬度量測 49
4.3 TiNiSi合金之形狀記憶效應 50
4.4 TiNiSi合金之微弧氧化 54
4.4.1 經微弧氧化後電壓對氧化層孔洞的影響 54
4.4.2 經微弧氧化後電壓對氧化層表面粗糙度的影響 54
4.4.3 經微弧氧化後電壓對氧化層表面孔隙率的影響 54
4.4.4 經微弧氧化後電壓對氧化層厚度的影響 55
4.4.5 微弧氧化層生長機制 62
4.5 經微弧氧化後氧化層之特性 63
4.5.1 微弧氧化層EDS分析 63
4.5.2 XRD繞射分析 67
4.5.3 XPS氧化層分析 70
4.5.4 FIB製備橫截面TEM試片 74
4.5.5 TEM分析 75
4.5.5 水滴接觸角 78
4.5.6 附著力測試 79
4.5.7 電化學極化曲線測試 87
結論 88
參考文獻 89
個人簡歷 93

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