臺灣博碩士論文加值系統

摘 要
複合材料具有良好的比剛性、比強度可有效強化結構，使結構輕量化，加上生產技術日益成熟，複材的應用面逐步擴大至各個產業。複合材料在接合時若使用機械連接，則必須在複合材料結構上開孔，但在傳遞負載時，開孔會破壞材料的連續性，降低結構強度與承載能力，因此若採用膠合技術能避免複材因接合而造成損傷，並能改善應力集中、使應力均勻分布、結構輕量化，因此在碳纖結構中膠接是一種取代機械連接的常用技術。

本研究主要探討複合材料單搭接頭 single lap joint 承受拉伸負載時膠合介面之脫層及力學行為，過程中考慮負載所造成的幾合非線性行為。膠合介面透過內聚力模型 cohesive zone model 配合二次公稱應力準則及能量釋放率，能有效模擬膠合介面脫層起始與脫層擴展及其所相應之應力分布狀況。

Abstract

Composite materials have excellent specific stiffness, and specific strength, that can both reinforce the structure effectively and make it lightweight. As the production technology is becoming more and more advanced, composite materials have been widely applied in many industries. Ifmechanical connection is applied during the process of combination, there must be an opening on the structure of multiple materials. But the opening might destroy the continuity of material, decreasing the strength of structure, and the ability of loading. Therefore, by using bonded joint technology, the damage during combination can be avoided, and we can improve stress concentration to let stress distributeuniformly and obtain a more lightweight structure. The bonded joint technology in composite structural, is now a common technology that has replaced mechanical connection.

The study is aimed at the Adhesive Bonded interface of Delamination and mechanical behavior when the composite Adhesive Bonded single lap joint supports Tensile load. In the process, it considers the geometric nonlinear behavior that the load caused. With adhesive Bonded interface matching up with Quadratic nominal stress criterion and energy release rate by cohesive zone model, it can model Adhesive Bonded interface Initial
delamination, delamination expansion and the condition of corresponding Stress distribution.

第一章 緒論............. 1
1.1 簡介 ............. 1
1.2 文獻回顧 ......... 3
1.2.1 膠接接頭理論模型研究 .... 3
1.2.2 膠接接頭數值模擬研究 .... 5
1.3 研究動機與方法 ... 7
1.4 研究架構 ........ 7

第二章 相關理論基礎 .......... 9
2.1 複合材料單層板三維應力應變關係 ... 9
2.1.1 各項異性彈性單層板應變應力 ..... 9
2.1.2 正交各向異性單層材料應力應變... 10
2.1.3 橫觀各向同性單層材料應力應變 ... 12
2.1.4 單層板的偏軸應力轉換 ......... 13
2.2 單搭接接頭本構模型建立 ........... 18
2.2.1 考慮 Timoshenko beam 理論之單搭接頭 ........................ 19
2.2.2 考慮 Timoshenko beam theory 之對稱複 合材料單搭接頭 .... 22
2.3 黏結劑塑性模型本構關係 .......... 26
2.3.1 Drucker Prager Models .... 27
2.4 內聚力模型 cohesive zone models CZM ....................... 29
2.4.1 曳引力－位移(Traction separation law ) .......................... 29
2.4.2 損傷起始 ................... 31
2.4.3 損傷演化 ................... 31
2.5 混合模式行為(Mixed mode beheavior). 33
2.5.1 混合模式行為下能量釋放率 ......... 34
2.5.2 脫層擴展 ...................... 35

第三章 數值模型與分析流程簡介 ........... 36
3.1 數值模型描述 ..................... 36
3.2 碳纖維與黏結劑材料說明 ............. 37
3.3 數值分析 ....................... 39
3.3.1 單搭接接頭疊層角度探討 ........... 41
3.3.2 黏結劑厚度探討 ................. 41

第四章 數值分析結果與討論 .............. 42
4.1 網格收斂性分析.................... 42
4.2 不同疊層角度之內聚力模型應力分析..... 44
4.2.1 單搭接頭脫層起始之最大變形量 ...... 45
4.2.2 膠合界面脫層起始應力探討 ......... 45
4.2.3 膠合界面脫層起始時應力分布狀況 .... 47
4.3 膠合界面脫層擴展形式 .............. 49
4.3.1 膠合界面脫層擴展時應力分布狀況 .... 51
4.3.2 脫層擴展節點應力-位移響應 ........ 53
4.4 黏結劑厚度對剪切應力與剝離應力之影響 .. 56

第五章 結論與未來展望 ................. 58
5.1 結論 ........................ 58
5.2 未來展望 ..................... 60
參考文獻 ............................ 61
附錄Ａ .............................. 65
附錄Ｂ .............................. 67

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