參考文獻
[1]X. Xu, X. Yu, ”Sawing performance of diamond with alloy coating,” Surface & Coating Technology, Vol.198, pp.459-463, 2005.
[2]Y. H. Wang, J. B. Zang, M. E. Wang, Y. Guan, Y. E. Zheng, ”Properties and applications of Ti-coating diamond grinding,” Journal of Materials Processing Technology, Vol.129, pp.369-379, 2002.
[3]T. Ohi, ”Trends and future developments for diamond CMP Pad condition,” Ind. Diamond At Work, pp.1-4, 2007.
[4]B. Zhang, Y. Fulum, W. Jiexin, Z. Zhenqi, M. Richard, ”Stock removal rate and workpiece strength in multi-pass grinding of Ceramics,” Journal of Materials Processing technology, Vol.104, pp.178-184, 2000.
[5]B. Zhang, Y. Fulun, W. Jiexin, Z. Zhenqi, M. Richard, “Stock removal rate and workpiece strength in multi-pass grinding of ceramics,” Journal Material Process Technology, Vol.104, pp.178-184, 2000.
[6]K. Yamaguchi, K. Mizutani and Y. Tanaka, ”Chipping of the Work at Its Corner in Grinding of Ceramics,” ICPE, pp.552-557, 1997.
[7]余宗翰,類LIGA技術製造微鑽石研磨錠工具之研究,博士論文,華梵大學,2009。[8]S. Y. Luo, Y.Y. Tsai, C.H. Chen, ”Studies on cut-off grinding of BK7 optical glass using thin diamond wheels,” Journal of Materials Processing Technology, Vol.173, pp.321–329, 2006
[9]O. Desa, S. Bahadur, ”The effect of lubricants in single point scratching and abrasive machining of alumina and silicon nitride,” Wear, Vol.251, pp.1085-1093, 2001.
[10]S. Malkin, S. Kannappan, ”Effects of grain size and operating parameters on the mechanics of grinding, ”Journal of Engineering for Industry, Trans ASME, Series B, Vol.94, p833-842, Aug. 1972.
[11]洪珮文,化學機械研磨中鑽石修整器修整特性之研究,國立台灣大學機械工程研究所碩士論文,民國九十一年六月。[12]楊琦婷,化學機械研磨中鑽石修整器磨耗之研究,國立台灣大學機械工程研究所碩士論文,民國九十一年六月。[13]趙弘文,化學機械研磨中單顆鑽石於研磨墊上作用之探討,國立台灣大學機械工程研究所碩士論文,民國九十二年六月。[14]精密鑽石工具,松祿文化事業股份有限公司,1992。
[15]江信( FACT )公司型錄。
[16]伍祖璁、黃錦鐘譯著,粉末冶金,高立圖書有限公司,2000。
[17]黃忠良編著,工業鑽石合成及接著技術, 復漢出版社,1973。
[18]賴耿楊譯著,精密加工新技術全集,復漢出版社,2001。
[19]蔡宗河譯,陶瓷的機械加工,全華科技圖書股份有限公司,1991。