臺灣博碩士論文加值系統

半導體的製造過程可達數百道程序，且必須考慮等候時間限制、批量機台限制、機台限制、迴流等特性，複雜度甚高。本研究探討個案公司之半導體爐管製程，包含其前製程清洗，與後製程的爐管加工。該製程因為具有等候時間限制與批量機台限制的特性，且因爐管製程之加工時間長，而清洗機台的加工時間短，並有機台限制的特性，因此其投料的數量與時間點為半導體生產過程中相當艱鉅的區段，本研究提出一拉式投料策略，在已知工作數的前提下，先對第二站的爐管機台進行排程，再向前對第一站的清洗機台發出投料需求，求取最小化機台的產能未利用率及其晶圓報廢率。
實證結果顯示，本研究所提出之投料法則，在工作數為30, 60, 90時，將現況解之產品報廢率分別由3%, 5%, 16%，皆降為0%；而機台產能未利用率則由現況解之41.53%, 36.34%, 33.23%，以基因演算法求解分別降為31.47%, 15.73%, 10.96%；其改善率分別為24.17%, 56.66%, 67.03%，可證明本研究所提之演算法與派工法則可供實務應用與相關學術研究。

In the face of high fixed-cost investment, companies try hard to stay competitive advantage by improving utilization of machines and keeping the quality of products. There are hundreds of procedures of semiconductor manufacturing, including queue time limits, batch-process machine, and the recipe limits...etc. It causes the high degree of complexity. The range of this study includes the former process - wash and the after process - furnace with characteristics of batch limit and waiting time constraint. This study proposes a pull-oriented releasing rules, and the number of jobs is known. First, schedule the jobs in second stage, after that, send out the needs to fist stage. The goal is to minimize the idle capacity of machines and the scrap rate of products.
Computational results show that the proposed method performed better than the current state. First, when number of jobs are 30, 60, 90, the current solution of product scrap rate are 3%, 5% and 16%. In the other hand, the scrap rate of proposed research method is 0%. The improved rate is 100%. Secondly, when number of jobs are 30, 60, 90, the idle capacity of machines are 41.53%, 36.34%, 33.23%, and the solution of proposed method are 31.47%, 15.73%, 10.96%, the improved rate are 24.17%, 56.66%, 67.03%. Obviously, the proposed method not only can solve the practical scheduling problems, but also provide recommendations for the academic study.

目錄

第壹章、緒論
第一節 問題背景與研究動機
第二節 研究範圍與限制
第三節 研究目的
第四節 研究流程
第貳章、文獻探討
第一節 晶圓代工產業之現況簡介
第二節 平行機之定義與類型
第三節 等候時間限制、批量機台及其派工法則
第四節 基因演算法
第參章、具等候時間限制之批量排程研究
第一節 個案公司簡介
第二節 晶圓製造之爐管製程
第三節 問題敘述與基本假設
第四節 求解演算法之設計
第肆章、資料測試與分析
第一節 工廠資料
第二節 釋例
第三節 實證資料測試
第伍章、結論與建議
第一節 結論
第二節 未來研究建議
參考文獻


表目錄
表2-1-1 全球前五大半導體晶圓代工廠商排行
表4-1-1 工廠之出產產品比例
表4-1-2 機台之環境與限制
表4-2-1 產品之投料數量與排程結果
表4-3-1 機台閒置產能時間(單位：小時)
表4-3-2 現況解與啟發式演算法解之彙整


圖目錄
圖1-4-1 研究流程圖
圖2-4-1 輪盤式機率
圖3-2-1 半導體製造流程圖
圖3-2-2 爐管機台構造圖
圖3-3-3 本研究製程之示意圖
圖3-4-1 基因演算法之基本步驟流程圖
圖4-2-1 初始群體與演化後之基因甘特圖
圖4-3-1 產品報廢率之比較圖
圖4-3-2 產品報廢之改善率圖
圖4-3-3 產能未利用率之比較圖
圖4-3-4 產能未利用之改善率圖
圖4-3-5 總和改善率圖

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