臺灣博碩士論文加值系統

CMOS影像感測器(CMOS Image Sensor，CIS)在最近幾年間被廣泛應用於光學滑鼠、數位相機、影像電話、汽車倒車雷達、視訊攝影機、以及家庭娛樂等方面，在可預期的未來，因為價格較低及功能提高，CMOS影像感測器會逐漸取代CCD影像感測器而成為主流。
本研究將針對CMOS影像感測器來做可靠度的分析與熱設計，一般來說，CMOS影像感測器最容易造成疲勞破壞的地方就是UV膠與銲錫接點處，因此如何選擇適當的材料將是一個很重要的問題，本研究將對其UV膠及封膠材料(Dam)的特性來做一分析與探討，且對不同成份的無鉛銲錫接點做一疲勞壽命的預測與比較。
由於在CMOS影像感測器中有空氣的存在，且空氣不只熱膨脹係數大，其吸收濕氣的速度也比其他高分子材料要來得快，因此如何有效地防止濕氣的進入也是一個重要的問題，在本研究中也將對這一問題做一分析及討論。
本研究應用了現今最廣泛使用的有限元素分析(Finite Element Analysis)軟體，來對CMOS影像感測器做一模擬與分析，建立起CMOS影像感測器的有限元素分析模型，模擬CMOS影像感測器在溫度變化中所造成的熱應力和熱應變，以及在濕度的環境中所造成的濕度應力及應變。也以雲紋干涉法(Moir? Interferometry)來進行實驗，觀察構裝元件材料間，因熱膨脹不匹配現象所造成的熱變形，再以有限元素分析軟體進行模擬分析，將其結果與雲紋干涉實驗結果做一比對與驗證。近幾年來，子模型的模擬技術應用越來越熱門，在本研究中也應用了子模型的模擬技術，並對其做一探討與分析。

Due to huge demand for optical mouse, digital cameras, photo-mobile phones, web-cam and optoelectronic devices in home entertainment in recent years, the production and packaging techniques for CMOS image sensor (CIS) have been rapidly developed and improved. The CIS will gradually become main product to take over CCD camera for its low price and high performance.
The reliability and thermal design for CMOS image sensor has been fully studied in this paper. It has been found that uv glue and solder paste are much easiest to failure in thermal fatigue for CIS structure. Therefore, it would be an important issue to choose suitable materials for CIS package. The thermal and moisture-absorption characteristic of uv glue and molding compound (Dam) for CIS have been studied in this paper. In addition, the predicted thermal fatigue life for different series of lead-free SnAgCu solder paste has been conducted in this research.
Because the coefficient of thermal expansion (CTE) of the air is much greater than other materials and the rate of absorbed moisture is faster than other polymer materials, it is important to develop an effective moisture-resistant mechanism for CIS package, which has been carefully studied in this paper.
A three-dimensional solid model of CMOS image sensor based on finite element ANSYS software is developed to predict the thermal-induced strain, stress distributions, and the hygroscopic swelling strain. The predicted thermal-induced displacements were found to be excellent agreement with the Moir? Interferometry experimental in-plane deformation. In this paper, the application of sub-model scheme in thermal cycle test prediction was also studied for its efficiency and interesting in recent years.

中文摘要Ⅰ
英文摘要Ⅲ
致謝Ⅴ
總目錄Ⅵ
圖目錄ⅩⅡ
表目錄ⅩⅨ
符號表.ⅩⅩⅡ
第一章 緒論與介紹1
1.1 緣由1
1.2 CMOS影像感測器3
1.3 熱設計5
1.4 可靠度8
1.5 研究目的10
第二章 文獻回顧12
第三章 理論基礎20
3.1 熱傳基礎理論20
3.1.1 熱傳導(Conduction)20
3.1.2 熱對流(Convection)22
3.2 濕度傳遞基礎理論23
3.2.1 吸濕(Moisture Pre-Conditioning)23
3.2.2 去濕(Dry-Baking)23
3.3 熱應力(Thermal Stress)、熱應變(Thermal Strain)24
3.4 等效應力(Von Mises Stress)29
3.5 潛變(Creep29
3.6 無鉛銲錫潛變建構方程式31
3.7 預測疲勞壽命模式32
3.8 LS-DYNA掉落模式33
第四章 有限元素模型與架構35
4.1 封裝製程程序35
4.1.1 前段製程36
4.1.2 後段製程37
4.2 研究架構38
4.3 有限元素分析模型的基本假設43
4.4 材料性質參數設定44
4.5 有限元素模型與網格化46
4.6 UV膠及封膠材料之參數探討50
4.6.1 有限元素類型50
4.6.2 邊界條件設定與求解設定51
4.6.3 參數設計51
4.6.4 模擬分析討論之觀察位置點52
4.7 濕度模擬53
4.7.1 有限元素類型53
4.7.2 邊界條件設定及求解設定55
4.7.3 參數設計59
4.7.4 模擬分析討論之觀察位置點60
4.8 溫度循環模擬61
4.8.1 有限元素類型61
4.8.2 邊界條件設定及求解設定61
4.8.2.1 整體模型的邊界條件設定及求解設定62
4.8.2.2 子模型的邊界條件設定及求解設定63
4.8.3 參數設計64
4.8.3.1 不同無鉛銲錫成份64
4.8.3.2 不同溫度循環條件65
4.8.3.3 不同比例之子模型66
4.8.3.4 不同網格數之子模型67
4.8.4 模擬分析討論之觀察位置點67
4.9 自由掉落模擬69
4.9.1 有限元素類型69
4.9.2 邊界條件設定及求解設定71
4.9.3 參數設計71
4.9.3.1 不同角度之掉落接觸71
4.9.3.2 不同高度之掉落接觸72
4.9.4 模擬分析討論之觀察位置點73
第五章 實驗驗證74
5.1 雲紋干涉法基本原理74
5.2 雲紋干涉實驗75
5.3 雲紋干涉實驗結果77
5.4 有限元素模型之分析結果與討論77
5.4.1 有限元素模型之邊界條件設定77
5.4.2 模擬結果78
5.4.3 結論80
5.5 翹曲模擬結果與討論80
5.5.1 有限元素模型之邊界條件設定80
5.5.2 模擬結果81
5.5.3 結論85
第六章 模擬結果與討論87
6.1 不同UV膠及封膠材料之參數的影響87
6.1.1 改變封膠材料的楊氏係數之模擬結果87
6.1.1.1 降溫狀態87
6.1.1.2 升溫狀態89
6.1.2 改變封膠材料的熱膨脹係數之模擬結果90
6.1.2.1 降溫狀態90
6.1.2.2 升溫狀態93
6.1.3 改變UV膠的楊氏係數之模擬結果95
6.1.3.1 降溫狀態95
6.1.3.2 升溫狀態97
6.1.4 改變UV膠的熱膨脹係數之模擬結果98
6.1.4.1 降溫狀態98
6.1.4.2 升溫狀態101
6.1.5 結論103
6.2 基板佈銅量的影響105
6.2.1 基板內無佈銅層之模擬結果105
6.2.2 基板內佈一層75%的銅層之模擬結果110
6.2.3 基板內佈一層100%的銅層之模擬結果114
6.2.4 基板內佈二層100%的銅層之模擬結果119
6.2.5 結論124
6.3 不同無鉛銲錫成份的影響125
6.3.1 不同無鉛銲錫成份之模擬結果126
6.3.2 結論137
6.4 不同溫度循環條件的影響138
6.4.1 不同溫度循環條件之模擬結果138
6.4.2 結論149
6.5 子模型之驗證151
6.5.1 子模型之驗證模擬結果151
6.5.2 結論153
6.6 不同比例之子模型的影響154
6.6.1 不同比例的子模型之模擬結果154
6.6.2 結論157
6.7 不同網格化之子模型的影響157
6.7.1 不同網格化的子模型之模擬結果157
6.7.2 結論161
6.8 不同角度掉落的影響161
6.8.1 不同角度掉落之模擬結果161
6.8.2 結論162
6.9 不同高度掉落的影響162
6.9.1 不同高度掉落之模擬結果163
6.9.2 結論163
第七章 總結165
第八章 未來展望168
參考文獻169
作者簡介181

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