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[1]M. C. A. M. Koolen, J. A. M. Geelen, and M. P. J. G. Versleijen, "An improved de-embedding technique for on-wafer high-frequency characterization," in Proc. Bipolar Circuits and Technology Meeting, 1991, pp. 188-191. [2]T. E. Kolding, "A four-step method for de-embedding gigahertz on-wafer CMOS measurements," IEEE Trans. Electron Device, vol. 47, pp. 734-740, April 2000. [3]C. H. Chen and M. J. Deen, "A general noise and S-parameter deembedding procedure for on-wafer high-frequency noise measurements of MOSFETs," IEEE Trans. Microwave Theory Tech., vol. 49, pp. 1004-1005, May 2001. [4]C. H. Chen and M. J. Deen, "A general procedure for high-frequency noise parameter de-embedding of MOSFETs by taking the capacitive effects of metal interconnections into account," in Proc. ICMTS, 2001, pp. 109-114. [5]M.-H. Cho, Y.-H. Wang, and L.-K. Wu, "Scalable short-open-interconnect S-Parameter de-embedding method for on-wafer microwave characterization of silicon MOSFETs," ICICE Trans. Electronics, vol. E90-C, pp. 1708-1714, Step. 2007. [6]T. E. Kolding, O. K. Jensen, and T. Larsen, "Ground-shielded measuring technique for accurate on-wafer characterization of RF CMOS devices," in Proc. ICMTS, 2000, pp. 246-251. [7]R. E. Collin, Foundations for Microwave Engineering, 2nd ed., New York: McGraw-Hill, 1992. [8]H. Jeonghu, J. Minkyu, and S. Hyungcheol, "A simple and accurate method for extracting substrate resistance of RF MOSFETs," IEEE Electron Device Letters , vol. 23, pp. 434-436, July 2002. [9]J. Minkyu and S. Hyungcheol, "Gate bias dependence of the substrate signal coupling effect in RF MOSFETs," IEEE Electron Device Letters , vol. 24, pp. 183-185, March 2003. [10]C. Yuhua and M. Matloubian, "Parameter extraction of accurate and scalable substrate resistance components in RF MOSFETs," IEEE Electron Device Letters, vol. 23, pp. 221-223, April 2002. [11]H. Cho and D. E. Burk, "A three-step method for the de-embedding of high-frequency S-parameter measurements," IEEE Trans. Electron Devices, , vol. 38, pp. 1371-1375, June 1991. [12]E. P. Vandamme, D. M. M. P. Schreurs, and G. Van Dinther, "Improved three-step de-embedding method to accurately account for the influence of PAD parasitics in silicon on-wafer RF test-structures," IEEE Electron Devices, vol. 48, pp. 737-742, April 2001. [13]T. Kaija and P. Heino, "Shield-based on-wafer CMOS test fixture employing polysilicon shield plane," in Proc. NORCHIP Symp., 2005, pp. 118-121. [14]M. -H. Chen, G. -H. Huang, L. -K. Wu, C. -S. Chiu, Y. -H. Wang, K. -M. Chen, H. -C. Tseng, and T. -L. Hsu, "A shield-based three-port de-embedding method for microwave on-wafer characterization of deep-submicrometer silicon MOSFETs," IEEE Trans. Microwave Theory Tech , vol. 53, pp. 2926-2934, Setp. 2005. [15]S.-D. Wu, G.-W. Huang, K.-M. Chen, H.-C. Tseng, T.-L. Hsu, and C.-Y. Chang, "RF MOSFET characterization by four-port measurement." ICICE Trans. Electronics, vol. E88-C, pp. 851-856, May 2005. [16]C. Yuhua, M. J. Deen, and C. H. Chen, "MOSFET modeling for RF IC design," IEEE Trans. Electron Devices, vol. 52, pp. 1286-1303, July 2005. [17]S. D. Wu, G. W. Huang, K. M. Chen, C. Y. Chang, H. C. Tseng, and T. L.Hsu, "Extraction of substrate parameters for RF MOSFETs based on four-port measurement," IEEE Microwave Wireless Components Letters, vol. 15, pp. 437-439, June 2005. [18]S. H. M. Jen, C. C. Enz, D. R. Pehlke, M. Schroter, and B. J. Sheu, "Accurate modeling and parameter extraction for MOS transistors valid up to 10 GHz," IEEE Electron Devices, vol. 46, pp. 2217-2227, Dept. 1999.
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