臺灣博碩士論文加值系統

在半導體積體電路製造的領域，如何將新製程技術快速引進至生產線並能有良好的良率，是一個半導體製造公司競爭力的關鍵。從製程研發到生產線的技術移轉，嚴謹的管理模式及方法論更是快速提升良率不可或缺之要素。

「完整複製」”Copy Exactly”的技術移轉及量產化模式成功地運用在整合元件製造商 (IDM) 之晶圓廠，這類晶圓廠往往有專一 (dedicated) 的研發設施，而其所生產的產品通常為大量但少樣；但擁有專一的研發設施卻得付出較高的固定成本。至於以生產多元化產品的晶圓代工廠，製程研發單位除了少數關鍵機台外，往往與生產線共用大部分的機器設備以節省研發成本；然而卻因此可能與生產線的出貨優先次序有所衝突，影響先進製程良率的學習曲線。

無論採取何種製程開發及量產化的模式，跨部門的溝通和協調管理能力往往是製程量產成功的要素。一個有效率的晶圓廠擁有靈活的組織架構和管理系統，使其能夠迅速組成跨部門的專案小組，以集中資源解決技術和後勤支援的問題。

One of the key elements in running a successful semiconductor or integrated circuits (IC) production line is the capability for a fab to quickly ramp up new process technologies with good yield. Fast yield learning is closely related to the rigorous methodology and management systems from technology development to production transfer.

The “copy exactly” model in a dedicated R&D line facilitates problem solving and fast yield learning cycle but at a higher cost. This model is adopted by IDM fabs that produce few product types with large volume. On the other hand, most foundry companies that have high levels of product mix share manufacturing facilities with R&D to amortize the development cost but yield learning at early stages of process development may be compromised due to priority conflicts with production lines.

Regardless of the new process ramp model, the essence of a successful ramp-up relies on a company’s capability to coordinate cross-organization activities and to build an infrastructure in which task forces can be assembled in a short period time to address technical and logistic issues.

ACKNOWLEDGEMENT……………………………………………………….i

論文摘要………………………………………………………………iii

ABSTRACT………………………………………………………………iv

TABLE OF CONTENTS………………………………………………….vi

LIST OF FIGURES…………………………………………………………… ix

LIST OF TABLES………………………………………………………xi

CHAPTER 1 INTRODUCTION

1.1 Background and Motivation…………………………………………..1
1.2 Purpose and Scope…………………………………………………...3
1.3 Research Methodology……………………………………………….3
1.4 Thesis Framework…………………………………………………….5

CHAPTER 2 LITERATURE SURVEY AND THEORETICAL BACKGROUND

2.1 The Innovation Cycles……………………………………………….6
2.2 The Incentives for R&D………………………………………………7
2.3 The Efficiency vs. Replacement Effect……………………………..8
2.4 The Learning and Experience Curve Effect………………………11
2.5 Competing for Standards…………………………………………..16
2.6 Protection of Intellectual Properties……………………………….20
2.7 Strategic Cooperation………………………………………………23


CHAPTER 3 OVERVIEW OF THE SEMICONDUCTOR INDUSTRY AND THE “COPY EXACTLY” MODEL

3.1 The Development of the Semiconductor IC Industry……………27
3.2 The IC Manufacturing Flow and Supply Chain…………………..30
3.3 Yield and Defect Density…………………………………………...32
3.4 General Prognosis of the IC Industry……………………………..33
3.5 Market Trend of Global Semiconductor Industry………………...40
3.6 Vertical Disintegration-The Foundry Business
Model Overview…………………………………………………...45
3.7 The Moore’s Law……………………………………………………54
3.8 The “Copy Exactly” Model………………………………………….58
3.8.1 The Motivation of the “Copy Exactly” Methodology…………58
3.8.2 The “Copy Exactly” Approach…………………………………63
3.8.3 Results…………………………………………………………..65
3.8.4 Discussion………………………………………………66

CHAPTER 4 TECHNOLOOGY RAMP-- A FOUNDRY PERSEPCTIVE

4.1 Business Impact on Foundry Technologies………………………69
4.2 Multiple Offerings of Product and Technology…………………...70
4.3 The Business Process Flow……………………………………….72
4.4 Escalating Cost of Advanced Technologies……………………...73
4.5 Time to Volume……………………………………………………...75
4.6 The Technology Development Cycle……………………………..76
4.7 Equipment Migration and Manufacturing Strategy………………80
4.8 Yield Learning and Fast Yield Ramp……………………………...82

CHAPTER 5 COMPARISON OF TECHNOLOGY RAMP MODELS

5.1 Business Model and Financial Performance…………………….86
5.2 Organization Approach for Technology Ramp…………………..88
5.3 Dedicated or Shared Facility………………………………………90
5.4 Summary…………………………………………………………….92

CHAPTER 6 CONCLUSIONS………………………………………………94

REFERENCE………………………………………………………………99

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