|
[1]G.E. Thompson, G.C. Wood, Nature 290 (1981) 230. [2]S.M. Chou, H. Leidheiser Jr., Ind. Eng. Chem. Prod. Res. 25 (1986)473–478. [3]K. Kobayashl, K. Shimizu, J. Electrochem. Soc. 135 (1988) 908. [4]G. Patermerakis, K. Moussoutzanis, J. Electrochem. Soc. 142 (1995)737. [5]F. Keller, M. Hunter, D. Robinson, J. Electrochem. Soc. 100 (1953)411. [6]S. Wernick, R. Pinner, P.G. Sheasby, England, 1987. [7]D. R. Gabe and I. H. Dowty, Surf. coat. technol., 30(1987)309. [8]P. Skeldon, K. Shimizu, G.E. Thompson, G.C. Wood, Thin Solid Films 123 (1985) 127. [9]A. Despic, V. Parkhutik, J.O.M. Bockris, R.E. White, B.E. Conway (Eds.), Modern Aspects of Electrochemistry, vol. 20, Plenum Press, New York, 1989, p. 401. [10]G.C. Wood, P. Skeldon, G.E. Thompson, K. Skeldon, J. Electrochem. Soc. 143 (1996) 74. [11]T. Abe, T. Uchiyama, T. Otsuka, J. Met. Finish. Soc. Jpn. 26 (1975) 168. [12]J. Saito, M. Ikegaya, T. Takahashi, J. Met. Finish. Soc. Jpn. 27 (1976) 511. [13]D.G. Adrews, Trans. Inst. Met. Finish. 58 (1980) 13. [14]C. Barnes, Rev. Prog. Color. 14 (1989) 127. [15]T.W. Jelinek, Galvanotechnik 79 (1988) 60. [16]N. Thorne, G. Thompson, R. Furneaux, G.Wood, in: R.S. Alwitt, G.E. Thompson (Eds.), Proc. Symp. on Aluminum Surf. Treatment Technol., The Electrochem. Society, Pennigton, NJ, 1986, p. 274. [17]A.S. Doughty, G.E. Thompson, J.A. Richardson, G.C. Wood, Trans. Inst. Met. Finish. 53 (1975) 33. [18]Asada, British Patent 1,121,228 (1968). [19]A.K. Sharma, H. Bhojraj, V.K. Kaila and H. Narayanamurthy, Metal Finishing, 12 (1997) 14. [20]Su. Yongqing, Metal Finishing, 12 (2000)21. [21]M.F. Morks, A.S. Hamdy, N.F. Fahim, M.A. Shoeib, Surface & Coatings Technology 200 (2006) 5071 – 5076. [22]H. Masuda, M. Yotsuya, M. Asano, K. Nishio, M. Nakao, A. Yokoo, T. Tamamura, Appl. Phys. Lett. 78. 826 (2001). [23]J. S. Sun, J. S. Lee, Appl. Phys. Lett. 75, 2047 (1999). [24]C. Y. Liu, A. Datta, Y. L. Wang, Appl. Phys. Lett. 78, 120 (2001). [25]D. R. Gabe and I. H. Dowty, Surf. coat. technol., 30(1987)309. [26]F. Keller, M. S. Hunter and D. L. Robinson, J. Electrochem. Soc., 100 (1953)411. [27]S. Wernick and R. Pinner, The Surface Treatment and Finishing of Aluminum and its Alloy, Vol. 1(1972)297. [28]S. Setoh and A. Miyata, Sci. Pap. Inst. Phys. Chem. Res, Tokyo. (1932) 189. [29]Digby D. MacDonald and P. Butler, Corros. Sci. 13 (1973) 259. [30]H. H. Shih and S. H. Tzou, Surf. coat. technol., 124 (2000)278. [31]C.L. Raub and A. Knodler, Plating surf. finish., 32 (1978)65. [32]D.S. Lashmore, I. Weisshaw and K. Pratt, Plating surf. finish., 48 (1986)73. [33]Y. T. Pang, G. W. Meng, L. D. Zhang, W. J. Shan, C. Zhang, X. Y. Gao, A. W. Zhao, Y. Q. Mao, J. Solid State Electrochem (2003). [34]O. Takahito, Y. Shinya, and E. Masayoshi, Nanotechnology 14 (2003). [35]I. Serebrennikova, P. Vanysek and V. I. Birss, Electrochim. acta., 42 (1997)145. [36]S. Yongqing, M. Zihe, G. Jiaqiang and Y. Yuan, Met. finish., 97 (1999)8. [37]Su Yongqing, Met. finish., 98 (2000)61. [38]J.F. Murphy and C. E. Michelson, Proceedings of Conference on Anodizing Aluminum, (1991)83. [39]T. Sato, Plating surf. finish., 78 (1991)70. [40]Jerome Kruger, The Johns Hopkins University Baltimore, MD 21218, USA (April, 2001) [41]Mason, R.B., fowle, P.E. J.Electrochem. Soc., 101 (1954) No.2 2,53-59.
|