臺灣博碩士論文加值系統

本研究發展一項新的微製造技術用來開發可撓式溫度感測器陣列與40×1陣列平面溫度感測器，可撓式元件利用兩層聚醯亞銨(polyimide)將一層低應力氮化矽薄膜(Low stress Si3N4)、鉑電阻感溫元件陣列以及內部連結導線緊密包覆，首先將感測器陣列製作在氮化矽薄膜上，再配合蝕刻終止技術形成可撓式薄膜。溫度感測器之靈敏度可以達到75 mV/℃，對電子訊號之響應頻率也可以達到160 kHz。其中可撓式溫度感測器陣列，在7mm×7mm的面積裡有8×8陣列溫度感測器，可撓式溫度感測器陣列可以貼附在具有高彎曲度的表面，以進行溫度量測；40×1陣列平面溫度感測器，在2cm×7mm的面積裡有40個溫度感測器以直線方式排列，用以測量流體經過平面物體所產生之渦旋(Vortex number)與溫度變化的關係。
本研究為可撓式溫度感測器陣列與40×1陣列溫度感測器之研發，用以量測環境中溫度場的密集變化。感測器主要應用的原理是利用鉑(platinum)金屬在量測範圍為0℃∼630℃時，電阻值對溫度變化率為線性變化的特性來設計。以此方式製造之薄膜感測器與傳統感測器做比較，具有體積小、空間解析度高、響應速度快等優點。本研究對兩種溫度感測器物理特性與電性作比較，並就感測器完成後之實驗校正的部分作討論。

目次
第一章 緒論…………………………………………………………………1
1-1 前言……………………………………………………………………1
1-2 微機電系統 (Micro-Electro-Mechanical-Systems)…………3
1-3 研究動機與目標………………………………………………………4
1-4 文獻回顧………………………………………………………………5
1-4-1 微型溫度感測器發展現況………………………………………5
1-4-2 可撓式感測器發展現況…………………………………………8
第二章 溫度感測器原理與設計…………………………………………12
2-1 前言……………………………………………………………………12
2-2 溫度感測元件應用原理…………………………………………… 13
2-1-1 鉑熱電阻感測原理…………………………………………………………………………… 13
2-1-2 電阻溫度係數(Temperature Coefficient of Resistance)…14
2-2 溫度感測元件設計……………………………………………15
2-2-1 電阻值計算…………………………………………………15
2-2-2 8×8陣列可撓式溫度感測器設計………………………15
2-2-3 40×1陣列平面溫度感測器設計…………………………17
第三章 材料與製程方法……………………………………………18
3-1 簡介……………………………………………………………18
3-2 可撓式溫度感測器陣列製程簡介………………………………18
3-2-1 晶片清潔……………………………………………………20
3-2-2 微影製程……………………………………………………21
3-2-3 蒸鍍金屬層製程……………………………………………25
3-2-4 化學氣象沈積低應力氮化矽薄膜製程……………………28
3-2-5 金屬層剝離 ………………………………………………29
3-2-6 蝕刻…………………………………………………………30
3-2-6-1 濕式蝕刻 ………………………………………………30
3-2-6-2 乾式蝕刻 ………………………………………………31
3-3 40×1 溫度感測器陣列製程簡介………………………………33
3-4 製程結果與討論…………………………………………………34
3-4-1 可撓式溫度感測器陣列之製程討論………………………34
3-4-1-1 微影製程討論…………………………………………34
3-4-1-2 鉑金屬層剝離製程討論………………………………35
3-4-1-3 晶片背面蝕刻與低壓化學氣相沈積氮化矽薄膜之間的關係…35
3-4-2 40×1溫度感測器陣列製程討論…………………………36
3-4-3 熱處理對感測器電阻溫度係數TCR的影響………………37
第四章 實驗結果與討論………………………………………………38
4-1 感測器參數校正…………………………………………………38
4-1-1 定電流電路量測感測器頻率響應以及測試電阻溫度係數…38
4-1-2 可撓式溫度感測器陣列量測結果…………………………39
4-1-2-1 平面式溫度感測器量測結果…………………………39
4-1-2-1-1 感測器之頻率響應………………………………39
4-1-2-1-2 感測器之電阻對溫度變化………………………40
4-1-2-1-3 利用定電流電路將溫度訊號轉換為電壓輸出訊號…………40
4-1-2-2 可撓式溫度感測器量測結果…………………………41
4-1-2-2-1 感測器之頻率響應…………………………………41
4-1-2-2-2 感測器之電阻對溫度變化…………………………41
4-1-2-3 平面式與可撓式溫度感測器的比較…………………41
4-1-3 40×1陣列平面溫度感測器量測結果………………………42
4-1-3-1 電阻對溫度變化…………………………………………42
4-2 溫度感測器實驗………………………………………………………43
4-2-1 利用定溫度電路量測風速對輸出變化…………………43
第五章 結論與展望…………………………………………………44
5-1 結論……………………………………………………………44
5-2 未來展望.………………………………………………………46

參考文獻
[1] J. W. Gardner, “Microsensors Principle and Application”, Forth Edition, John Wiley & Sons, Inc. 1994.
[2] J. Fraden, “ AIP Handbook of Modern Sensors：physics, designs and application”, First Edition, American Institute of Physics, 1993.
[3] J. B. Huang, C. M. Ho, F. Jiang, and Y. C. Tai, ” Dynamic Behavior and Application of Micro Sensors with Negative Temperature Coefficient, ” Instrumentation and Measurement Technology Conference, Pasadena, CA, USA, vol.2, pp.1191-1194,
1996.
[4] J. Schieferdecker, R. Quad, E. Holzenkämpfer, M. Schulze, “ Infrared thermopile sensors with high sensitivity and very low temperature coefficient, ” Sensors and Actuators A, vol. 47,pp.
422-427, 1995.
[5] U. A. Dauderstädt, P.H.S. de Vries, R. Hiratsuka, P. M. Sarro, “ Silicon accelerometer based on thermopiles, ” Sensors and
Actuators A, vol. 46, pp. 201-204, 1995.
[6] U. Dillner, E. Kessler, S. Poser, V. Barier, J. Műller, “ Low power consumption thermal gas-flow sensor based on thermopiles of highly effective thermoelectric materials, ” Sensors and Actuators
A, vol. 60, pp. 1-4, 1997.
[7] J. B. Lee, I. S. Kim, Y. C. Sim, T. Y. Kim, “ Optimization and fabrication of dual thermopile sensor based on the BEM, ” Sensors
and Actuators A, vol. 64, pp. 179-184, 1998.
[8] D. J. Beebe, D. D. Denton, J. G. Webster, R. G. Radwin, “A Polyimide Packaging Process For A Semiconductor Diaphragm Tactile Sensor, ” Proceedings of the Twelfth Annual International Conference of the IEEE, University of Wisconsin, USA , pp.
1058—1059, 1990.
[9] D. J. Beebe, D. D. Denton, ” A Flexible Polyimide-based Package for Silicon sensors, “Sensors and Actuators A , vol. 44, pp.
57-64, 1994.
[10] M. H. Li, J. J. Wu, and Y. B. Gianchandani, ” High Performance Scanning Thermal Probe Using a low Temperature Polyimide -Based Micromachining Process, “ Micro Electro Mechanical Systems, 2000. The Thirteenth Annual International Conference of the IEEE 2000. Wisconsin Univ., Madison, WI, USA, pp.763 —768,
2000.
[11] T. Stieglitz, H. Beutel, R. Keller, M. Schuettler, J. U. Meyer, “ Flexible, polyimide-based neural interfaces, “ Proceedings of the Seventh International Conference of the IEEE 1999. SanktIngbert,
Germany, pp. 112 —119, 1999.
[12] G. B. Lee, Y. F. Gai, H. C. Wu, Y. C. Lin, J. H. Chou, J. J. Miau, and C. Y. Wei, ” Development of a Surface-Micromachined
Pressure Sensor on a Flexible Substrate,”(1999).
[13] F. Jiang, G. B. Lee, Y. C. Tai, C. M. Ho, ”A flexible
micromachine-baesd shear-stress sensor array and its application to separation- point detection,” Sensors and Actuators A, vol. 79, pp. 194-203, 2000.
[14] F. Jiang, Y. C. Tai, K. Walsh, T. Tsao, G. B. Lee, C. M. Ho, “A flexible MEMS technology and its first application to shear stress sensor skin,” Micro Electro Mechanical Systems, 1997. Proceedings, IEEE., Tenth Annual International Workshop,
Pasadena, CA, USA, pp. 465-470, 1997.
[15] Wen J. Li, John D. Mai, C. M. Ho, “ Sensors and actuators on non-planar substrates, ” Sensors and Actuators A, vol. 73, pp.80-88, 1999.
[16] M. G. Allen, M. Scheidl, R. L. Smith, , ”Design and fabrication of movable silicon plates suspended by flexible supports, ” Micro Electro Mechanical Systems, 1989, Proceedings, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.
IEEE , MA, USA, pp. 76—81, 1989.
[17] M. Uesaka, K. Hakuta, K. Miya, K. Aoki, A. Takahashi, “ Eddy-current testing by flexible microloop magnetic sensor array, ” Magnetics, IEEE Transactions, Japan, vol. 34, Issue 4, Part
2, pp. 2287—2297, July 1998.
[18] R.H. Liu, M. J. Vasile, D. J. Beebe,” The fabrication of nonplanar spin-on glass microstructures, “ Microelectromechanical Systems,
USA, vol. 8, Issue 2 , pp. 146—151, June 1999.
[19] S. M. Sze, “Semiconductor Sensors, ” First Edition, John Wiley & Sons, Inc. 1994.
[20] H. Esch, G. Huyberechts, R. mertens, G. Maes, J. Manca, W. De Ceuninck, L. De Schepper, “The stability of Pt Heater and temperature sensing elements for silicon integrated tin oxide gas sensors, ” Sensors and Actuators B, vol. 65, pp. 190-192, 2000.
[21] 吳東權, 鄭泗東, 周敏傑, 陳世洲, 蔡明杰, 林盈熙, 林育生, 邱能信, “微機電系統之技術現況與發展”, 財團法人工業技術研
究院機械工業研究所, 民國八十八年二版修訂.
[22] D. William, Jr. Callister, “Materials Science and Engineering”,
Third Edition, John Wiley & Sons, Inc. 1994.