臺灣博碩士論文加值系統

本研究係以黃光微影製程並使用氫氧化鉀蝕刻(100)晶面的矽作為非等向性溼式蝕刻之製程，製備俱{111}面與(100)面夾54.74度的倒四角錐體矽模仁；並利用聚二甲基矽氧烷(PDMS)翻印矽模仁，由於PDMS之易拉伸性質而將PDMS施予單軸向拉伸以改變結構尺寸上及{111}面與(100)面夾角角度的改變；利用紫外光硬化技術將拉伸的PDMS之結構轉印，並使用電鑄技術將俱有倒四角錐體結構的UV膠翻印以當作高分子熱壓的模仁；最後將熱壓的高分子做光學檢測，並得到光的繞射圖形。

In this thesis, the Si mold containing inverted pyramid patterns with 54.74 degree between {111} planes and (100) plane was manufactured by photolithography process and Si (100) was prepared with KOH etching process for the anisotropic wet etching process. The polydimethylsiloxane was used to reprinted the structure of the si mold. Because polydimethylsiloxane was elongated easily, polydimethylsiloxane was forced to elongate single-axially to change the degree of the angle between {111} planes and (100) plane and the dimension of the structure. By using UV curing technology, the structure of the elongated PDMS would be reprinted. And then the electroforming technology was used to reprinted the UV curing agent with the structure of the inverted pyramid patterns for being the mold of polymer hot embossing. Finally, polymer was used for optical test and get diffraction pattern of the photo.

總目錄
總目錄…………………………………………………………………I
圖目錄…………………………………………………………………III
表目錄…………………………………………………………………VI
中文摘要………………………………………………………………VII
英文摘要………………………………………………………… VIII
壹、導論………………………………………………………………1
1-1 前言……………………………………………………………1
1-2 文獻回顧………………………………………………………4
1-2-1濕蝕刻原理……………………………………………4
1-2-2 軟微影…………………………………8
1-2-3 電鑄原理………………………………………………9
1-3研究範疇………………………………………………………13
貳、實驗設計……………………………………………………22
2-1實驗材料………………………………………………………22
2-2實驗設備………………………………………………………22
2-3實驗步驟………………………………………………………23
2-3-1矽模仁製作……………………………………………23
2-3-2 PDMS 翻印矽模仁……………………………………25
2-3-3 PDMS 拉伸……………………………………………26
2-3-4 UV膠轉印……………………………………………26
2-3-5電鑄模仁………………………………………………27
2-3-6雙軸向拉伸……………………………………………29
2-3-6熱壓成型………………………………………………29
2-3-7光學測試………………………………………………29
參、結果與討論…………………………………………37
3-1 矽晶圓之金字塔形模仁製作………………………………37
3-1-1 矽晶圓蝕刻與倒四角錐形成機制……………………37
3-1-2 矽晶圓蝕刻後之金字塔缺陷形成…………………38
3-2 PDMS翻印矽模仁結構及UV膠翻印………………………39
3-3 拉伸試片形狀之PDMS拉伸與UV硬化及電鑄翻印………41
肆、結論……………………………………………………………60
伍、參考文獻………………………………………………………61





圖目錄
圖1-1 熱壓成型與射出成型之示意圖……………………………….16
圖1-2 LIGA製程技術示意圖…………………………………………16
圖1-3 等向性濕蝕刻之示意圖………………………………...….…..17
圖1-4 矽的晶格結構之示意圖………………………………………..17
圖1-5 常用立方晶體面之米勒指標……………..……………………18
圖1-6 濕蝕刻反應機制…………………..……………………………18
圖1-7 PDMS當模仁並利用紫外光硬化成型技術之流程…..................19
圖1-8 電鑄原理與基本架構..................................................................20
圖1-9 不同高深寬比之結構，電鑄時模穴內的質傳定性模式...........20
圖1-10 一維擴散位移之單位流量的變化............................................21
圖1-11 改善電鑄層均勻性之裝置........................................................21
圖2-1 光罩30×30μm的正方形且線寬為2μm的間距之陣列............30
圖2-2 未蝕刻之矽晶片..........................................................................30
圖2-3 藉由OM得知是否蝕刻完畢........................................................31
圖2-4 矽模仁製作之示意圖.................................................................32
圖2-5 PDMS翻印矽模結構之機構示意圖.............................................33
圖2-6 PDMS拉伸機構示意圖:(a)數位式測微頭；(b)滑塊；(c)彈簧；(d)圓棒；(e)頂銷置入處...........................................................34
圖2-7 UV膠轉印之流程示意圖.............................................................35
圖2-8 雷射光路徑俯視圖......................................................................36
圖3-1 俱倒四角錐體結構之矽模仁之SEM圖......................................43
圖3-2 微小金字塔結構缺陷之四面體與八面體之SEM圖..................44
圖3-3 氫氣導致微小金字塔缺陷的機制示意圖..................................45
圖3-4 氫氣泡與矽晶圓之界面關係(a)斥水(b)親水..........................45
圖3-5 PDMS翻印矽模仁結構之SEM圖.................................................46
圖3-6 UV膠翻印未拉伸的PDMS結構之SEM圖.................................47
圖3-7 UV過度曝光未拉伸的PDMS之PDMS SEM圖(曝光時間30秒) ...48
圖3-8 UV過度曝光拉伸的PDMS之UV膠 SEM圖(曝光時間30秒) .... 49
圖3-9 UV曝光拉伸的PDMS之UV膠 SEM圖(UV膠試片中間) .............50
圖3-10 UV曝光拉伸的PDMS之UV膠 SEM圖(UV膠試片邊界) ............51
圖3-11 試片拉伸變化示意圖；上圖為PDMS拉伸前的示意圖，下圖為PDMS拉伸固定後的示意圖.................................................52
圖3-12 UV曝光拉伸的PDMS之UV膠 SEM圖.......................................53
圖3-13經ㄧ次拉伸之電鑄模仁 OM圖...................................................54
圖3-14 二次拉伸之UV SEM圖................................................................55
圖3-15 經二次拉伸之電鑄模仁 OM圖.................................................56
圖3-16 經二次拉伸且電鑄之熱壓的高分子 SEM圖...........................57
圖3-17 Si模熱壓的高分子之繞射數位照…………………...............58
圖3-18 二次拉伸後鎳模熱壓的高分子之繞射數位照........................59

表目錄
表1-1 MEMS領域之微製造技術分類表.................................................15

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