中文部分
[1] 王通成（2000），筆記型電腦廠製造流程分析碩士論文：電路板組裝線，國立清華大學工業工程研究所。[2] 方國富(民89)，多品質特性產品之穩健參數設計碩士論文，國立成功大學工業管理科研究所。[3] 史開泉、吳國威、黃有評（1994），灰色信息關係論，全華科技圖書股份有限公司。
[4] 白振義（1993），「灰色關聯分析研究綜述」，灰色系統理論與實踐，第3卷第1期，pp.119-122。
[5] 朱豔芳(民86)，整合品質機能展開與田口方法之穩健品質設計模式博士論文，台灣大學商學研究所。[6] 宋永兆 (1999)，「利用AOI 和ICT 來增加利潤」，SMT 設備與PCB 組裝測試設備雜誌，pp.152-155。
[7] 吳俊義(民90)，提昇基層陶瓷電容器電性檢驗良率之研究碩士論文-以田口方法進行篩選設備參數設定最佳化，元智大學工業工程與管理研究所。[8] 李思賢(民89)，田口品質工程應用於鋁輪圈高壓鑄造製程參數之研究碩士論文，元智大學工業工程與管理研究所。[9] 林常平（1995.08），「灰色系統-灰色的世界?灰色的思想?」，自動化科技。[10] 易德生、郭萍（1992），灰色理論與方法─提要、題解、程序、應用，石油工業出版社。
[11] 柯瑞芬(民86)，多重品質特性之產品穩健設計決策模式碩士論文，國立成功大學工業管理科研究所。[12] 紀勝財、徐立章（2000），「模糊多重品質特性田口實驗設計法之建立與電漿電弧銲接之應用」，Journal of the Chinese Institute of Industrial, Vol. 18, No 4, pp.97-110
[13] 張華基(民90)，田口方法於半導體封裝製程改善之應用碩士論文，交通大學工業工程與管理學系。[14] 張志平、詹曉苓、連啟泰 (2000)，「應用田口方法於空氣濾清器製程改善」，中華民國品質學會第六屆全國品質管理研討會。
[15] 陳信憲(民90)，結合6σ手法與田口實驗設計對改善製程能力之研究碩士論文，國防管理學院資源管理研究所。[16] 陳明宏(民86)，多種品質特性在動態系統中之研究碩士論文，中原大學工業工程研究所。[17] 張哲維(民86)，模糊多屬性決策方法應用於田口方法多重品質特性問題碩士論文-以IC 製造為例，中華大學工業工程與管理研究所。[18] 鄭燕琴（1995），田口品質工程技術理論與實務，中華民國品質管制學會。
[19] 劉漢淳 (1999)，「一種比刮刀更可靠、耐用、快速的新印刷技術」，SMT 設備與PCB 組裝測試設備雜誌，pp.117-120。
[20] 鄧聚龍（1992），灰色系統理論教程，華中理工大學出版。
[21] 蕭綱衡 (1990)，「田口式參數設計在鐵礦燒結之應用研究」，中國統計學報，第二十八卷第二期，pp.253-275。[22] 蘇木春、張孝德（1997），機器學習類神經網路、模糊系統以及基因演算法則，全華科技圖書。
[23] 蘇朝墩（1997），產品穩健設計，中華民國品質管制學會。
英文部分
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[33] Lau, J. H.（1996）, Flip Chip Technologies, McGraw-Hill, New York.
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[38] Markstein, H. W. (1997), “Controlling the Variables in Stencil Printing,” Electronic Packaging & Production, Vol. 37, No. 2, pp.48-56.
[39] Owczarek, J. A. and F. L. Howland (1990a), “A study of the Off-contact Screen Printing Process-Part I: Model of the Printing Process and some Results Derived from Experiment,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, No. 2, pp.358-367.
[40] Owczarek, J. A. and F. L. Howland (1990b), “A Study of the Off-contact Screen Printing Process-Part II: Analysis of the Model of the Printing Process,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, No. 2, pp.368-375.
[41] Pearson, K. (1901), “On Lines and Planes of Closest Fit to Systems of Points in Spaces,” Philosophical Magazine, Series 6,Vol.2, pp.559-572.
[42] Phadke, M. S. (1989), Quality Engineering Using Robust Design, AT&T Bell Laboratories.
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[46] Ries, B. (2000), Inspection Strategies for Process Control, Circuits Assembly, March.
[47] Sahay, C., L. M. Head, R. Shereen, P. Dujari, J.H. Constable and G. Westby (1995), “Study of Print Release Process in Solder Paste Printing, Journal of Electronic Packaging,” Vol. 117, pp.230-234.
[48] Tong, L. I. and C. T. Su (1997a), “Multi-Response Robust Design by Principal Component Analysis,” Total Quality Management, Vol.8, No.6, pp.409-416.
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[52] Whitmore, M., C. Mackay and A. Hobby (1997), “Plastic Stencils for Bottom-side Chip Attach,” Electronic Packaging & Production, Vol. 37, No. 13, pp.68-72.