臺灣博碩士論文加值系統

由於，LED晶片體積較小，累積的熱能不易散發，造成其亮度減低、壽命減短與波長飄移等問題，因此，在研發LED產品時，散熱機構的設計是一個很重要的課題。本研究針對產學合作廠商所開發的LED崁燈，先以Autodesk Inventor繪製散熱機構，再匯入CFDesign中，設置其材料係數、邊界條件及網格劃分等步驟後，進行散熱機構熱模擬分析，以實驗數據與模擬結果互相比對，確認模擬的材料係數、邊界條件及網格設置之正確性。再以此模擬條件進行散熱機構之參數變化，來探討在自然對流的情況下，各種設計對散熱效果之不同影響。最後模擬結果得知，當散熱機構材質更改為導熱系數較高的材質時，散熱效果較佳。更改鰭片數目與間距比較得知，不管散熱機構直徑增加或是縮小，在鰭片數目與間距之設計為5mm效果最佳。關於燈具擺設角度，本論文模擬出擺設為90度 時，散熱溫度上升8.64％，影響散熱效果最明顯。最後，以相同之體積進行兩款散熱機構設計，得到散熱效果有明顯差異。
經由本研究得知，散熱機構之設計（材質、間距、鰭片數、鰭片構型）、和擺設位置都會影響LED燈具的散熱性能，本研究方法、過程和結論，可以提供LED燈具產業製作散熱鰭片的參考。

Since LED chip is smaller than conventional light source, it is easy to distribute and accumulate heat. This can reduce its brightness, shorten its life time and drift wavelength spectrum. So in manufacturing LED products, cooling mechanism is a very important issue.
In this study, academia partners developed LED Down Light was used to simulate the behavior of heat distribution. At first we use Autodesk Inventor to draw heat sink mechanism solid model, i.e., heat sink mechanism, then it is imported to CF Design heat flow analysis simulation software. After setting the coefficient of its materials, boundary conditions and meshing and following steps, we get thermal simulation analysis data.
Alternating the different required conditions, we get some useful results. The heat sink material is one of the important factors for cooling because of its heat transfer parameters. The 5mm spacing of the heat sink’s fins will get the best cooling condition in this case. Tilting heat sink in 90 degrees, the heat temperature will rise 8.64 percent, and this is obvious impact of the cooling effect. Finally, two cooling heat sink models with the similar volume show a significant difference in the cooling effect.
Through this study, we can see the design of the cooling mechanism (material, spacing, number of fins, fin configuration), and fixture orientation will affect the thermal performance of LED lamps. We hope the study methods, processes and conclusions can provide some useful information to LED lighting products.

中文摘要 I
英文摘要 II
圖目錄 VI
表目錄 X
第一章 緒論 1
1.1 研究背景及動機 1
1.2 研究目的與方法 4
1.3 文獻回顧 5
1.4 論文內容 9
第二章 模擬原理與分析分法 10
2.1 LED的發展 10
2.2 LED發光原理 11
2.3 白光LED 12
2.4 CFDesign數值模擬軟體介紹 14
2.5 CFDesign模擬軟體使用之運算方程式 15
2.6 實際測量方式 16
2.7 LED晶片規範 19
2.8 LED散熱途徑 20
第三章 散熱機構模擬流程 20
3.1 散熱模擬流程圖 21
3.2 建立實體模型 22
3.3匯入 CFDesign 並設置外部體積 25
3.4設定各部位材料係數 27
3.5設定邊界條件 30
3.6 設定網格尺寸 32
3.7設定求解方式 34
3.8模擬結果顯示 35
第四章 模擬結果與設計分析 37
4.1 初始模擬結果 37
4.2散熱機構材質分析 39
4.3散熱機構鰭片數目模擬 42
4.4 散熱器最佳擺放角度模擬 49
4.5 改變散熱機構外型設計模擬 52
第五章 結論與未來展望 57
5.1 結論 57
5.2 未來展望 59
參考文獻 60
誌謝 64

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