臺灣博碩士論文加值系統

本研究探討電鍍鑽石磨削工具對強化玻璃基板之磨削加工，使用四種不同鑽石種類及大粒徑與小粒徑鑽石，相對鑽石強度分別為YK-JQ-SMB(低強度)、YK-JQ(低強度)、PK-5(高強度)、P5Y-J(中強度)，比較不同(1)鑽石種類與粒徑，(2)進給率，(3)順磨削及逆磨削等，分析鑽石磨棒之鑽石突出度及作用顆粒比例對玻璃磨邊、鑽孔及溝槽加工產生破裂之影響。
實驗結果顯示：(1)玻璃磨邊加工：當使用較小粒徑及較窄粒徑分佈的鑽石磨棒，將呈現相對較小的鑽石突出度，乾磨削玻璃邊緣產生較小破裂。當使用大粒徑者以40-50μm之低強度鑽石YK-JQ磨棒所得磨邊破裂比36-54μm之高強度鑽石P5Y-J者相對較小；但使用小粒徑者以20-30μm之高強度鑽石P5Y-J的磨棒相對比22-36μm之低強度鑽石YK-JQ者呈現較小破裂。當使用逆磨削與較快進給率乾磨削玻璃基板所產生磨邊破裂較小。(2)玻璃鑽孔及溝槽加工：啄鑽深度及冷卻液出水量對於濕磨削玻璃鑽孔及溝槽破裂影響大。當使用較小粒徑22-36μm之低強度鑽石YK-JQ磨棒所得玻璃鑽孔破裂比使用大粒徑、鑽石突出度差大及36-54μm之高強度鑽石PK-5磨棒者相對較小。

The purpose of the paper investigated the grinding chipping of the glass substrates using the electroplated diamond tools. Using four kinds of different diamonds and two diamond sizes; the strength of the diamonds was a low strength of YK-JQ-SMB and YK-JQ, a high strength of PK-5, and a middle strength of P5Y-J. Comparing the different (1) diamond types and size, (2) feed rate, and (3) up grinding and down grinding would be studied to analyze the effect of diamond protrusion and working particles of the tools on the chipping of glass grinding edge, drilling holes, and slot processing.
The experiment results showed that (1) For glass edge grinding, when the smaller grit size and the narrower particle size distribution of the diamond grinding tools were used during dry grinding, the smaller diamond protrusion obtained can produce a smaller chipping size of the glass substrates. The tools containing the larger size of 40-50 μm with a lower diamond strength of YK-JQ after grinding glass can get a smaller chipping than that of a higher strength of P5Y-J with a grit size of 36-54 μm. For a smaller diamond size, the tool using a higher diamond strength of P5Y-J of 20-30 μm can obtain a relatively smaller chipping than that of a lower strength of diamond YK-JQ of 22-36 μm. In addition, the tool containing a higher strength of P5Y-J with an irregular shape can produce a smaller chipping of glass than that of PK-5 with a regular shape. Furthermore, when an up grinding and a faster feed rate employed during dry grinding glass can obtain a smaller edge chipping. (2) For glass drilling holes and slots processing, drilling depth and the amount of cooler fluid have greatly effected on wet grinding glass holes and slots. Using a tool with a smaller grit size, and a low strength diamond of YK-JQ 22-36 μm can obtained a smaller glass chipping than that of a larger size, a larger difference of grit protrusion and a higher strength diamond of PK-5 36-54 μm.

目錄
致謝 I
摘要 II
Abstract III
表目錄 VII
圖目錄 VIII
第一章 緒論 1
1.1 研究動機 1
1.2文獻回顧 2
1.3研究目的 7
1.4 本文內容 8
第二章 理論基礎 9
2.1磨削加工原理 9
2.1.1磨粒加工 9
2.1.2 硬脆材料受壓印的特性 11
2.1.3 鑽石磨棒磨削中切刃之變化 13
2.2 磨削模式 15
2.3 鑽石磨粒種類 18
第三章 實驗程序與設備 21
3.1 磨削加工實驗流程 21
3.1.1 電鍍鑽石磨棒外型尺寸 25
3.1.2 鑽石突出度 26
3.1.3 單位面積之鑽石顆粒數 26
3.1.4 光學強化玻璃材料 27
3.1.5 磨削條件 29
3.1.6 磨削實驗步驟 31
3.2 玻璃磨削實驗 31
3.2.1 玻璃邊磨削破裂觀察 31
3.2.2 玻璃鑽孔破裂觀察 33
3.2.3 玻璃溝槽磨削破裂觀察 34
3.3磨削實驗設備及分析儀器 35
第四章 實驗結果與討論 40
4.1 鑽石突出度與單位面積顆粒數 40
4.2 磨削玻璃邊緣加工 42
4.2.1鑽石突出度對玻璃磨邊破裂之影響 46
4.2.2電鍍磨棒單位面積作用之鑽石顆粒數 48
4.2.3鑽石作用顆粒數對玻璃磨邊破裂之影響 51
4.2.4玻璃邊破裂尺寸與鑽石作用顆粒數最大差值之影響 52
4.3玻璃鑽孔加工 54
4.3.1玻璃鑽孔加工條件 54
4.3.2玻璃鑽孔 58
4.3.3玻璃破裂最大孔徑與鑽石突出度 79
4.4玻璃溝槽加工 80
第五章 結論 87
第六章 未來展望 89
參考文獻 90
作者簡歷 93

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