Metal Handbook, A. W. Worcester and J. T. O’Reilly, ASM, 10th Edition, (1990), Vol. 2, pp.543-556.
.S. Jin, “Developing Lead-Free Solders: A Challenge and Opportunity”, JOM, July (1993), pp.13.
.S. S. Kang and A. K. Sarkhel, “Lead Free Solders for Electronic Packaging”, J. Elec. Mater., Vol. 23, (1994), pp.701-707.
.M. McCormack, S. Jin, H. S. Chen, and D. A. Machusak, “New Lead-Free Sn-Zn-In Solder Alloys”, J. Elec. Mater., Vol. 23, (1994), pp.687-690.
.J. Glarzer, “Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly: A Review”, J. Elec. Mater., Vol. 23, (1994), pp.693-700.
.W. B. Hampshire, “The Search for Lead-Free Solders”, Soldering and Surface Mount Tech., No. 14, June (1993), pp.49-52.
.N. C. Lee, “Getting Ready for Lead-free Solders”, Soldering and Surface Mount Techn., No. 26, July (1997), pp.65-69.
.United States Patent, No. 6241942 B1, Jun. 5, 2001.
.T. Takemoto, T. Funaki, and A. Matsunawa, “Electrochemical Investigation on the Effect of Silver Addition on Wettability of Sn-Zn System Lead-Free Solder”, J. Jpn. Welding Soc., Vol. 17, No. 2, (1999), pp.251-258.
.K. L. Lin, and C. L. Shih, “Wetting interaction between Sn-Zn-Ag solders and Cu”, J. Elec. Mater., Vol. 32, (2002), pp.95-100.
.United States Patent, No. 5698160, Dec. 16, 1997.
.J. M. Song, G. F. Lan, T.S. Lui and L. H. Chen, “Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys”, Scripta Mater., Vol. 48, No. 8, (2003), pp.1047-1051.
.United States Patent, No. 5718868, Feb. 17, 1998.
.Y. S. Kim, K. S. Kim, C. W. Hwang and K. Suganuma, “Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys”, J. of Alloys and Compounds, Vol. 352, (2003), pp.237-245.
.N. A. Lange, Handbook of Chemistry, Sandusky, Ohio, 1956, pp.100.
.S. Kikuchi, M. Nishimura, K. Suetsugu, T. Ikari and K. Matsushige, “Strength of bonding interface in lead-free Sn alloy solders”, Materials Science and Engineering A - Structural Materials Properties Microstructure and Processing, Vol. 319, (2001), pp.475-479.
.M. Nishiura, A. Nakayama, S. Sakatani, Y. Kohara, K. Uenishi and K. F. Kobayashi, “Mechanical strength and microstructure of BGA joints using lead-free solders”, Mater. Trans., Vol. 43, No. 8, (2002), pp.1802-1807.
.C. M. L. Wu and M. L. Huang, “Creep behavior of eutectic Sn-Cu lead-free solder alloy ”, J. Elec. Mater., Vol. 31, No. 5, (2002), pp.442-448.
.洪敏雄、游善溥,“電子構裝用無鉛銲錫”,科儀新知第二十卷二期,民國87年,57-66頁。.C. M. L. Wu, D. Q. Yu, C. M. T. Law and L. Wang, “Improvements of microstructure, wettability, tensile and creep strength of eutectic Sn-Ag alloy by doping with rare-earth elements”, J. of Mater. Res., Vol. 17, No. 12, (2002), pp.3146-3154.
.D. G. Ivey, “Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications”, Micron, Vol. 29, No. 4, (1998), pp.281-287.
.W. Sun and D. G. Ivey, “Development of an electroplating solution for code positing Au-Sn alloys”, Materials Science and Engineering B - Solid State Materials for Advanced Technology, Vol. 65, No. 2, (1999), pp.111-122.
.P. L. Liu and J. K. Shang, “Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect”, Scripta Mater., Vol. 44, No.7, (2001), pp.1019-1023.
.H. W. Miao and J. G. Duh, “Microstructure evolution in Sn-Bi and Sn-Bi-Cu solder joints under thermal aging”, Mater. Chem. Phys., Vol. 71, No. 3, (2001), pp.255-271.
.C. B. Lee, S. B. Jung, Y. E. Shin and C. C. Shur, “The effect of Bi concentration on wettability of Cu substrate by Sn-Bi solders”, Mater. Trans., Vol. 42, No. 5, (2001), pp.751-755.
.P. L. Liu and J. K. Shang, “Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect”, Scripta Mater., Vol. 44, No. 7, (2001), pp.1019-1023.
.S. H. Huh, K. S. Kim and K. Suganuma, “Effect of Ag addition on the microstructural and mechanical properties of Sn-Cu eutectic solder”, Mater. Trans., Vol. 42, No. 5, (2001), pp.739-744.
.N. Tamura, R. Ohshita, M. Fujimoto, S. Fujitani, M. Kamino and I. Yonezu, “Study on the anode behavior of Sn and Sn-Cu alloy thin-film electrodes”, J. of Power Sources, Vol. 107, No. 1, (2002), pp.48-55.
.J. W. Morris, Jr., J. L. Freer Goldstein and Z. Mei, “Microstructure and Mechanical Properties of Sn-In and Sn-Bi Solders”, JOM, July (1993), pp.25-27.
.United States Patent, No. 6179935 B1, Jan. 30, 2001.
.ASM Handbook, Vol. 3, Alloy Phase Diagrams, pp.25-383.
.M. J. Voss and H. L. Tsai, “Effects of the Rate of Latent Heat Release on Fluid Flow and Solidification Patterns During Alloy Solidification”, Int. J. Eng. Sci., Vol. 34, No. 6, (1996), pp.715-737.
.M. C. Flemings, “Solidification Processing”, McGraw-Hill International Editions, 1974.
.S. Argyropoulos, B. Closset, J. E. Gruzleski, and H. Oger, “The Quantitative Control of Modification in Al-Si Foundry Alloys Using a Thermal Analysis Technique”, AFS Transactions, (1983), pp.351-358.
.D. M. Stefanescu, G. Upadhya, and D. Bandyopadhyay, “Heat Transfer Solidification Kinetics Modeling of Solidification of Castings”, Metall. Trans. A, Vol. 21A, (1990), pp.997-1005.
.I. G. Chen and D. M. Stefanescu, “Computer-Aided Differential Thermal Analysis of Spheroidal and Compacted Graphite Cast Irons”, AFS Transactions, (1984), pp.947-965.
.K. G. Upadhya, D. M. Stefanescu, K. Lieu, and D. P. Yeager, “Computer-Aided Cooling Curve Analysis:Principles and Applications in Metal Casting”, AFS Transactions, (1989), pp.61-66.
.J. O. Barlow and D. M. Stefanescu, “Computer-Aided Cooling Curve Analysis Revisited,” AFS Transactions, (1997), pp.349-354.
.C. H. Su and H. L. Tsai, “A Direct Method to Include Latent Heat Effect for Modeling Casting Solidification”, AFS Transactions, (1991), pp.781-789.
.J. H. Chen and H. L. Tsai, “Comparison on Different Models of Latent Heat Release for Modeling Casting Solidification”, AFS Transactions, (1990), pp.539-546.
.S. H. Jong, and W. S. Hwang, “Study of Functional Relationship of Fraction of Solid with Temperature in Mushy Range for A356 Al Alloy”, AFS Transactions, (1992), pp.939-946.
.Y. F. Chen, S. H. Jong, and W. S. Hwang, “Effects of Cooling Rate on Latent Heat Released Mode of near Pure Aluminum and Aluminum-silicon Alloys”, Mater. Sci. Tech., Vol. 12, (1996), pp.539-544.
.J. H. Lienhard IV and J. H. Lienhard V, A Heat Transfer Textbook, 3rd Edition, Phlogiston Press, Cambridge, (2002), pp.21-25.
.H. Huang, V. K. Suri, J. L. Hill, and J. T. Berry, “Heat Source/Sink Algorithm for Modeling Phase Changes during Metal Solidification in Castings and Water Evaporation in Green Sand Molds”, AFS Transactions, (1991), pp.685-689.
.S. W. Yoon, J. R. Soh, H. M. Lee and Lee BJ, “Thermodynamics-aided Alloy Design and Evaluation of Pb-free Solder, Sn-Bi-In-Zn System”, Acta Mater., Vol. 45, No. 3, (1997), pp.951-960.
.陳信文,“無鉛銲料簡介”,電子與材料,民國88年,第一期,74-77頁。
.T. Siewert, S. Liu, D. R. Smith and J. C. Madeni, Database for Solder Properties with Emphasis on New Lead-free Solders, Colorado, 2002, pp.57.
.J. R. Lloyd, C. Zhang and H. L. Tan, “Measurements of Thermal conductivity and Specific Heat of Lead Free Solder”, IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, Institute of Electrical and Electronics Engineers, (1995), pp.252-262.
.J. H. Lau and C. Chang, “TMA, DMA, DSC, and TGA of Lead Free Solders”, 1998 Electronic Components and Technology Conference, Seattle, Institute of Electrical and Electronics Engineers, (1998), pp.1339-1344.
.M. McCormack and S. Jin, “Improved Mechanical Properties in New Pb-free Solder Alloys”, J. Elec. Mater., Vol. 23, N0. 8, (1994), pp.715-720.
.J. M. Song and K. L. Lin, “Double peritectic behavior of Ag-Zn intermetallics in Sn-Zn-Ag solder alloys”, J. Mater. Res., Vol. 19, No. 9 (2004), pp.2719-2724.
.R. Hultgren, P. D. Desai, D. T. Hawkins, M. Gleiser and K. K. Kelley, “Selected Values of the Thermodynamic Properties of Binary Alloys”, (American Society for Metals, Metals Park, Ohio, 1973), pp.103-111.
.R. Hultgren, P. D. Desai, D. T. Hawkins, M. Gleiser and K. K. Kelley, “Selected Values of the Thermodynamic Properties of Binary Alloys”, (American Society for Metals, Metals Park, Ohio, 1973), pp.115-121.
.J. D. Cox, D. D., Wagman and V. A. Medvedev, CODATA Key Values for Thermodynamics, Hemisphere Publishing Corp., New York, USA, 1989.
.S. W. Chen, C. C. Lin and C. M. Chen, “Determination of the Melting and Solidification Characteristics of Solders Using Differential Scanning Calorimetry”, Metall. and Mater. Trans. A, 29A (1998), pp.1965-1972.
.A. Mulugeta and S. Gunna, “Lead-free Solders in Microelectronics”, Mater. Sci. Eng., Vol. R27 (2000), pp.95-141.
.R. Hultgren, P. D. Desai, D. T. Hawkins, M. Gleiser and K. K. Kelley, “Selected Values of the Thermodynamic Properties of Binary Alloys”, (American Society for Metals, Metals Park, Ohio, 1973), pp.795-800.
.R. Hultgren, P. D. Desai, D. T. Hawkins, M. Gleiser and K. K. Kelley, “Selected Values of the Thermodynamic Properties of Binary Alloys”, (American Society for Metals, Metals Park, Ohio, 1973), pp.810-822.
.游善溥,博士論文,國立成功大學材料科學及工程學系,(2000),92頁。