臺灣博碩士論文加值系統

本研究目的在於探討電鍍鎳-鎢-磷合金在表面處理上各項電鍍條件影響。製程上將採用硫酸鎳、亞磷酸和鎢酸鈉電鍍液系統製備鎳-鎢-磷合金。針對可能影響鍍層硬度因素，如鍍層之元素含量及奈米組織結構，運用Alpha-Step、FESEM、XRD進行材料微結構觀察與分析。
實驗結果顯示其鍍層硬度、耐高溫、抗磨耗和耐腐蝕性能比純鎳、鎳鎢及鎳磷合金較優良，電流密度提升對於鍍層中鎢含量影響較為明顯，硬度相對提高，但電鍍效率較低，且會導致鍍層表面較不平整情形。亞磷酸的添加量增加則相對影響鍍層中磷含量，電鍍效率相對應降低。而脈衝電鍍能使鍍層鍍層鎢含量提升，且具有降低鍍層內應力和提高電鍍效率之效果。鍍液中pH值越高，鍍層內應力提升，鍍層產生裂紋，且電鍍效率越差。在適當的熱處理溫度下，鎳鎢磷合金的硬度可達900～1100HV，耐磨耗性相對應提高。具有替代硬鉻表面處理能力。

The main purpose of this study is to investigate the effects of various process parameters electrodeposited Ni-W-P alloy on the surface treatment using. The modified Watts bath consisted of nickel sulfate, phosphorous acid and Sodium tungstate solution. The Alpha-Step profilometer, FESEM, XRD were employed for observation and analysis of material microstructure in order to determine the critical factor which inference the coating hardness, such as element content and microstructure of the coating.
The experimental results showed that coating hardness, heat-resistant, wear resistance and corrosion resistance is better than nickel, Ni-W alloy and Ni-P alloy. Increasing current density had obvious effect on the coating tungsten content. The hardness of the coating was increased, but the electroplated efficiency was lower, and the roughness of increased the coating surface. The phosphorus content in coating became higher with the raise in the added amount phosphorous acid, which electroplated efficiency was lower. The use of pulse plating increased tungsten content in coating, and reduced internal stress and improved electroplated efficiency. In addition raising the pH value in solution caused increases in internal stress, the coating surface cracks, and lowered electroplated efficiency. With annealing at appropriate temperature, the Ni-W-P alloy coating hardness reached 900~1100HV, which increased the wear resistance, and became a potential candidate for replacing hard chromium coating.

目錄

中文摘要 i
英文摘要 .ii
誌謝 iv
目錄 v
表目錄 ..viii
圖目錄 ix
第一章 前言 1
1.1 電鍍鎳的發展與應用 1
1.2合金電鍍之發展應用 2
1.3 研究動機與目的 3
1.4 論文架構 3
第二章 基礎理論文獻回顧 4
2.1 電化學沉積基本原理 4
2.2 電化學結晶成長過程與行為 5
2.2.1 金屬電沉積的成長步驟 5
2.2.2 金屬的電結晶 7
2.2.3 電結晶的主要型態 7
2.2.4 影響電鍍層結構的主要因素 8
2.3 合金電鍍 10
2.3.1 合金共鍍的基本條件 10
2.3.2 合金電鍍之電解定律與電流效率 11
2.3.3 鎳鎢合金 12
2.3.4 鎳磷合金 13
2.4 鍍層內應力 15
2.5 鎳鎢磷合金電鍍之影響變因 16
2.5.1 電鍍液組成 16
2.5.2 電流密度及脈衝電鍍 17
2.6 文獻回顧 20
2.6.1 鎳鎢磷合金電鍍文獻 20
2.6.2 電鍍鎳鎢文獻 23
2.6.3 電鍍鎳磷合金文獻 24
第三章 實驗方法 26
3.1 電鍍實驗流程 26
3.1.1 電鍍實驗設備 27
3.1.2 電鍍前處理 29
3.1.3 鎳鎢磷合金電鍍液組成 32
3.2 實驗參數設定 33
3.3 鍍層分析 34
3.3.1 微結構分析 34
3.3.2 成份分析 35
3.3.3 硬度測試 35
3.3.4 鍍層內應力量測 36
3.3.5 X射線繞射分析 38
3.3.6 表面輪廓儀量測 39
3.3.7 磨耗試驗 40
3.3.8 熱處理 42
第四章 結果與討論 43
4.1 亞磷酸含量對鍍層之影響 43
4.1.1 對鍍層成分及電鍍效率之影響 43
4.1.2 鍍層結構分析 45
4.1.3 對鍍層硬度及表面形貌之影響 46
4.2 電流密度對鍍層之影響 49
4.2.1 對鍍層成分及電鍍效率之影響 49
4.2.2 鍍層結構分析 51
4.2.3 對鍍層硬度及表面形貌之影響 52
4.3 脈衝電鍍對鍍層之影響 55
4.3.1 對鍍層成分及電鍍效率之影響 55
4.3.2 鍍層結構分析 58
4.3.3 對鍍層硬度之影響 59
4.4 添加劑對鍍層之影響 61
4.4.1 pH值對於電鍍鎳鎢磷之影響 61
4.4.2 硼酸對於鍍液pH緩衝之影響 65
4.4.3 潤濕劑對鍍層平整性的影響 66
4.5 熱處理 68
4.6 磨耗試驗 72
4.7 內應力分析 75
第五章 結論 79
5.1電鍍參數對於鍍層之影響 79
5.2電鍍液組成對於鍍層之影響 79
5.3熱處理對鍍層硬度之影響 80
5.4未來展望 81
參考文獻 82

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