臺灣博碩士論文加值系統

本研究採用鎳基鍍浴並添加Trimethylamineborane(TMAB)作為硼離子來源，發展Ni-B合金及複合鍍層，製備方式共分為三種製程技術 (1)直流電沉積Ni-B合金鍍層、(2)脈衝電沉積合Ni-B合金鍍層、(3)直流電沉積Ni-B/BN(h)複合鍍層，並分別探討鍍層抗腐蝕性能與抗磨特性，成果如下：
直流電沉積Ni-B合金鍍層製程結果顯示鍍層內硼含量值4.38 at.%，最高硬度值954 Hv，有較佳之抗磨耗性能，磨耗實驗平均摩擦係數值0.519，磨耗損失值0.13 mg，最低腐蝕電流密度Icorr(A/cm2)值3.22×10-7，具良好之抗腐蝕性能。脈衝電沉積應用L9(34)實驗設計法輔助製備PC-Ni-B合金鍍層，利用脈衝間歇休鍍特性，改善直流電沉積容易產生吸氫效應所引起鍍層裂紋缺陷之情形，在相同電流密度5 A/dm2條件下，所得鍍層硼含量為脈衝(7.39 at.%)與直流(2.21 at.%)，脈衝鍍層硼含量能有效提升3.3倍；脈衝製程參數為硼離子濃度0.08 M、負載循環(γ)0.2、脈衝頻率100 Hz；此條件鍍層硬度提升至1035 Hv、平均摩擦係數值0.396，磨耗損失值0.11 mg，相比較直流鍍層提升15.4 %抗磨耗性能，平均摩擦係數降低23.7%，其有最低腐蝕電流Icorr(A/cm2)值1.21×10-7，抗腐蝕性能與直流電鍍層相當。在鍍浴中添加BN(h)六方氮化硼固體自潤滑微粒，成功製備出Ni-B/BN(h)複合鍍層，在硼含量3.72 at.%能使得硬度值能高達935 Hv，其鍍層BN(h)體積百分率含量9.1 Vol.%，有最低平均摩擦係數值為0.383，相較直流鍍層降低26.2 %改善摩擦阻力，BN(h)微粒體積百分率值為0.8 Vol.%時，有最低之腐蝕電流密度(A/cm2)值6.37×10-8，相較直流與脈衝Ni-B合金鍍層之抗腐蝕能力有顯著提升。

In this study, Ni–B alloy and composite coatings were prepared under both direct current (DC) and/or pulse current (PC) conditions from a nickel-plating bath with and without BN(h). The Trimethylamineborane (TMAB) was used as the boron source. The corrosion resistance and anti-wear characteristics of the coatings were explored.
Our results found that the boron content in the N-B alloy coatings prepared by DC electrodeposition process decreases significantly with increasing deposition current density. A maximum hardness of about 954 Hv, a minimum wear loss of 0.13 mg, and a lowest corrosion current density (Icorr) value of 3.22 × 10-7 A/cm2 were obtained for a nanocrystalline Ni-B coating with a boron content of 4.38 at.%.
A L9 (34) experimental design has used to establish the influence of the TMAB concentration, and the pulse plating parameters (duty cycle as well as frequency) on coatings characteristics such as boron content, hardness, corrosion current density, wear loss and the average friction coefficient of PC-Ni-B alloy coatings. A significant reduction in cracks caused by the hydrogen absorption of electroplated coatings could be obtained when pulse current was used, compared to the use of direct current at the same average current density of 5 A/dm2. The optimal plating parameters found in this work are TMAB concentration of 0.08 M, duty cycle of 0.2, and pulse frequency of 100 Hz. Under these conditions, the hardness of the PC-Ni-B alloy coating is 1035 Hv, the average coefficient of friction is 0.396, the wear loss is 0.11 mg, and the corrosion current density (Icorr) is about 1.21 × 10-7 A/cm2. The PC-Ni-B alloy coating has corrosion resistance similar to the DC-Ni-B alloy coating, but utilization of pulse current was found to considerably increase the wear resistance of coating relative to that produced under direct current condition.
The Ni-B/BN(h) composite coatings were successfully prepared by adding BN(h) hexahedral boron nitride solid self-lubricating micro-particles in the plating solution. It has been shown that electroplated Ni-B/BN(h) composite coating with 3.72 at.% boron presented a hardness of 935 Hv. Corrosion behavior and the average friction coefficient of the composite coating are affected by the amount of BN(h) particles incorporated into the Ni-B matrix. When the volume percentage of BN(h) is 9.1 Vol.%, a minimum average coefficient of friction of 0.383 is obtained, which is 26.2 % lower than that of DC-Ni-B coating. When the volume percentage of BN(h) is 0.8 Vol.%, a minimum corrosion current density of 6.37 × 10-8 A/cm2 is obtained, which is nearly one order of magnitude smaller than that of BN(h)-free coatings.

目錄

誌謝 ii
摘要 iii
ABSTRACT iv
目錄 vi
表目錄 x
圖目錄 xi
符號說明 xxiii
1. 緒論 1
1.1 研究背景 1
1.2 研究動機與目的 2
1.3 文獻回顧 5
1.3.1 化學鍍沉積Ni-B合金鍍層 5
1.3.2 電鍍沉積Ni-B合金鍍層 10
1.3.3 脈衝電沉積鎳基合金鍍層 11
1.3.4 固體潤滑微粒Ni-B複合鍍層 14
2. 理論基礎 16
2.1 直流電沉積原理與機制 16
2.2 複合電鍍共沉積機制 19
2.3 脈衝電沉積原理 27
2.4 磨潤基礎理論 29
2.5 腐蝕理論 32
2.5.1 腐蝕形態 32
2.5.2 腐蝕電化學影響 34
2.5.3 腐蝕極化 35
2.6 田口品質設計 37
2.6.1 參數設定 38
2.6.1.1 直交表 38
2.6.1.2 參數分類 39
2.6.2 品質損失函數 41
2.6.3 信號雜訊比（S/N比） 43
3. 實驗方法與步驟流程 46
3.1. 電沉積Ni-B鍍層製備及流程 46
3.1.1 電沉積製程相關設備 46
3.1.2 鍍浴使用藥品及原料 47
3.1.3 電沉積施鍍流程 47
3.1.3.1 藥品配置及基材前處理 47
3.1.3.2 電沉積操作步驟 50
3.1.3.3 熱處理 51
3.2 檢測儀器與鍍層分析 52
3.2.1 微觀結構觀察(SEM) 54
3.2.2 鍍層成份與結構分析(EPMA、XRD、FIB、TEM) 56
3.2.3 表面粗糙度(Surface Roughnes) 59
3.2.5 耐腐蝕性質檢測(Potentiodynamic Polarization & Salt Spray) 60
3.2.6 硬度檢測(Hv) 61
3.2.7 磨耗實驗(Wear) 63
4. 結果與討論 65
4.1 電沉積Ni-B合金鍍層製備研析 65
4.1.1 直流Ni-B合金鍍層-實驗設計 65
4.1.2 直流Ni-B合金鍍層-性質影響 67
4.1.3 直流Ni-B合金鍍層-微結構 77
4.1.4 直流Ni-B合金鍍層-耐腐蝕特性 81
4.1.4.1 耐蝕蝕性-線性極化分析 81
4.1.4.2 耐蝕蝕性-鹽霧加速腐蝕實驗 86
4.1.5 直流Ni-B合金鍍層-機械性能 90
4.1.5.1 機械性能-硬度 90
4.1.5.2 機械性能-磨耗 91
4.1.7 直流Ni-B合金鍍層-綜合討論 95
4.1.8 小結 98
4.2 脈衝電沉積Ni-B合金鍍層製備研析 99
4.2.1 脈衝電沉積Ni-B合金鍍層-實驗設計 99
4.2.2 脈衝鍍層-田口直交表S/N比分析 102
4.2.2.1 硼含量與S/N比較 102
4.2.2.2 表面粗糙度與S/N比較 102
4.2.2.3 硬度與S/N比較 103
4.2.3 脈衝參數對鍍層表面形貌的影響 104
4.2.4 脈衝參數對鍍層硼含量的影響 107
4.2.5 脈衝參數對鍍層表面粗糙度影響 115
4.2.6 脈衝鍍層微結構 123
4.2.7 脈衝鍍層對硬度影響 126
4.2.8 脈衝鍍層抗腐蝕性能 135
4.2.9 脈衝鍍層耐磨耗性能 138
4.2.10 小結 144
4.3 電沉積Ni-B/BN(h)複合鍍層製備研析 145
4.3.1 Ni-B/BN(h)複合鍍層-實驗設計 145
4.3.2 田口直交表S/N比分析 148
4.3.2.1 複合鍍層硼含量與S/N比影響 148
4.3.2.2 複合鍍層表面粗糙度與S/N比影響 148
4.3.2.3 複合鍍層硬度與S/N比影響 149
4.3.2.4 複合鍍層BN(h)微粒含量體積百分率與S/N比影響 150
4.3.3 複合鍍層之性質影響 151
4.3.4 複合鍍層之硼含量影響 163
4.3.5 複合鍍層成表面粗糙度影響 170
4.3.6 複合鍍層BN(h)含量體積百分率影響 177
4.3.7 複合鍍層對微結構影響 185
4.3.8 複合鍍層之硬度影響 191
4.3.9 複合鍍層抗腐蝕性能 199
4.3.10 複合鍍層耐磨耗性能 203
4.3.11 小結 208
5. 結論 211
6. 未來展望與應用 214
參考文獻 219
論文發表 236
自傳 239

[1]林樹強、陳文哲、葉宏謨，工作研究：工業4.0 (6版)，鼎茂圖書出版社，第1-8頁，2017。
[2]https://www.ipcc.ch/ 政府間氣候變化專門委員會, 2017.
[3]Arthur, G., Birch, D. J., Michie, G. M., Moorhouse, P.T., Wells, C., and Bell, T., “Wear Resistant Surfaces in Engineering,” HMSO publications book, Chapter 6-7, pp. 81-109, 1985.
[4]Thiemig, D. and Bund, A., “Characterization of Electrodeposited Ni–TiO2 Nano Composite Coatings,” Surf Coat Technol, Vol. 202, pp. 2976-2984, 2008.
[5]Liu, Z. and Gao, W., “Electroless Nickel Plating on AZ91 Mg Alloy Aubstrate,” Surface and Coatings Technology, Vol. 200, pp. 5087-5093, 2006.
[6]Liu, Z. and Gao, W., “A Novel Process of Electroless Ni-P Plating With Plasmaelectrolytic Oxidation Pretreatment,” Applied Surface Science, Vol. 253, pp. 2988-2991, 2006.
[7]Liu, Z. and Gao, W., “The Effect of Substrate on the Electroless Nickel Plating of Mg and Mg Alloys,” Surface and Coatings Technology, Vol. 200, pp. 3553-3560, 2006.
[8]Sankara-Narayanan, T. S. N. and Seshadri, S. K., “Formation and Characterization of Borohydride Reduced Electroless Nickel Deposits,” Journal of Alloy and Compounds, Vol. 365, pp. 197-205, 2004.
[9]Campillo, B., Sebastian, P. J., Gamboa, S. A., Albarran, J. L., and Caballero, L. X., “Electrodeposited Ni-Co-B Alloy: Application in Water Electrolysis,“ Materials Science and Engineering: C, Vol. 19, pp. 115-118, 2002.
[10]Chen, W., Gao, W., and He. Y., “A Novel Electroless Plating of Ni–P–TiO2 Nano-Compositecoatings,” Surface and Coatings Technology, Vol. 204, pp. 2493-2498, 2010.
[11]Chen, W., He, Y., and Gao, W., “Electrodeposition of Sol-Enhanced Nanostructured Ni-TiO2 Composite Coatings,” Surface and Coatings Technology, Vol. 204, pp. 2487-2492. 2010.
[12]Krishnaveni, K., Sankara-Narayanan, T. S. N., and Seshadri, S. K., “Electrodeposited Ni–B Coatings: Formation and Evaluation of Hardness and Wear Resistance,” Materials Chemistry and Physics, Vol. 99, pp. 300-308, 2006.
[13]Delaunois, F., Petitjean, J. P., Lienard, P., and Jacob-Duliere, M., “Autocatalytic Electroless Nickel-Boron Plating on Light Alloys,“ Surface and Coatings Technology, Vol. 124, pp. 201-209, 2000.
[14]Delaunois, F. and Lienard, P., “Heat Treatments for Electroless Nickel–Boron Plating on Aluminium Alloys,” Surface and Coatings Technology, Vol. 160, pp. 239-248, 2002.
[15]El-Sharf, M., Mcdougall, J., and Chisholim, C. U., “Electrodeposition of Thick Chromium Coat-ings from an Environmentally Acceptable Chromium (Ⅲ) Glycine Complex,” Transactions of the Institute of Metal Finishing, Vol. 77, pp.139-144, 1999.
[16]賈金平、謝少艾、陳虹錦等，電鍍廢水處理技術及工程實例，北京化學工業出版社，第23頁，2003。
[17]Changgeng, X., Xinmin, H., Zonggang, D., and Yanwen, W., “Properties of Electroless Ni-P and Ni-P-SiC," Plating and Surface Finishing,” Vol. 76, pp. 90-93, 1989.
[18]Lima-Neto. P. d., Silva, G. P. d., and Correia, A. N., “A Comparative Study of the Physicochemical and Electrochemical Properties of Cr and Ni–W–P Amorphous Electrocoatings,” Electrochimica Acta, Vol. 51, pp. 4928-4933, 2006.
[19]Lima-Neto, P. d., Correia, A. N., Vaz, G. L., and Casciano, P. N. S., “ Morphological, Structural, Microhardness and Corrosion Characterisations of Electrodeposited Ni-Mo and Cr Coatings,” Journal of the Brazilian Chemical Society, Vol. 21, pp. 1968-1976, 2010.
[20]Sharma, Y. C., “Cr(VI) Removal from Industrial Effluents by Adsorption on An indigenous Low-Cost Material,” Colloids and Surfaces A: Physicochem Engineering Aspects, Vol. 215, pp. 155-162, 2003.
[21]Hena, S., “Removal of Chromium Hexavalent Ion from Aqueous Solutions using Biopolymer Chitosan Coated with Poly 3-Methyl Thiophene Polymer,” Journal of Hazardous Materials, Vol. 181, pp. 474-427, 2010.
[22]Gardea-Torresdey, J. L., Tiemann, K. J., Armendariz, V., Bess-Oberto, L., Chianelli, R. R., Rios, J., Parsons, J. G., and Gamez, G., “Characterization of Cr(VI) Binding and Reduction to Cr(III) by the Agricultural Byproducts of Avena Monida (Oat) Biomass,” Journal of Hazardous Materials, Vol. 80, pp. 175-188, 2000.
[23]Hou, K. H., Jeng, M. C., and Ger, M. D., “A Study on the Wear Resistance Characteristics of Pulse Electroforming Ni–P alloy Coatings as Plated,” Wear, Vol. 262, pp. 833-844, 2007.
[24]Tsai, W. T. and Chung, S. T., “Electrodeposition of High Phosphorus Ni–P Alloys in Emulsified Supercritical CO2 Baths,” The Journal of Supercritical Fluids, Vol. 95, pp. 292-297, 2014.
[25]Huang, P. C., Hou, K. H., Wang, G. L., Chen, M. L., and Wang, J. R., “Corrosion Resistance of the Ni-Mo Alloy Coatings Related to Coating's Electroplating Parameters,” International Journal of Electrochemical Science, Vol. 10, pp. 4972-4984, 2015.
[26]Houa, K. H., Wang, H. T., Sheuc, H. H., and Gerca, M. D., “Preparation and Wear Resistance of Electrodeposited Ni–W/Diamond Composite Coatings,” Applied Surface Science, Vol. 308, pp. 372-379, 2014.
[27]Torabinejad, V., Sabour Rouhaghdam, A., Aliofkhazraei, M., and Allahyarzadeh, M. H., “Electrodeposition of Ni–Fe and Ni–Fe-(Nano Al2O3) Multilayer Coatings,” Journal of Alloys and Compounds, Vol. 657, pp. 526-536, 2016.
[28]Srivastava, M., William Grips, V. K., and Rajam, K. S., “Electrochemical Deposition and Tribological Behaviour of Ni and Ni–Co Metal Matrix Composites with SiC Nano-Particles,” Applied Surface Science, Vol. 253, pp. 3814-3824, 2007.
[29]Peeters, P., Hoorn, G. v. d., Daenen, T., Kurowski, A., and Staikov, G., “Properties of Electroless and Electroplated Ni–P and its Application in Microgalvanics,” Electrochimica Acta, Vol. 47, pp. 161-169, 2001.
[30]Liu, Z. and Gao, W., “A Novel Process of Electroless Ni-P Plating with Plasma Electrolytic Oxidation Pretreatment,” Applied Surface Science, Vol. 253, pp. 2988-2991, 2006.
[31]Sankara Narayanan, T. S. N. and Seshadri, S. K., “Formation and Characterization of Borohydride Reduced Electroless Nickel Deposits,” Journal of Alloys and Compounds, Vol. 365, pp. 197-205, 2004.
[32]Campillo, B., Sebastian, P. J., Gamboa, S. A., Albarran, J. L., and Caballero, L. X., “Electrodeposited Ni–Co–B Alloy: Application in Water Electrolysis ,” Materials Science and Engineering, Vol. 19, pp. 115-118, 2002.
[33]Delaunois, F., Petitjean, J. P., Lienard, P., and Jacob-Duliere M., “Autocatalytic Electroless Nickel-Boron Plating on Light Alloys,” Surface and Coatings Technology, Vol. 124, pp. 201-209, 2000.
[34]Delaunois, F. and Lienard, P., “Heat Treatments for Electroless Nickel–Boron Plating on Aluminium Alloys,” Surface and Coatings Technology., Vol. 160, pp. 239-248, 2002.
[35]Krishnaveni, K., Sankara Narayanan, T. S. N., and Seshadri, S. K., “Electrodeposited Ni–B Coatings: Formation and Evaluation of Hardness and Wear Resistance,” Materials Chemistry and Physics, Vol. 99, pp. 300-308, 2006.
[36]Abdel Hamid, Z., Hassan, H. B., and Attyia, A. M., “Influence of Deposition Temperature and Heat Treatment on the Performance of Electroless Ni–B Films,” Surface & Coatings Technology, Vol. 205, pp. 2348-2354, 2010.
[37]Vitry, V., Sens, A., Kanta, A. F., and Delaunois, F., “Experimental Study on the Formation and Growth of Electroless Nickel–Boron Coatings from Borohydride-Reduced bath on Mild Steel,” Applied Surface Science, Vol. 263, pp. 640-647, 2012.
[38]Giampaolo, A. R., Ordofiez, J. G., Gugliemacci, J. M., and Lira, J., “Electroless Nickel-Boron Coatings on Metal Carbides,” Surface and Coatings Technology., Vol. 89, pp. 127-131, 1997.
[39]Anik, M., Körpe, E., and Şen, E., “Effect of Coating bath Composition on the Properties of Electroless Nickel–Boron Films,” Surface & Coatings Technology., Vol. 202, pp. 1717-1727, 2008.
[40]Oraon, B., Majumdar, G., and Ghosh, B., “ Improving Hardness of Electroless Ni–B Coatings using Optimized Deposition Conditions and Annealing,” Materials and Design, Vol. 29, pp. 1412-1418, 2008.
[41]Liang, Y., Li, Y. S., Yu, Q. Y., Zhang, Y. X., Zhao, W. J., and Zeng, Z. X., “Structure and Wear Resistance of High Hardness Ni-B Coatings as Alternative for Cr Coatings,” Surface & Coatings Technology, Vol. 264 pp. 80, 2015.
[42]Ogihara, H., Udagawa, K., and Saji, T., “Effect of Boron Content and Crystalline Structure on Hardness in Electrodeposited Ni–B Alloy Films,” Surface & Coatings Technology, Vol. 206, pp. 2933-2940, 2012.
[43]Delaunois, F., Petitjean J. P., Lienard P., and Duliere M. J., “Autocatalytic Electroless Nickel-Boron Plating on Light Alloys,” Surface and Coatings Technology, Vol. 124, pp. 201-209, 2000.
[44]Vitry, V., Kanta, AF., Dille, J., and Delaunois, F., “Structural State of Electroless Nickel–Boron Deposits (5 wt.% B): Characterization by XRD and TEM,” Surface and Coatings Technology, Vol. 206, pp. 3444-3449, 2012.
[45]Das, S. K. and Sahoo. P., “Influence of Process Parameters on Microhardness of Electroless Ni–B Coatings,” Advances in Mechanical Engineering, pp. 11, 2012
[46]Dervos, CT., Novakovic, J., and Vassiliou, P., “Vacuum Heat Treatment of Electroless Ni–B Coatings,” Materials Letters, Vol. 58, pp. 619-623, 2004.
[47]Abdel Hamid, Z., Hassan, H. B., and Attyia, A. M., “Influence of Deposition Temperature and Heat Treatment on the Performance of Electroless Ni–B Films,” Surface and Coatings Technology, Vol. 205, pp. 2348-2354, 2010.
[48]Vitry, V., Sens, A., Kanta, A. F., and Delaunois, F., “Experimental Study on the Formation and Growth of Electroless Nickel–Boron Coatings from Borohydride-Reduced bath on Mild Steel,” Applied Surface Science, Vol. 263, pp. 640-647, 2012.
[49]Sankara Narayanan, T. S. N., Krishnaveni, K., and Seshadri, S. K., “Electroless Ni–P/Ni–B Duplex Coatings: Preparation and Evaluation of Microhardness, Wear and Corrosion Resistance,” Materials Chemistry and Physics, Vol. 82, pp. 771-779, 2003.
[50]Baskaran, I., Kumar, R. S., Sankara Narayanan, T. S. N., and Stephen, A. “Formation of Electroless Ni–B Coatings using Low Temperature bath and Evaluation of their Characteristic Properties,” Surface and Coatings Technology, Vol. 200, pp. 6888-6894, 2006.
[51]Vitry, V., Kanta, A. F., and Delaunois, F., “Application of Nitriding to Electroless Nickel–Boron Coatings: Chemical and Structural Effects; Mechanical Characterization; Corrosion Resistance,” Materials & Design, Vol. 39, pp. 269-278, 2012.
[52]Gorbunova, K. M., Ivanov, M. V., and Moiseev, V. P., “Electroless Deposition of Nickel–Boron Alloys Mechanism of Process, Structure, and Some Properties of Deposits,” Journal of The Electrochemical Society, Vol. 120, pp. 613-618, 1973.
[53]Venkatakrishna, P. G., Mohamed Narayanan, S. S., and Sankara Narayanan, T. S. N., “Electroless Ni–B–P Ternary Alloy Coatings: Preparation and Evaluation of Characteristic Properties,” European Journal of Scientific Research, Vol. 82, pp. 506-514, 2012.
[54]Machine Design, September 5, 2002.
[55]Jones Plating Company, http://www.kcjplating.com/nickel-boron-plating.
[56]Henry, J., “Electroless Plating-Part II-Nickel,” Metal Finishing, Vol. 82, pp. 45, 1984.
[57]神戶德藏，“無電解鍍金”，復漢出版社，第58-60頁，1984。
[58]王興運、楊聰仁，“低碳鋼無電鍍鎳硼之研究”，碩士論文，逢甲大學，台中，第78-83頁1987。
[59]羅一玲、黃秉照，“鎳硼化學鍍反應行為及鍍浴穩定性之研究”，碩士論文，國立台灣工業技術研究院，第33頁，台北，1992。
[60]林政良、吳信田，“鎳硼鍍膜之研究”，碩士論文，國立清華大學，新竹，第55-60頁，1995。
[61]Vitry, V., Kanta, AF., Dille, J., and Delaunois, F., “Structural State of Electroless Nickel–Boron Deposits (5 wt.% B): Characterization by XRD and TEM,” Surface and Coatings Technology, Vol. 206, pp. 3444-3449, 2012.
[62]Hitoshi, O., Takafumi, K., and Tetsuo, S., “Electroless Deposited Robust Ni–B Films Coated with Trimethylsiloxysilicate Exhibit Superhydrophobicity,” Journal of Materials Chemistry, Vol. 21, pp. 14890-14896, 2011.
[63]Hassan, H. B. and Abdel Hamid, Z., “Electroless NieB supported on carbon for direct alcohol fuel cell applications,” International Journal of Hydrogen Energy, Vol. 36, pp. 849-856, 2011.
[64]Wang, H. Yu., Chung, S. T., Chuang, Y. C., and Tsai, W. T., “Electroless Ni–B Deposition from an Emulsified Supercritical Carbon Dioxide bath,” Thin Solid Films, Vol. 518, pp. 7505-7508, 2010.
[65]Vitry, V., Kanta, A. F., and Delaunois, F., “Initiation and Formation of Electroless Nickel–Boron Coatings on Mild Steel: Effect of Substrate Roughness,” Materials Science and Engineering, Vol. 175, pp. 266-273, 2010.
[66]Mustafa, A, Körpe, E., and Şen, E., “Effect of Coating bath Composition on the Properties of Electroless Nickel-Boron Films,” Surface & Coatings Technology, Vol. 202, pp. 1718-1727, 2008.
[67]Das, S. K. and Sahoo. P., “A Parametric Investigation of the Friction Performance of Electroless Ni-B Coatings,” Lubrication Science, Vol. 23, pp. 81-97, 2011.
[68]Vitry, V., Kanta, A. F., and Delaunois, F., “Mechanical and Wear Characterization of Electroless Nickel-Boron Coatings,” Surface & Coatings Technology, Vol. 206, pp. 1879-1885, 2011.
[69]Abdel Hamid, Z., Hassan, H. B., and Attyia, A. M., “Influence of Deposition Temperature and Heat Treatment on the Performance of Electroless Ni–B Films,” Surface & Coatings Technology, Vol. 205, pp. 2348-2354, 2010.
[70]Kantaa, A. F., Poelmanb, M., Vitry, V., and Delaunois, F., “Nickel–Boron Electrochemical Properties Investigations,” Journal of Alloys and Compounds, Vol. 505, pp. 151-156, 2010.
[71]Krishnaveni, K., Sankara Narayanan, T. S. N., and Seshadri, S. K., “Electroless Ni–B Coatings: Preparation and Evaluation of Hardness and Wear Resistance,” Surface & Coatings Technology, Vol. 190, pp. 115-121, 2005.
[72]Correa, E., Zuleta, A. A., Guerra, L., Gómez, M. A., Castaño, J. G., Echeverría, F., Liu, H., Skeldon, P., and Thompson, G. E., “Tribological Behavior of Electroless Ni–B Coatings on Magnesium and AZ91D Alloy,” Wear, Vol. 305, pp. 115-123, 2013.
[73]Correa, E., Zuleta, A. A., Sepúlveda, M., Guerra, L., Castaño, J. G., Echeverría, F., Liu, H., Skeldon, P., and Thompson, G. E., “Nickel–Boron Plating on Magnesium and AZ91D Alloy by a Chromium-Free Electroless Process,” Surface & Coatings Technology, Vol. 206, pp. 3088-3093, 2012.
[74]Wang, Z.C., Jia, F., Yu, L., Qi, Z. B., Tang, Y., and Song, G. L., “Direct Electroless Nickel–Boron Plating on AZ91D Magnesium Alloy,” Surface & Coatings Technology, Vol. 206, pp. 3676-3685, 2012.
[75]Petro, R. and Schlesinger, M., “Direct Electroless Deposition of Nickel Boron Alloys and Copper on Aluminum Containing Magnesium Alloys,” Electrochemical and Solid-State Letters, Vol. 14, pp. 37-40, 2011.
[76]Fan, N., Huang, M., and Wang, L., “International Conference on Electronic Packaging Technology & High Density Packaging,” pp. 288-292, 2011.
[77]Zhang, W. and He, C., “Electroless Ni-W-P/Ni-B duplex coatings on AZ91D magnesium alloy,” Mechanic Automation and Control Engineering, IEEE, pp. 3895-3899, 2010.
[78]Zhang, W.X., Jiang, Z. H., Li, G. Y., Jiang, Q., and Lian, J. S., “Electroless Ni-P/Ni-B Duplex Coatings for Improving the Hardness and the Corrosion Resistance of AZ91D Magnesium Alloy,” Applied Surface Science, Vol. 254, pp. 4949-4955, 2008.
[79]Mao, W., He, X. B., Ren, S. B., Qin, M. L., and Qu, X. H., “Microstructure Evolution of Sn-2.5Ag-2.0Ni Solder Joint with Various Ni Platings on SiCp/Al Composites,” Materials Science Forum, Vol. 638-642, PP. 3811-3818, 2010.
[80]Onoda, M., Tsuchiya, T., Ogawa, K., and Watanabe, T., “Preparation of Amorphous Ni–B Alloy Films by Electroplating,” Journal of The Surface Finishing Society of Japan, Vol. 41, pp. 388-391, 1990.
[81]Ogihara, H., Udagawa, K., and Saji, T., “Effect of Boron Content and Crystalline Structure on Hardness in Electrodeposited Ni–B alloy Films,” Surface & Coatings Technology, Vol. 206, pp. 2933-2940, 2012.
[82]Krishnaveni, K., Sankara Narayanan, T. S. N., and Seshadri, S. K., “Electrodeposited Ni–B Coatings: Formation and Evaluation of Hardness and Wear Resistance,” Materials Chemistry and Physics, Vol. 99, pp. 300-308, 2006.
[83]Shakoor, R. A., Kahraman, R., Waware, U., Wang, Y., and Gao, W., “Properties of Electrodeposited Ni-B-Al2O3 Composite Coatings,” Materials and Design, Vol. 64, pp. 127-135, 2014.
[84]Ogihara, H., Wang, H., and Saji, T., “Electrodeposition of Ni–B/SiC Composite Films with High Hardness and Wear Resistance,” Applied Surface Science, Vol. 296, pp. 108-113, 2014.
[85]Wang, Yuxin., Wang, S. J., Shu, X, Gao, W., Lu, W., and Yan, B., “Preparation and Property of Sol-Enhanced Ni-B-TiO2 Nano-Composite Coatings,” Journal of Alloys and Compounds, Vol. 617, pp.472-478, 2014.
[86]Ogihara, H., Safuan, M., and Saji, T., “Effect of Electrodeposition Conditions on Hardness of Ni-B/Diamond Composite Films,” Surface & Coatings Technology, Vol. 212, pp. 180-184, 2012.
[87]Bekish, Y. N., Poznyak, S. K., Tsybulskaya, L. S., and Gaevskaya, T. V., “Electrodeposited Ni–B Alloy Coatings: Structure, Corrosion Resistance and Mechanical Properties,” Electrochimica Acta, Vol. 55, pp. 2223-2231, 2010.
[88]Krishnaveni, K., Sankara Narayanan, T. S. N., and Seshadri, S. K., “Electrodeposited Ni-B-Si3N4 Composite Coating: Preparation and Evaluation of its Characteristic Properties,” Journal of Alloys and Compounds, Vol. 466, pp. 412-420, 2008.
[89]Contreras, A., Leo´n, C., Jimenez, O., Sosa, E., and Pe´rez, R., “Electrochemical Behavior and Microstructural Characterization of 1026 Ni–B Coated Steel,” Applied Surface Science, Vol. 253, pp. 592-599, 2006.
[90]Fellner, P. and Cong, P. K., “Ni-B and Ni-Si Composite Electrolytic Coatings,” ASurface and Coatings Technology, Vol. 82, pp. 317-319, 1996.
[91]Weil, R., “Origins of Stress in Electrodeposits-1,” Plating, Vol. 57, pp. 1231-1237, 1970.
[92]Puippe, J. Cl. and Ibl, N., “Influence of Charge and Discharge of Electric Double Layer in Pulse Plating,” Journal of Applied Electrochemistry, Vol. 10, pp. 775-784, 1980.
[93]Holmbom, L. G., “Effects of Bath Temperature and Pulse-Plating Frequency on Growth Morphology of High-Purity Gold,” Plating and Surface Finishing, Vol. 74, pp. 74-79, 1987.
[94]Chin, D. T., “Mass Transfer and Current-Potential Relation in Pulse Electrolysis,” Journal of the Electrochemical Society, Vol. 130, pp. 1657-1667, 1983.
[95]Chene, O. and Landolt, D., “The Influence of Mass Transport on the Deposit Morphology and the Current Efficiency in Pulse Plating of Copper,” Journal of Applied Electrochemistry, Vol. 19, pp. 188-194, 1989.
[96]Puippe, J. C. and Leaman, F., “Theory and Practice of Pulse Plating, American Electroplaters and Surface Fnishers Society,” New York, pp. 17-40, 1986.
[97]Li, Z., Wang, J., Lu, J., and Meng, J., “Tribological Characteristics of Electroless Ni–P–MoS2 Composite Coatings at Elevated Temperatures,” Applied Surface Science, Vol. 264, pp. 516-521, 2013.
[98]Sivandipoor, I. and Ashrafizadeh, F., “Synthesis and Tribological Behaviour of Electroless Ni-P-WS2 Composite Coatings,” Applied Surface Science, Vol. 263, pp. 314-319, 2012.
[99]León, O. A., Staia, M. H., and Hintermann, H. E., “Deposition of Ni–P–BN(h) Composite Autocatalytic Coatings,” Surface and Coatings Technology, Vol. 108-109, pp. 461-465, 1998.
[100]León, O. A., Staia, M. H., and Hintermann, H. E., “Wear Mechanism of Ni-P-BN(h) Composite Autocatalytic Coatings,” Surface and Coatings Technology, Vol. 200, pp. 1825-1829, 2005.
[101]尖端科技軍事雜誌, 381期, http://www.dtmdatabase.com/News.aspx?id=339, 2016.
[102]青年日報, 軍事版, http://news.gpwb.gov.tw/News/110188, 2016.
[103]高誠輝，“非晶態合金鍍及其鍍層性能”，科學出版社，北京，第39-47頁，2004。
[104]Dini, J. W., “Electrodeposition: The Materials Science of Coatings and Substrates,” Noyes Publications Park Ridge, NJ, 1993.
[105]侯光煦，“脈衝電流電鑄Ni-P鍍層之磨潤特性”，博士論文，國立中央大學，桃園，第80-95頁，2006.
[106]Low, C. T. J., Wills, R. G. A., and Walsh, F. C., “Electrodeposition of Composite Coatings Containing Nanoparticles in a Metal Deposit,” Surface and Coatings Technology, Vol. 201, pp. 371-383, 2006.
[107]Musiani, M., “Electrodeposition of Composites: An Expanding Subject in Electrochemical Materials Science,” Electrochimica Acta, Vol. 45, pp. 3397-3402, 2000.
[108]Hovestad, A. and Janssen, L. J. J., “Electrochemical Codeposition of Inert Particles in a Metallic Matrix,” Journal of Applied Electrochemistry, Vol. 25, pp. 519-527, 1995.
[109]Guglielmi, N., “Kinetics of the Deposition of Inert Particles from Electrolytic Baths,” Journal of the Electrochemical Society, Vol. 119, pp. 1009-1012, 1972.
[110]Zahavi, J. and Hazan, J., “Electrodeposited Nickel Composites Containing Diamond Particles,” Plating and Surface Finishing, Vol. 70, pp. 57-61, 1983.
[111]Celis, J. P., Roos, J. R., and Buelens, C., “A Mathematical Model for the Electrolytic Codeposition of Particles with a Metallic Matrix,” Journal of the Electrochemical Society, Vol. 134, pp. 1402-1408, 1987
[112]Celis, J. P., Roos, J. R., Buelens, C., and Fransaer, J., “Mechanism of Electrolytic Composite Plating: Survey and Trends,” Transactions of the Institute of Metal Finishing, Vol. 69, pp. 133-139, 1991.
[113]Hwang, B. J. and Hwang, C. S., “Mechanism of Codeposition of Silicon Carbide with Electrolytic Cobalt,” Journal of the Electrochemical Society, Vol. 140, pp. 979-984, 1993.
[114]Holmbom, G. and Jacobson, B. E., “Nucleation and Initial Growth of Pulse-Plated Gold on Crystalline and Amorphous Substrates,” Journal of the Electrochemical Society, Vol. 135, pp. 2720-2725, 1988.
[115]Puippe, J. C. and Ibl, N., “Influence of Charge and Discharge of Electric Double Layer in Pulse Plating,” Journal of Applied Electrochemistry, Vol. 10, pp. 775-784, 1980.
[116]Holmbom, L. G., “Effects of Bath Temperature and Pulse-Plating Frequency on Growth Morphology of High-Purity Gold,” Plating and Surface Finishing, Vol. 74, pp. 74-79, 1987.
[117]Roy, S. and Landolt, D., “Determination of the Practical Range of Parameters During Reverse-Pulse Current Plating,” Journal of Applied Electrochemistry, Vol. 27, pp. 299-307, 1997.
[118]Yin, K. M., “Duplex Diffusion Layer Model for Pulse with Reverse Plating,” Surface and Coatings Technology, Vol. 88, pp. 162-164, 1997. 159
[119]Mandich, N. V., “Pulse and Pulse-Reverse Electroplating,” Metal Finishing, Vol. 97, pp. 375-380, 1999.
[120]Chin, D. T., “Mass Transfer and Current-Potential Relation in Pulse Electrolysis,” Journal of the Electrochemical Society, Vol. 130, pp. 1657-1667, 1983.
[121]Chene, O. and Landolt, D., “Influence of Mass Transport on the Deposit Morphology and the Current Efficiency in Pulse Plating of Copper,” Journal of Applied Electrochemistry, Vol. 19, pp. 188-194, 1989.
[122]Stokes, J., “Theory and Application of the High Velocity Oxy-Fuel (HVOF) Thermal Spray Process,” Dublin City University, pp. 1-14, 2008.
[123]莊東漢，材料破損分析，五南圖書，第304-440頁，2007。
[124]林信全，“使用磁控濺鍍法製備燃料電池金屬雙極板鎳鋁鍍層之研究”，碩士論文，逢甲大學材料科學與工程學系研究所，台中，第30-35頁，2004。
[125]柯文賢、王朝正，腐蝕及其防制，全華圖書，第120-135頁，2014。
[126]Lee. S. J., Huang. C. H., and Chen. Y. P., “Investigation of PVD Coating on Corrosion Resistance of Metallic Bipolar Plates in PEM Fuel Cell,” Journal of Materials Processing Technology, Vol. 140, pp. 688-693, 2003.
[127]蘇朝墩，“品質工程”，中華民國品質學會，第20-32頁，2005。
[128]劉克祺，田口式品質工程與實驗設計，華太文化事業有限公司，第69-185頁，1994。
[129]張季娜，羅仕勇等編譯，田口式品質工程導論，中華民國品質管制學會，第45-50頁，1993。
[130]林秀雄，田口方法與品質工程，新知企業管理顧問有限公司，第6-8頁，1997。
[131]李輝煌，田口方法-品質設計的原理與實務，高利圖書有限公司，第51-52頁，2000。
[132]MADHAV S. PHADKE., 著黎正中編譯，穩健設計品質工程，台北圖書有限公司，第32-33頁，1993。
[133]陳建華，“塑膠模壓鑄用鋼之球擠光加工研究”，國立台灣科技大學機械工程學系碩士學位論文，第50-70頁，2001。
[134]Ogihara, H., Udagawa, K., and Saji, T., “Pulse and Pulse-Reverse Electroplating,” Surface & Coatings Technology, Vol. 206, pp. 2933-2940, 2012.
[135]Krishnaveni, K., Sankara Narayanan, T. S. N., and Seshadri, S. K., “Electrodeposited Ni–B coatings: Formation and Evaluation of Hardness and Wear Resistance,” Materials Chemistry and Physics., Vol. 99, pp. 300-308, 2006.
[136]ONODA, M., TSUCHIYA, T., OGAWA, K., and WATANABE, T., “Preparation of Amorphous Ni-B Alloy Films by Electroplating,”  Journal of The Surface Finishing Society of Japan., Vol. 4, pp. 388-308, 1990.
[137]Abdel-Karim, R., Halim, J., El-Raghy, S., Nabil, M., and Waheed, A., “Surface Morphology and Electrochemical Characterization of Electrodeposited Ni–Mo Nanocomposites as Cathodes for Hydrogen Evolution,” Journal of Alloys and Compounds, Vol. 530, pp. 85-90, 2012.
[138]Kang, S. Y. and Hwang, W. S., “Effect of Electrolysis Condition on Internal Stress and Hardness of Ni-W Electrodeposits,” Indian Journal of Science and Technology, Vol. 8. pp. 267, 2015.
[139]Saravanan, G. and Mohan, S., “Corrosion Behavior of Cr Electrodeposited from Cr(VI) and Cr(III)-baths Using Direct (DCD) and Pulse Electrodeposition (PED) Techniques,” Corrosion Science, Vol. 51, pp. 197-202, 2009.
[140]Taylor, A., “X-ray Metallography,” John Wiley and Sons, pp. 673, 1961.
[141]López, J. R., Méndez, P. F., Pérez-Bueno, J. J., Trejo, G., Stremsdoerfer, G., and Meas, Y., “The Effect of Boron Content, Crystal Structure, Crystal Size on the Hardness and the Corrosion Resistance of Electrodeposited Ni-B Coatings,” International Journal of Electrochemical Science, Vol. 11, pp. 4231-4244, 2016.
[142]Chang, C. R., Hou, K. H., Ger, M. D., and Wang, J. R., “Characteristics of Nickel Boron Coatings prepared by Direct Current Electrodeposition Technique,” International Journal of Electrochemical Science, Vol. 12, pp. 2055-2069, 2017.
[143]Bekish, Yu. N., Poznyak, S. K., Tsybulskaya, L. S., and Gaevskaya, T.V., “Electrodeposited Ni–B Alloy Coatings: Structure, Corrosion Resistance and Mechanical Properties,” Electrochimica Acta, Vol. 55, pp. 2223-2231, 2010.
[144]Lee, K. H., Chang, D., and Kwon, S. C., “Properties of electrodeposited nanocrystalline Ni–B alloy films,” Electrochimica Acta, Vol. 50, pp. 4538-4543, 2005.
[145]Archard, J., “Contact and Rubbing of Flat Surfaces,” Journal of applied physics, Vol. 24, pp. 981-988, 1953.
[146]Marlot, A., Kern, P., and Landolt, D., “Pulse Plating of Ni–Mo Alloys from Ni-rich Electrolytes,” Electrochimica Acta, Vol. 48, pp. 29-36, 2002.
[147]Moon, Y. S., Lee, J. H., Oh, T. S., and Byun, J. Y., “Fabrication of Diamond Dispersed Nickel Composite Coating by Electroplating Method to Enhance the Mechanical Property of Coating,” Key Engineering Materials, Vol. 345, pp. 1597-1600, 2007.
[148]劉國雄、鄭晃忠、李勝隆、林樹均、葉均蔚，工程材料科學，全華圖書公司，臺北，第411-413頁，2006。
[149]Sriraman, K. R., Ganesh Sundara Raman, S., and Seshadri, S. K., “CorrosionBehaviour of Electrodeposited Nanocrystalline Ni–W and Ni–Fe–W Alloys,”Materials Science and Engineering: A, Vol. 460-461, pp. 39-45, 2007.
[150]Ralston, K. D., Birbilis, N., and Davies, C. H. J., “Revealing the Relationship between Grain Size and Corrosion Rate of Metals,” Scripta Materialia, Vol. 63, pp. 1201-1204, 2010.
[151]Mazaheri, H. and Allahkaram, S. R., “Deposition, Characterization and Electrochemical Evaluation of Ni–P–Nano Diamond Composite Coatings,” Applied Surface Science, Vol. 258, pp. 4574-4580, 2012.
[152]Krishnavenia, M. K., Sankara Narayanana, T. S. N., and Seshadrib, S. K., “Corrosion Resistance of Electrodeposited Ni–B and Ni–B–Si3N4 Composite coatings,” Journal of Allloy and Compounds, Vol. 480, pp. 765-770, 2009.
[153]Huang, P. C., Hou, K. H., Wang, G. L., Chen, M. L., Wang., and J. R., “Corrosion Resistance of the Ni-Mo Alloy Coatings Related to Coating's Electroplating Parameters,” International Journal of Electrochemical Scienc, Vol. 10, pp. 4972-484, 2015.