臺灣博碩士論文加值系統

本研究分別對高功率LED路燈模組之LED光源模組與散熱模組進行熱分析，藉由CAE軟體模擬結果與實驗結果的比較，探討各模組之熱行為，並提出可具體改善溫度的方法。
軟體方面使用ANSYS 8.0有限元素分析套裝軟體，設定條件以恆定的發熱功率與自然對流下的熱邊界條件，分別對各模組進行溫度場模擬，藉由有限元素法求解各模組之溫度分佈、熱通量、熱率與熱梯度。
實驗方面在常溫常壓之自然對流條件下，操作各模組並待至溫度變化趨於穩定的狀態後，以一熱影像分析儀與紅外線測溫槍，分別對路燈散熱模組與LED光源模組進行溫度量測。
結果顯示，散熱模組模擬值約46.02 ℃、實驗值約45.5 ℃；LED光源模組模擬值約101.33 ℃、實驗值約100.7 ℃；將模擬結果與實驗結果相互比對後，其結果顯示光源模組之模擬誤差範圍約在2 %內，而散熱模組之模擬誤差範圍則約在3.5 %內。
本研究針對各模組之溫度模擬結果提出三種不同改善條件，將各種改善條件之模擬結果相互比較後，並提出較佳之改善條件；光源模組之鋁基板增厚1 mm可達到約3.45 %的溫度改善效率，而加裝銅散熱塊之散熱模組可達到約6.2 %的改善效率。

This study reports on thermal analysis of the LED module and the cooling module of the high power LED streetlight module, respectively. By the simulation results compared with the experimental results, the thermal behavior of each module is observed. According to the simulation temperature values of each module, we proposed that various ways decreased the temperature values of the modules.
In the study, we simulated temperature flied of each module by using ANSYS 8.0 software. By the boundary conditions of each module are defined that there are constant power and free convection. The analysis results of each module are solved by finite element method that there are temperature distribution, thermal flux, thermal gradient and heat flow.
For experiment, we are operating each module for a long time in normal ambient temperature and atmosphere. When the temperature of each module is steady state, we measured the temperature of each module by using the thermography and the infra-red thermometer.
The temperature results of each module shown, the results of the cooling module is made that the simulation value is 46.02 ℃ and the experimental value is 45.5 ℃. The results of the LED module is made that the simulation value is 101.33 ℃ and the experimental value is 100.7 ℃. After the simulation results are compared with the experimental results, The Error range of the LED module is within 2 % and the cooling module is within 3.5 %.
For simulation temperature values, we proposed three ways that the temperature of each module is decrease. The better way is proposed by comparing the three ways. The temperature decrease rate of the LED module is about 3.45 % by the thickness of aluminum substrate increased 1 mm. The rate of the cooling module is about 6.2 % by installing the copper heat slug.

目錄
摘要 ..................................................... I
Abstract ............................................... III
謝誌 ..................................................... V
目錄 ................................................... VII
表目錄 .................................................. XI
圖目錄 ................................................. XIV
第一章 緒論 ............................................... 1
1.1 前言 ............................................... 1
1.2 文獻回顧 ............................................ 3
1.3 研究動機 ............................................ 4
1.4 研究規劃 ............................................ 5
1.5 分析樣品之規格 ...................................... 6
1.6 問題定義 ........................................... 10
1.7 分析目標之定義 ..................................... 11
1.8 論文架構 ........................................... 12
第二章 有限元素分析 ....................................... 13
2.1 CAE模型之建構 ...................................... 13
2.2 元素類型之定義 ..................................... 16
2.3 材料性質之定義 ..................................... 16
2.4 邊界條件之定義 ..................................... 17
2.5 理念有限元素模型之建構 .............................. 19
2.6 模擬&計算 .......................................... 21
2.6.1 穩態溫度場之模擬 ............................... 21
2.6.2 暫態溫度場之模擬 ................................ 22
2.7 溫度場模擬結果 ..................................... 24
2.7.1 LED光源模組之穩態溫度場模擬 ...................... 24
2.7.2 LED光源模組之暫態溫度場模擬 ...................... 27
2.7.3 路燈散熱模組之穩態溫度場模擬 ..................... 28
2.7.4 路燈散熱模組之暫態溫度場模擬 ..................... 31
第三章 實驗量測 ........................................... 33
3.1 實驗環境之設計 ..................................... 33
3.2 實驗設備 ........................................... 33
3.3 實驗量測 ........................................... 36
3.3.1 路燈散熱模組之實驗量測 .......................... 36
3.3.2 LED光源模組之實驗量測 ........................... 37
3.4 實驗量測結果 ....................................... 38
3.4.1 路燈散熱模組之測溫結果 .......................... 38
3.4.2 LED光源模組之測溫結果 ........................... 39
3.5 模擬與實驗之誤差比對 ................................ 39
第四章 產品改良之溫度模擬 .................................. 41
4.1 變更LED光源模組之基板材質 ........................... 41
4.2 變更LED光源模組之基板厚度 ........................... 43
4.3 變更路燈散熱模組之整體材質 ........................... 46
4.4 變更路燈散熱模組之鰭片尺寸 ........................... 48
4.5 路燈散熱模組加裝銅材散熱塊 ........................... 50
4.6 路善效率之分析 ..................................... 53
第五章 結果與討論 ......................................... 55
5.1 模擬與實驗之誤差比對 ................................ 55
5.2 改善效率之分析 ..................................... 56
第六章 結論 .............................................. 58
參考文獻 ................................................. 60
附錄1 ................................................... 63
附錄1.1 高功率LED路燈模組之穩態熱模擬 .................... 63
附錄1.2 高功率LED路燈改良模組之穩態熱模擬 ................. 64
附錄1.3 無鰭片之路燈散熱模組之穩態熱模擬 .................. 66
附錄2 ................................................... 67
作者簡介 ................................................. 68

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