臺灣博碩士論文加值系統

本文之主要目的在建立一IC構裝設備之整個生產流程之最佳化分析，文中吾人以生產線平衡(Line Balancing)的觀念為基礎，主要是以閒置時間百分比公式為基本公式，然後搭配時間公差(Time Tolerance)的觀念後所推導出之新公式，並且應用於IC構裝製程上，然後藉由時間公差之演繹法則來決定選用之設備，並且將會探討時間公差對於生產線平衡問題之影響，設法降低其閒置時間以提高生產線之效率。
在本文中將以最佳化方法中之模擬退火演算法(Simulated Annealing)為求解工具，並利用其所求得之最佳解為挑選設備之依據，並將所選取設備之時間範圍代入時間公差演繹法中進行迭代，最後會得到一組最適合此一製程之設備組合，吾人可將其迭代過程視為時間公差調整之分析方法，並將此一時間公差法應用於IC構裝製程之分析以降低製程中之閒置時間，進而提高製程之生產效率。

The optimal analysis of the entire production flowchart of IC packaging equipment was established based on the concept of production line balancing. With the equation of down time percentage as the basic equation, a new equation is derived from the concept of time tolerance and applied in IC packaging manufacturing process. Then the algorithm of time tolerance is used to select the equipment. The effect of time tolerance on production line balancing is also discussed in an attempt to reduce the down time and improve the efficiency of production lines.
The simulated annealing method among the optimization methods is used as a solution tool. The optimal solution derived is used as the basis for selecting equipment. The time range of the selected equipment is then incorporated into the time tolerance algorithm for iteration to finally derive a set of equipment combination most suitable for the process. The iteration process can be considered as the analytical method of adjusting the time tolerance. This time tolerance method is applied in the analysis of IC packaging manufacturing process to reduce the down time during the process so as to improve the process production efficiency.

中文摘要 I
Abstract II
誌謝 III
目錄 IV
圖表索引 VI
1 第一章 緒論 1
1.1 研究背景 1
1.2 研究方法與動機 1
1.3 文獻回顧 2
1.4 論文架構 2
2 第二章 IC構裝製程 4
2.1 IC構裝製程介紹 4
2.1.1 晶片切割(Die Saw) 4
2.1.2 黏晶（Die Bond） 5
2.1.3 銲線( Wire Bond) 8
2.1.4 封膠（Mold） 10
2.1.5 剪切與成形(Trim/Form) 12
2.1.6 印字(Mark) 13
2.1.7 檢測(Inspection) 14
2.2 IC構裝之系統模組 15
2.2.1 模組化之概念 15
2.2.2 模組化之優點 15
2.2.3 模組化可能面對之問題 16
2.2.4 模組化之生產設備 16
2.3 小精靈半導體封裝設備(Smart Element System) 19
2.3.1 主控單元 19
2.3.2 料條供應單元 21
2.3.3 沖壓單元 24
3 第三章 生產線平衡及時間公差 27
3.1 生產線平衡介紹 27
3.2 時間公差(Time Tolerance) 30
3.3 最佳化方法 32
4 第四章 實例探討 40
4.1 剪切沖壓單元部份 40
4.2 成形分離系統 46
4.3 當系統之產能提高後該如何調整 56
5 第五章 結論與建議 67
5.1 結論 67
5.2 建議 67
6 參考文獻 68

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