臺灣博碩士論文加值系統

本研究主要探討Cu-Sn-Ti合金作為Ti-6Al-4V合金之硬銲填料的合金比例與製程參數。實驗使用四種不同Cu-Sn-Ti比例之合金對Ti-6Al-4V進行真空硬銲，硬銲程序為將Cu-Sn-Ti合金銲料置於Ti-6Al-4V平板上方，以30℃/min升溫速率加熱至600℃，持溫30分鐘後，繼續以30℃/min分別加熱至三種硬銲溫度：850℃、900℃以及950℃，經持溫30分鐘後，以爐冷方式(降溫速率4℃/min)冷卻至常溫。將所得之試片切取縱向截面以觀察其巨觀結構與潤濕性；並利用掃描式電子顯微鏡與電子微探束分析儀進行顯微結構觀察與成份分析；以X光繞射儀分析合金之組成相；熱掃描分析儀測量合金組成相的變態溫度，同時對銲料、界面層以及鈦合金進行微硬度測量。
　　 研究結果顯示：當硬銲溫度900℃時，Cu-10Sn-20Ti合金有最低的潤濕角，顯示在此溫度，Cu-10Sn-20Ti合金與Ti-6Al-4V合金有最佳的潤濕效果，同時微硬度值也是四種合金中最高者；四種合金銲料之組成相主要有五個，包括三個介金屬化合物：CuSn3Ti5、Cu2SnTi3與CuTi以及兩個固溶相：Cu-5Ti與Cu-9Sn等。在Cu-Sn-Ti銲料與Ti-6Al-4V合金之間的界面層中，所含有的組成相主要有介金屬化合物Ti3Sn與CuTi等，固溶體則有：Cu-Ti、Ti-V、Ti-Sn與Ti-Al等。

This study mainly develops the Cu-Sn-Ti alloys as filler metals to braze Ti-6Al-4V alloy. Four Cu-Sn-Ti alloys of different compositions were used to braze Ti-6Al-4V alloy in vacuum furnace. The brazing process was carried out to heat with a rate of 30℃/min from room temperature to 600℃ and held for 30 minutes, then keep heating to brazing temperature, and heat-treated at an isothermal holding temperature of either 850℃, 900℃, or 950℃, and held for 30 minutes. The specimens were subsequently furnace-cooled (cooling rate of 4℃/min) to room temperature. The specimens were split in longitudinal sections for observing the macrostructure as well as wettability. Microstructures of the specimens were examined by scanning electron microscope. Compositional analysis of the constituting phases in Cu-Sn-Ti alloys, and interface between filler metal and Ti-6Al-4V alloy was carried out using an electron probe micro-analyzer. X-ray diffraction was employed to detect the constituting phases of the Cu-Sn-Ti alloys. The phase transformation of the alloys was recorded by a differential scanning calorimeter. The hardness of specimens was measured by a micro-Vickers hardness tester.
The results revealed that the lowest wetting angel is approximately 16° between Cu-10Sn-20Ti and Ti-6Al-4V alloy after brazed at 900℃. The micro hardness of Cu-10Sn-20Ti is highest among these four Cu-Sn-Ti alloys. There were five constituting phases in the Cu-Sn-Ti alloy, witch included three intermetallic compounds: CuSn3Ti5, Cu2SnTi3, CuTi and two solid solutions: Cu-5Ti and Cu-9Sn. The major constituting phases of the interface included intermetallic compounds: Ti3Sn and CuTi, and solid solution Cu-Ti, Ti-V, Ti-Sn and Ti-Al etc.

誌謝..........................................................................................................i
中文摘要..................................................................................................ii
英文摘要..................................................................................................iii
目錄..........................................................................................................iv
表目錄.....................................................................................................vii
圖目錄.....................................................................................................viii

第一章 前言 1
第二章 文獻回顧 3
2.1鈦與鈦合金 3
2.1.1密度 4
2.1.2比強度與比剛性 4
2.1.3耐蝕性 4
2.1.4高溫特性 5
2.1.5疲勞強度 5
2.1.6破壞韌性與彈性模數 5

2.2鈦合金的接合方法 6
2.3硬銲作業 7
2.4鈦合金之硬銲接合 9
2.5銅錫鈦銲料 9
第三章 材料與實驗方法 21
3.1 實驗目的 21
3.2 實驗材料與設備 21
3.2.1 材料備製與表面處理 21
3.2.2 Cu-Sn-Ti銲料備製 22
3.2.3 壓錠 22
3.3 真空硬銲 22
3.4 試片製作 23
3.5 熱掃瞄分析 23
3.6 X-ray繞射分析 23
3.7 潤濕性觀察 23
3.8 顯微結構與成份分析 24
3.9 微硬度試驗 24
第四章 實驗結果與討論 33
4.1 熱掃描分析 33
4.2 巨觀結構與潤濕性分析 35
4.3 顯微結構與成份分析 36
4.3.1 硬銲合金之顯微組織與組成相分析 36
4.3.2 界面層之顯微組織與組成相分析 37
4.3.3 界面層厚度與原素分佈分析 38
4.4 硬銲合金之X-ray繞射分析 39
4.5 微硬度分析 40
第五章 結論 74
第六章 參考文獻 75
作者簡介 81
附錄 82

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